David Atienza Alonso, Ecole Polytechnique Federale de Lausanne (EPFL), Switzerland

Biography

Abstract: Continuous advances in manufacturing technologies are enabling the development of more powerful and compact 3D multi-processor ICs for high-performance computing (HPC). However, 3D stacking originates higher power and heat densities, leading to degraded performance in HPC if cooling is not handled properly at all levels of abstraction. In this talk, I present a novel thermal-aware design paradigm for 3D-ICs and overall “Green Datacenter Design”, developed at EPFL in cooperation with IBM and ETHZ, which includes thermal modeling as fundamental step to design 3D multi-processor ICs with inter-tier liquid cooling microchannels, in combination with the use of dynamic thermal management at system-level to tune the flow rate of the coolant in each tier in order to achieve thermally-balanced 3D-ICs and complete datacenters servers.
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The NANOPACK Project

Afshin Ziaei, THALES Research & Technology, Palaiseau, France

Biography

Abstract: NANOPACK – Nano Packaging Technology for Interconnect and Heat Dissipation – is a European large-scale integrating project aiming at the development of new technologies and materials for low thermal resistance interfaces and electrical interconnects, by exploring the capabilities offered by nanotechnologies such as carbon nanotubes, nanoparticles and nano-structured surfaces, and by using different enhancing contact formation mechanisms, compatible with high volume manufacturing technologies. Major achievements of the project will be presented, in particular in the fields of low resistance thermal interface materials, their modeling, characterization and their demonstration into relevant industrial demonstrators (for automotive, avionic, microprocessor and microwave applications).