THERMINICBudapest, Hungary
25-27 September 2012

18th International Workshop on
Thermal investigations of ICs and Systems

General Chair: Marta RENCZ , BME, Budapest, Hungary
Vice General Chair: Bernard COURTOIS, CMP, Grenoble, France
  • Sponsored by:
  • CMP
  • IEEE
  • CPMT


Programme Chair: Peter Raad, SMU, USA

Day 1, 25 September, Tuesday
 8:00  9:10 Registration
 9:10  9:20 Welcome Address
 9:20 10:00 Invited Talk: Thermal Stress Modeling in Electronics and Photonics: Brief Review
Ephraim Suhir, UC Santa Cruz (USA)
10:00 11:00 Session 1: Thermal Stress
Minimizing Thermally Induced Interfacial Shearing Stress in a Thermoelectric Module
Amirkoushyar Ziabari, Ephraim Suhir, Ali Shakouri, (USA)
Overview of thermal Studies on photonics devices for reliability, robustness and new design
Y. Deshayes, A. Royon, R. Baillot, L. Béchou, L. Canioni, Y. Petit, Th. Cardinal, I. Bord, B. Levrier and Y. Ousten, IMS Lab. - Université Bordeaux 1 (France)
Thermal Stress Analyses of Inductive Proximity Sensors under Thermal Cycling Condition
Sung Yi, Kevin Pickup, Mechanical and Material Engineering Department, Portland State University (USA)
11:00 11:30 Coffee Break
11:40 12:30 Session 2: ICs
MiMAPT: Adaptive Multi-Resolution Thermal Analysis at RT and Gate Level
Mohammadsadegh Sadri, Andrea Bartolini, Luca Benini, University of Bologna (Italy)
Thermal Sensor Distribution Method for 3D Integrated Circuits Using Efficient Thermal Map Modeling
Fatemeh Kashfi, Jeff Draper, Information Science Institue/University of Southern California (USA)
Drawing the packaging landscape for CFL applications
F.J. Sluijs, J.H.J. Janssen, E.P.B.J. de Bruin, P. Dijkstra, NXP Semiconductors (The Netherlands)
12:35 14:00 Lunch
14:00 15:20 Session 3: Measurements
Thermoreflectance Measurements for Optically Emitting Devices
Peter E. Raad, Pavel L. Komarov, Mauro A. Bettiati, SMU (USA)
Temperature Prediction for Multi-Core Microprocessors with Application to Dynamic Thermal Management
Bartosz Wojciechowski, Janusz Biernat, Wroclaw University of Technology (Poland)
Thermal design and characterization of solar cell arrays aimed to be used in CubeSat missions
Gyula Horváth, David Czifra, Gábor Marosy, Zsolt Várhegyi, BME-DED (Hungary)
Heat spreading in a thin longitudinal fin
Wendy Luiten, Philips Research (The Netherlands)
15:20 15:40 Coffee Break
15:40 17:20 Session 4: Electro-thermal
Electro-thermal characterization of a differential temperature sensor and the thermal coupling in a 65nm CMOS IC
Josep Altet, José Luis Gonzalez, Dídac Gómez, Xavier Perpińŕ, Stephane Grauby, Cedirc Dufis, Miquel Vellvehi, Diego Mateo, Stefan Dilhaire and Xavier Jordŕ, Electronic Engineering Department - Universitat Politčcnica de Catalunya (Spain)
Electro-thermal modeling and measurements of SiGe HBTs
Mountakha Dieng, Abdel-Kader El Rafei, Raphael Sommet, Raymond Quéré, XLIM-University of Limoges (France)
Electro-thermal High-Level Modeling of Integrated Circuits
Jean-Christophe Krencker, Jean-Baptiste Kammerer, Yannick Hervé, Luc Hébrard, Institut d`Electronique du Solide et des Systčmes (France)
Development and Performance of LED Metal Package with an Integrated Reflector/Heat Slug Structure
Jin Hwan Kim, Jong Hwa Choi, So Hyeon Mun, Moo Whan Shin, School of Integrated Technology, College of Engineering, Yonsei University (Korea)
A disruptive technology for thermal to electrical energy conversion
O. Puscasu, S. Monfray, C. Maître, JP Pemeant, F. Boeuf, G. Savelli, F. Gaillard, D. Guyomar, T. Skotnicki, STMicroelectronics (France)
17:20 17:40 Vendors Session
17:40 18:05 Poster Introduction Session
The thermal design of the thermal cutter of an antenna opening mechanism employed on a pico-satellite
Zoltán Kovács, Gábor Marosy, Gyula Horváth, BME Department of Electron Devices (Hungary)
CFD Transient Model of the Buoyancy Heat Transfer for a Heat Sink: Effects of Geometry Rotation
Carmine Sapia, Giorgio Sozio, Applied Electronic Department, University "Roma TRE" (Italy)
Integrated microcooler structure realized by wet chemical etching
György Bognár, Balázs Plesz, Péter G. Szabó, Gusztáv Hantos, Department of Electron Devices, Budapest University of Technology and Economics (Hungary)
Simulations on Vanadium Dioxide Thin Film as Thermographic Material
Márton C. Bein, János Mizsei, BUTE DED (Hungary)
Practical Dynamic Thermal Management of Multi-core Microprocessors
Bartosz Wojciechowski, Marek A. Bawiec, Wroclaw University of Technology (Poland)
A Thermal Model for The PCB Structure Including Thermal Contribution of Traces and Vias
Yabin Zhang, Alessio Pennatini, Paolo Emilio Bagnoli, Department of Information Engineering, University of Pisa (Italy)
Miniaturized Frictionless Fan Concept for Thermal Management of Electronic
Ralph Schacht, Alexander Hausdorf, Bernhard Wunderle, Bernd Michel, Fraunhofer ENAS (Germany)
Dual Cold Plate System with Active Temperature and Heat Flux Control
Marcin Janicki, Zbigniew Kulesza, Tomasz Torzewicz, Andrzej Napieralski, Technical University of Lodz (Poland)
18:10 20:00 Poster Viewing and Cocktail

