MONDAY 4 OCTOBER
8:00-9:30	Registration
9:30-9:40	Welcome address: B. Courtois, General Chair, TIMA Laboratory, Grenoble, France
9:40-10:20	Invited talk: A. Bar-Cohen, University of Minnesota, USA Chair: V. Székely, TU of Budapest, Hungary	THERMAL PACKAGING FOR THE 21ST CENTURY: CHALLENGES AND OPTIONS
10:20-12:00	Session 1 Chair: O. Slattery, NMRC, Ireland	ADVANCED MEASUREMENT TECHNIQUES
10:20	V. Székely1, S. Ress1, A. Poppe1, S. Török1, D. Magyari1, Zs. Benedek1, B. Courtois2, M. Rencz3 1TU of Budapest, Hungary 2TIMA, Grenoble, France 3MicRed, Budapest, Hungary	Transient thermal measurements for dynamic package modeling: new approaches
10:40	N. Trannoy, S. Gomès, P. Grossel U. of Reims, France	Thermal characterization of measurement by STM and STHM
11:00	M. Rohde Forschungszentrum Karlsruhe, Germany	Nondestructive testing and determination of thermal parameters in thin films and microcomponents
11:20	R. Grimes, M. Davies U. of Limerick, Ireland	PIV measurements of cooling fan aerodynamics
11:40	N. Mathis Mathis Inst., Fredericton, Canada	New instrument for thermal management design
12:00-13:30	Lunch
13:30-14:30	Session 2 Chair: D. De Cogan, U. of East Anglia, United Kingdom	TEMPERATURE MEASUREMENT AND MONITORING
13:30	M. Janicki, A. Napieralski TU of Lodz, Poland	New approach to electronic circuit temperature monitoring
13:50	R.A. Bianchi1, J.M. Karam1, B. Courtois1, R. Nadal2, F. Pressecq3, S. Sifflet4 1TIMA, Grenoble, France 2UPC Barcelona, Spain 3CNES, Toulouse, France 4TRS31, Auterive, France	CMOS compatible temperature sensor with digital output for wide temperature range applications
14:10	H. Bellaj, J.M. Dorkel, P. Tounsi, Ph. Leturcq LAAS, Toulouse, France	Validity and limits of the junction temperature concept for integrated power devices
14:30-14:50	Coffee
14:50-15:10	Embedded Tutorial C.P. Tso, S.P. Mahulikar, Nanyang TU, Singapore Chair: G. De Mey, U. Gent, Belgium	A SURVEY ON COUPLED TRANSPORT PROCESSES IN THIN LIQUID FILMS FOR MICROCHANNEL HEAT TRANSFER APPLICATION
15:10-17:10	Session 3 Chair: G. De Mey, U. Gent, Belgium	ADVANCED COOLING TECHNOLOGIES
15:10	C. Perret1,2, J. Boussey2, Ch. Schaeffer1, M. Coyaut1 1LEG, Grenoble, France 2LPCS, Grenoble, France	Integration of cooling devices in silicon technology
15:30	G.B. Russell, W.Z. Black, J.G. Hartley, A. Glezer Georgia Inst. of Techno, Atlanta, USA	Microjet cooling of single level integrated modules
15:50	P. Dziurdzia, A. Kos U. of Mining and Metallurgy, Krakow, Poland	Electrothermal macromodel of active heat sink for cooling process simulation
16:10	G.I. Sultan Mansoura U., Egypt	Enhancing forced convection heat transfer from multiple protruding heat sources simulating electronic components in a horizontal channel by passive cooling
16:30	D.G. Wang NCR, San Diego, USA	Expanding conventional system level forced air-cooling envelope
16:50	C.H. Amon Carnegie Mellon U., Pittsburgh, USA	Metrics for transient cooling of portable electronics
17:15-19:00	Poster session 1 Chair: M. Rencz, Techn. Univ. of Budapest, Hungary
	N. Pesare, A. Giorgio, B.M. Bobbo, A.G. Perri Politecnico di Bari, Italy	A new electrothermal simulator of GaAs MESFETs for optimal layout design of MMICs
	K.O. Petrojanc1, I.A. Kharitonov1, P. Maltcev1, N.I. Rjabov1, L.N. Kravtchenko2, A.N. Sapelnikov2 1MUEM, Moscow, Russia 2Science and Research Inst. of Molecular Electr., Moscow, Russia	High-speed digital GaAs ICs electro-thermal simulation with PSPICE
	T. Franke Siemens, München, Germany	Thermal modelling of multichip assemblies
	M.Rencz, V. Székely, Zs. Kohari, S. Ress, A. Pàhi, A. Poppe TU of Budapest, Hungary	Thermal evaluation of the SIP9 package
	S. Ramminger1, J.G. Bauer1, T. Scherg1, H.J. Schulze1, K. Mosig2, G. Wachutka3 1Siemens, München, Germany 2Infineon, Villach, Austria 3München U. of Techno., Germany	Temperature behavior of power devices with copper metallisation using thermal simulation
