Keynote Speakers
Keynote: Thermal Transport in Nanostructured Materials and Devices
Ravi Prasher, Sheetak Inc., Austin, Texas, USA
Ravi Prasher is the VP of product development of Sheetak Inc., a technology startup. Sheetak is developing solid-state thermoelectric devices based on its proprietary thermoelectric modules. Ravi was also an adjunct professor in the school of engineering at ASU from 2005 – 2013. Ravi earlier worked as one of the first program directors at Advanced Research Projects Agency – Energy (ARPA-E) in US DOE. Prior to joining ARAP-E, Ravi was the technology development manager of thermal management group at Intel. Ravi has published more 85 archival journal papers and holds more than 30 patents. He is a fellow of ASME and senior member of IEEE. He is on the editorial committee of multiple journals. Ravi obtained his B.Tech. from IIT Delhi and Ph.D. from Arizona State University.
Keynote: Thermometry of Self-heated Nanoscale Devices
Bernd Gotsman, IBM Research, Zurich, Switzerland
Bernd Gotsmann (www.zurich.ibm.com) is a Research Staff Member in the Materials Integration & Nanoscale Devices group of the Science & Technology department at IBM Research – Zurich. Bernd Gotsmann studied Physics at the University of Muenster, Germany, and the University of York, UK. After receiving his PhD he joined IBM in 2001 as a postdoctoral fellow and became a Research Staff Member in 2006.
His research is focused on nanoscale electronics with applications in thermal transport, thermoelectricity, tribology, molecular electronics and nanomechanics.
Keynote: Thermal Management in Compact Systems – From Wishes to Implementation
Perceval Coudrain, STMicroelectronics, France
Dr. Perceval Coudrain received a MS degree in Material Sciences in 2001 and a PhD degree from Institut Supérieur de l’Aéronautique et de l’Espace in Toulouse, France, in 2009. He worked in Taiwan in 2000 on thin film deposition for micro-batteries and infrared bolometers. He joined STMicroelectronics in 2002 as a CVD process engineer in Crolles and moved to the advanced R&D group in 2005. He worked on the early development of backside illumination and monolithic 3D integrations of CMOS Image sensors for highly miniaturized pixels. Since 2009, he is with the 3D-Interconnects Group, and based at CEA-Leti in Grenoble, focusing on TSV-based 3D integrations. His research interests include TSV-middle integration, Cu-Cu/SiO2-SiO2 direct hybrid bonding for high density interconnections and thermal management for 3D circuits. He occasionally serves as an expert for the French Research Agency and is member of the EPTC Technical Committee on Emerging Technologies. He is author or co-author of more than 50 international publications and 10 international patents.