THERMINIC

International Workshop on
Thermal Investigations of ICs and Systems

 
 

Steering Committee:

M. Rencz, BME, HU
C. Bailey, U of Greenwich, UK
L. Codecasa, Politecnico di Milano, IT
J. Janssen, NXP, NL
W. Luiten, WLC, NL
G. Martin, Signify, NL
A. Napieralski, TU Lodz, PL
J. Parry, SIEMENS Digital Industry Software, UK
A. Poppe, BME, HU
D. Schweitzer, Infineon, DE
V. Tsoi, Huawei, SE
C. Villa, ST Microelectronics, IT
W. Wits, Thales, NL
B. Wunderle, TU Chemnitz / Fraunhofer ENAS, DE