Aim

Paper Submission | half-day NANOPACK | Venue & Access | Workshop Committee | Contacts | Social event | Exhibition | Registration | Hotel accommodation | Technical program | Poster presentations | Invited speakers | Past events |

Invited speakers

• Thermal conductivity in nanostructures: the role of acoustic phonons

Clivia M. Sotomayor Torres, Catalan Institute of Nanotechnology, Bellaterra (Barcelona), Spain, Catalan Institute for Research and Advanced Studies ICREA, Barcelona, Spain
We review the current understanding of the acoustic phonon contribution to thermal transport in nanostructures from nanoparticles to thin films and membranes. Confinement and cavity effects will be discussed as well as electrical and optical measurement methods.

• CAD/EDA embeddied CFD vs standalone CFD

John Parry, Flomerics, Hampton Court, UK
The paper will chart the changing use of CFD in electronics cooling since it’s earliest use in the 1980s to the present day. The unique characteristics of the electronics cooling market and how these have shaped the development trajectory of CFD software for this application will be discussed. Reflecting on the past, the paper will then consider the longevity of the stand-alone solutions that dominate today’s market of and how CAD-embedded and EDA-integrated solutions may shape the future of electronics cooling.