| THERMINIC 1996September 25-27,
|
|
| THERMINIC 1996September 25-27,
|
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES
Sponsored by the IEEE Computer Society, Test Technology Technical Committee and The Hungarian National Committee for Technical Development (OMFB) in cooperation with the THERMINIC CP940922 Copernicus and the BARMINT 8173 ESPRIT Projects and with the European Test Technology Technical Committee.
The first THERMINIC Workshop was held in Grenoble in 1995, it
gathered together about 90 attendees from Europe, the USA and Japan. The second THERMINIC Workshop will be held in Budapest, September 25-27, 1996. THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics and microstructures. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of
integrated circuits necessitating thermal simulation, monitoring and cooling.
The main topics to be discussed during the Workshop are the following
The Programme Committee received over 60 submissions this year, much more than in 1995. 34 contributions have been accepted for oral presentation and 15 for poster presentation. Oral contributions consist of 15 min. presentations followed by 5 min. discussion. The posters will be introduced by one slide in 2 minutes each.
More information on the Workshop is available from :
AIM OF THE WORKSHOP
The high element density of MCMs and the mobile parts of microsystems raise newer and newer thermal problems to be solved in the near future. Thermal effects on the other hand can be used as bases of sensors or other functional structures.WORKSHOP COMMITTEE
Workshop Committee :
Programme Committee :
INFORMATION
TIMA |
TU Budapest |
The Workshop will be held at Hotel AGRO in Budapest. Hotel AGRO is located in the Buda Hills, in 15 to 20 minutes distance from the very center of the city. Hotel AGRO can be accessed by car or by public transport easily.
Budapest is the capital of Hungary. Budapest, often referred as the "Queen of the Danube" is a large cosmopolitan city with abundance of culture, history and entertainment to offer visitors. It boasts world-class opera, ballet, jazz night-clubs, musical theatre, numerous museums both large and small, multitude of hot springs that are the source of its famous baths, restaurants with Hungarian and international cuisine and much more.
Hotel AGRO, Budapest XII, Normafa street 54 H-1121 Hungary
Tel : +36-1-1754011 - Fax : +36-1-1756164
TU Budapest will provide a small LAN with Internet access
(e-mail, telnet) at the Workshop.
How to reach Budapest ? Budapest can be accessed by air, by rail and by car.
International Airport :
- Budapest-Ferihegy I (for most foreign flights)
- Budapest-Ferihegy II (for all MALEV, AIR FRANCE and LUFTHANSA flights).
MALEV in cooperation with Delta runs a daily link to the USA.
There is a cheap and reliable shuttle bus service between the city and the terminals, run by the airport authority.
Companies that would like to exhibit should contact the General Chair.
GRANTS FROM ONR EUROPE
The Office of Naval Research Europe offers a support to help participants from Central and Eastern Europe. Registration fees might be withdrawn and help in lodging might be provided. Central and Eastern Europe participants have to apply to B. COURTOIS or M. RENCZ.
Wednesday 25 September 1996 |
Thursday 26 September 1996 |
Friday 27 September 1996 | |||
| 14.00 |
Registration |
8.40 |
Invited Talk |
8.40 |
Invited talk |
| 15.00 |
Welcome Address |
9.20 |
Coffee |
9.20 |
Session4: Thermal problems in packaging
|
| 15.10 |
Opening Address |
9.40 |
Session2: Temperature sensors & monitoring |
11.00 |
Coffee |
| 15.20 |
Invited talk |
11.00 |
Coffee |
11.20 |
Session5: Thermal transient measurements
|
| 16.00 |
Coffee |
11.20 |
Poster session |
13.20 |
Lunch |
| 16.20 |
Session1: Thermal simulation |
12.40 |
Lunch |
15.00 |
Session6: Temperature mapping |
| 18.00 |
Social event |
14.20 |
Session3: Electro-thermal simulation |
16.20 |
Coffee |
| 16.40 |
Vendor presentations |
16.40 |
Session7: Thermal sensors and actuators | ||
| 18.00 |
Dinner |
20.00 |
Banquet | ||
| 20.00 |
Panel discussion |
B. Courtois general chair, TIMA, Grenoble, France
S. Bottka vice-president of OMFB, Budapest, Hungary
J.L. Blanchard
Zuken-Redac S.A., Les Ulis, France
Temperature of copper tracks in a substrate cooled by radiation
A.K. Stubos
NCSR Demokritos, Attikis, Greece
Enhanced chip cooling via boiling in porous layers
Y. Scudeller* , C. Valn
* Univ. of Nantes, France
n 3D+, France
Heat transfer analysis on tridimensional stacking of thin plastic packages
S.P. Kolev*, I. Bársony%, A. van der Bergn, C. Cobianul
* Univ. of Sofia, Bulgaria
% Res. Inst. of Materials Sci., Budapest, Hungary
n Univ. of Twente, Enschede, The Netherlands
l Inst. of Microelectronics, Bucharest, Romania
Mathematical modelling of porous silicon based pellistor-type catalytic flammable gas sensor
W. Kalita, J. Potencki
Techn. Univ. of Rzeszow, Poland
Thick-film distributed rc networks in synthesis of sensors and control systems
G.A. Frolov*, O.M. Grudin*, I.I. Katsann, B.I. Lupinan
* Sensor Systems Co., Kiev, The Ukraine
n Kiev Polytechnic Inst., Kiev, The Ukraine
Thermal gas density sensor
Y. Assouad, F. Gatfosse, T. Gautier
Thomson RCM, Elancourt, France
Transient characterization and modelling of ceramic packages
A. Kos
Univ. of Mining & Metallurgy, Krakow, Poland
Estimation of thermal dynamics of ICs
V. Jiménez, F. Masana, M. Domínguez, L. Castañer
Univ. Polit. de Catalunya, Barcelona, Spain
Electro-thermal simulation in hot-wire flow sensors
M. Orlikowski, M. Zubert, W. Wójciak, A. Napieralski
Techn. Univ. of Lódz, Poland
General approach to VHDL-A modelling of an integrated micropump
F. Migom, W. Temmerman, J. Peeters
Alcatel Telecom, Antwerp, Belgium
Thermal models for integrated resistor technology
F. Dhondt*, P.A. Rolland*, N. Haese*, S. Delagen, H. Blanckn, E. Chartiern
* IEMN, Villeneuve d'Ascq, France
n Thomson LCR, Orsay, France
Self-consistent electro-thermal modelling of multifingers HBTs for power application
M. Wiklund
Univ. of Lund, Sweden
Electro-thermal simulation of MOS transistor circuits with SPICE using portable subcircuits
W. Szczesniak
Tech. Univ. of Gdansk, Poland
Reduction of thermal interactions between chosen elements of electronic circuits
A. Soulos, D. de Cogan, K.O. Chichlowski
Univ. of East Anglia, Norwich, UK
Sub-surface feature location and identification using inverse TLM techniques