THERMINICBudapest, Hungary
25-27 September 2012

18th International Workshop on
Thermal investigations of ICs and Systems

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General Chair: Marta RENCZ , BME, Budapest, Hungary
Vice General Chair: Bernard COURTOIS, CMP, Grenoble, France
  • Sponsored by:
  • CMP
  • IEEE
  • CPMT

THERMINIC 2012

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. This year THERMINIC will address in addition to the “traditional” thermal management problems, also stress and thermal-stress-related-reliability issues, both in micro- and opto-electronics fields.

AREAS OF INTEREST

include, but are not limited to, the following topics:
  • Thermal and Temperature Sensors
  • Acquisition and analysis of Thermal data
  • Thermal Simulation
  • Temperature Mapping
  • Electro-thermal Simulation
  • Novel and Advanced Cooling Techniques
  • Thermal Modelling & Investigation of Packages
  • Thermal Performance of Interconnects
  • Reliability Issues
  • Heat Transfer Enhancement
  • High Temperature Electronics
  • Validation of Thermal Software
  • Heat Transfer Education
  • Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects
  • Flow Visualisation Techniques
  • Turbulence Modelling in Complex Geometrics
  • Thermal Stress: Theory and Experiment
  • Defect and failure modelling
  • Thermal Stress Failures: Prediction and Prevention
  • Reliability evolution and prediction
  • Multiphysics simulation
  • Nanotechnology Applications
  • Nanoengineering issues
  • Noise control
  • Education
  • 3DIC, power electronics.
  • Measurement of Thermal Properties
  • Commercial Sponsors:
  • Mentor Graphics