Day 2, 26 September, Wednesday
 9:00  9:40 Invited Talk: Silicon Carbide – The Power Device for the Future
Erik Janzén, Olof Kordina, Linköping University (Sweden)
 9:40 11:00 Session 5: Dynamic Thermometry
The Thermoreflectance Approach in Dynamic Thermometry and Thermophysical Property Measurement for Thermal Design of Electronics
Peter E. Raad, Pavel L. Komarov, SMU (USA)
Nanoscale Thermal Metrology for Electronic Devices
Stefan Dilhaire, Wilfrid Claeys, LOMA - Université Bordeaux 1 (France)
Challenges and Opportunities for Transient Thermal Imaging of Microelectronic Devices
Kazuaki Yazawa, Dustin Kendig, Daniel Hernandez, Kerry Maze, Ali Shakouri, Microsanj LLC. (USA)
Development of pulsed heating thermoreflectance methods under configurations of rear heating / front detection and front heating / front detection
Tetsuya Baba, Naoyuki Taketoshi, Takashi Yagi, National Institute of Advanced Industrial Science and Technology (Japan)
11:00 11:30 Coffee Break
11:30 12:30 Session 6: Thermal Properties
Measurement of the thermal impedance of GaN HEMTs using "the 3ω method"
Mustafa Avcu, XLIM-University of Limoges (France )
A Simple and Approximate Analytical Model for the Estimation of the Thermal Resistances in 3D Stacks of Integrated Circuits
François de Crécy, CEA - LETI (France )
New thermal method for the characterization of solid materials at different temperature levels
Ali Assy, Séverine Gomčs, Patrice Chantrenne, Nicolas Pavy, Jayalakshmi Parasuraman, Xavier Kleber, and Philippe Basset, CETHIL- INSA Lyon (France )
12:35 14:00 Lunch
14:00 15:00 Session 7: Metals and Liquids
Modelling of heat transfer in microdroplets as microreactors
Ferenc Ender, Gusztáv Hantos, BME Department of Electron Devices (Hungary)
Quasi – 3D approach for BGA Package Thermal Modeling
Konstantin Petrosyants, Nikita Rjabov, Moscow State Institute of Electronics and Mathematics (Russia)
Context-Aware Energy Consumption of Mobile Wireless Communication
Marius Marcu, Sebastian Fuicu, Politehnica University of Timisoara (Romania)
15:00 15:20 Coffee Break
15:20 17:20 Session 8: Therminator
Thermal aware design methodology for small signal discrete products
Steffen Holland, Martin Röver, Hans-Jürgen Kühl, Hans-Jürgen Witt, Remo Quade, NXP Semiconductors (Germany)
Coupled electro-thermal model for simulation of GaN power switching HEMTs in circuit simulators
Steve Stoffels, Herman Oprins, Denis Marcon, Karen Geens, Xuanwu Kang, Marleen Van Hove and Stefaan Decoutere, Imec (Belgium)
Temperature dependent timing in standard cell designs
Andras Timár, Márta Rencz, BME DED (Hungary)
Layout Constrained Body-Biasing for Thermal Clock-Skew Compensation
Valerio Tenace, Sandeep Miryala, Andrea Calimera, Alberto Macii, Enrico Macii, Massimo Poncino, Politecnico di Torino (Italy)
A quasi-SPICE electro-thermal simulator
Albin Szalai, Zoltán Czirkos, Vladimír Székely, Budapest University of Technology and Economics, Department of Electron Devices (Hungary)
Yield enhancement by logi-thermal simulation based testing
Gergely Nagy, László Pohl, András Timár, András Poppe, BME DED (Hungary)
19:00 Departure to the Gala Dinner and a special social program

