Information for Authors

- Abstract submission deadline: 15 April 2013
- Notification of acceptance: 10 June 2013

Authors are invited to submit abstracts describing recent work covering “traditional” thermal management as well as stress and thermal-stress-related reliability issues. These challenges, faced in various nano-, micro- and power-electronic applications, are of significant importance and thus interest to the engineering community engaged in the field of thermal phenomena in “high-tech” systems.

Maximum length of abstracts is 400 words. All abstracts will be double blind reviewed. You can revise and update your abstract up to the deadline on April 15th, 2013.

Authors of accepted contributions will be invited to uoload a paper which will be published in the Workshop Proceedings, and archived in IEEE Xplore (provided they comply with the specifications). THERMINIC papers can be searched through IEEE, Google scholar and other search engines. They are also available on open archives like EDA Publishing, HAL and ArXiv.

The deadline for full paper upload is extended to August 20th, 2013.