5th International Workshop on
ICs and MICROSTRUCTURES
|| October 3-6, 1999,|
Two tutorials (A and B) are being offered on Sunday 3 October, from 9.30 a.m. to 5 p.m. They will run in parallel. Registrations will be guaranted on a first come first serve basis, upon maximum capacity is reached.
A- Design and Analysis of Cost-Effective Heat Sinks
Executive Director and Professor
The objectives of the tutorials is to acquaint attendees with the modeling approaches, analytical techniques, and experimental correlations needed to design and optimize air-cooled heat sinks for the cost-effective thermal management of electronic components. Attention will be focused on the development of the governing equations for individual fins and arrays of fins, including attention to minimization of fin material, pressure drop in channels (between the fins), and optimum spacings between fins. These relations will be used to define opportunities for heat sink optimization, including maximum thermal performance, least-material designs, and the performance envelope for specified flow rates and pressure drops. Supporting experimental results for natural and forced convection, high performance heat sinks will be presented. The tutorial will also address the constraints imposed by current manufacturing practices on heat sink performance.
Topics to be covered
Avram Bar-Cohen is Professor of Mechanical Engineering at the University of Minnesota and Executive Director of the Center for the Development of Technological Leadership. His career in industry and academia has focused on the thermal design, analysis, and optimization of electronic equipment. He is the Editor-in-Chief of the IEEE Transactions on Components and Packaging Technologies and co-author of "Design and Analysis of Heat Sinks" (1995) and "Thermal Analysis and Control of Electronic Equipment" (1983).
B- Thermal Design of Electronic Systems Through Combined Modeling and Testing
Department of Mechanical Engineering and CALCE Electronic Products and Systems Center
Product development cycle times for many electronics systems have shrunk from a few years to a few months. There is an ever-increasing emphasis on smaller, lighter, low cost and high reliability designs. Computer-aided design tools, in conjunction with limited validation testing are rapidly replacing the older build-and-test approach to design. Rapid recent progress in computational heat transfer and fluid flow is beginning to make system level thermal simulations feasible. However, the capabilities and limitations of these tools are often not available to the designer in sufficient detail. This tutorial will provide an introduction to the use of computational fluid dynamics and heat transfer techniques in the design of electronic products. The role of combined modeling and experimentation will be emphasized. An introduction to the role of thermal analysis in reliability and performance assessment will be included. This course should be of interest to industry engineers involved in design of electronic systems, as well as to students and researchers concerned with thermal management and characterization.
Topics to be covered
Yogendra Joshi is Professor of Mechanical Engineering at the University of Maryland at College Park, where he is active in research and instruction in the area of thermal engineering. His prior experience also includes seven years on the faculty at the Naval Postgraduate School (NPS), Monterey, California, and one year in the semiconductor assembly industry. Dr. Joshi received a Doctor of Philosophy in Mechanical Engineering and Applied Mechanics, from the University of Pennsylvania, in 1984. He is currently serving as Associate Technical Editor of the ASME Journal of Electronic Packaging. Prof. Joshis research projects deal with heat transfer and fluid flow processes associated with emerging technologies. He has served as an academic advisor to twenty five graduate students. Dr. Joshi is the author or co-author of forty journal articles and numerous conference papers.
Reservation and Registration
Hotel Reservation Form
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