Day 3, 27 September, Thursday
 9:00  9:40 Invited Talk: Nanoscale electrothermal energy conversion devices
Je-Hyeong Bahk, Younes Ezzahri, Kazuaki Yazawa, Bjorn Vermeersch, Gilles Pernot, Ali Shakouri, Birck Nanotechnology Center, Purdue University (USA)
 9:40 11:00 Session 9: SmartPower I
The SMARTPOWER project: goals and tasks
Afshin Ziaei, Thales Research and Technology (France)
Technical Requirements for the Development of a High Performance RF module for Airborne Radar Application
Franck Vouzelaud, Philippe Kertesz, Julie Mazeau and Yves Mancuso, Thales Systčmes Aéroportés (France)
Room Temperature Transfer of Carbon Nanotubes on Flexible Substrate
Di Jiang, Yifeng Fu, Yan Zhang and Johan Liu, Chalmers University of Technology (Sweden)
Graphene Heat Spreader for Thermal Management of Hot Spots in Electronic Packaging
Zhaoli Gao, Yong Zhang, Yifeng Fu, Matthew Yuen and Johan Liu, Chalmers University of Technology (Sweden)
11:00 11:20 Coffee Break
11:20 12:20 Session 10: SmartPower II
Enhancement of the thermal properties of a vertically aligned carbon nanotube thermal interface material using a tailored polymer
H. Le Khanh, L. Divay, Y. Ni, P. Le Barny, E. Leveugle, E. Chastaing, F. Wyczisk, A. Ziaei, S. Volz, J. Bai, Thales Research and Technology (France)
Thermal transient characterization of pHEMT devices
Zoltán Sárkány, Gábor Farkas, Márta Rencz, Budapest University of Technology and Economics (Hungary)
Modelling and characterisation of smart power devices
B. Wunderle, M. Abo Ras, M. Springborn, D. May, J. Kleff, H. Oppermann, M. Töpper, T. Caroff, R. Schacht, R. Mitova, Berliner Nanotest und Design GmbH (Germany)
 12:20  12:35 Closing Remarks
12:40 14:15 Lunch
  • Commercial Sponsors:
  • Mentor Graphics