	R. Schacht1, M. Kasper2, H. Reichl1 1TU of Berlin, Germany 2TU Hamburg-Harburg, Germany	Macro modelling for transient simulation of coupled electro-thermal problems for an IGBT module
	E.W. Kreutz1, N. Pirch1, T. Ebert2,3, R. Wester2, B. Ollier2,3, P. Loosen2, R. Poprawe1,2 1LLRWTH, Aachen, Germany 2Fraunhofer-Inst. für Lasertechnik, Aachen, Germany 3PROLAS, Aachen, Germany	Simulation of micro-channel heat sinks for optoelectronic microsystems
	S. Galliou, M. Mourey ENSMM, Besançon, France	Simulation of thermal regulated ultra stable quartz oscillator
	A.G. Madera, M.Sh. Sourgouladze Russian Acad. of Science, Moscow, Russia	Stochastical temperature fields in ICs and electron modules and method for their calculation
	A. Poppe, Gy. Csaba, K. Tarnay, V. Székely TU of Budapest, Hungary	Considering electro-thermal interations in sub-micron n-MOS transistor on microscopi scale within a 3D particle dynamics based monte carlo simulator
	F.H. Fernandez Morales, J. Samitier U. of Barcelona, Spain	Thermal behaviour of a bioparticle microhandler: a transient approach
	D. Fedasyuk, E. Levus, M. Mykhalchuk, D. Petrov State U. Lvivska Polytech, The Ukraine	Modelling and analysis of methods of providing thermal performance of flip-chip structure
	E. Chen Xiansong Hewlett-Packard, Singapore	Thermal performance study for a MCMS infrared transceiver by FEM
	J. Diefenbach1, F. Hiller2, R. Vahrmann2 1DaimlerChrysler, Frankfurt, Germany 2TEMIC, Heilbronn, Germany	THERESCA: a tool to calculate the thermal resistance of an electronic package
19:00	Reception
TUESDAY 5 OCTOBER
8:30-9:10	Invited talk: J. Rantala, Nokia, Helsinki, Finland Chair: C. Lasance, Philips, Eindhoven, The Netherlands	NEEDS AND TRENDS IN INDUSTRIAL THERMAL MANAGEMENT OF ELECTRONICS
9:10-11:10	Session 4 Chair: J.M. Dorkel, LAAS, Toulouse, France	ELECTRO-THERMAL SIMULATION
9:10	M.N. Sabry1, H. Haddara2, K. Abdel-Salam3, M. Awad1, A. Nasser3 1Mansoura U., Egypt 2Mentor Graphics, Egypt 3Tenth of Ramadan Higher Tech. Inst., Egypt	Investigation of self heating in SIMOX transistors operated at high temperatures using a boundary value problem formulation
9:30	P. Tounsi, K. Bellil, J.M. Dorkel LAAS-INSAT, Toulouse, France	Transient electrothermal computation: large power IGBT and MOS modules in on-state operating conditions
9:50	C. Harlander1, R. Sabelka1, R. Minixhofer2, S. Selberherr1 1TU Vienna, Austria 2Austria Mikro Systeme Intl, Unterpremstätten, Austria	Three-dimensional transient electro-thermal simulation
10:10	D. D'Amore, P. Maffezzoni Politecnico di Milano, Italy	Electro-thermal analysis of paralleled bipolar devices
10:30	M. Jakovljevic, P. Fotiu, Z. Mrcarica, H. Detter TU Wien, Austria	A method for simultaneous 3D electro-thermal simulation of microsystems
10:50	G. Breglio1, F. Frisiana2, A. Magri2, P. Spirito1 1U. of Napoli, Italy 2STMicroelectronics, Catania, Italy	Thermal mapping of new cellular power MOS affected by electro-thermal instability
11:10-11:30	Coffee
11:30-13:10	Session 5 Chair: K. Azar, Lucent Technologies, Andover, USA	EXPERIMENTAL VALIDATION OF NUMERICAL ANALYSIS
11:30	M.N. Sabry Mansoura U., Egypt	Scale effects on fluid flow and heat transfer in micro-channels
11:50	D. Newport1, M. Davies1, T. Dalton1, M. Whelan2 1U. of Limerick, Ireland 2Joint Research Centre, Ispra, Italy	An optical and numerical investigation into the temperature and velocity fields about an enclosed PCB with an array of simulated 2D components in free convection
12:10	J. Lohan, P. Tiilikka, C.M. Fagar, J. Rantala Nokia, Helsinki, Finland	Effect of PCB thermal conductivity on the operating temperature of an SO-8 package in a natural convection environment: experimental measurement versus numerical prediction
12:30	P. Rodgers1, J. Lohan2, V. Eveloy2 1U. of Limerick, Ireland 2Nokia, Helsinki, Finland	Impact of both convective environment and PCB conductivity on the distribution of heat transfer from three electronic component package types-operating on single-and multi-component printed circuit boards
12:50	D. Agonafer1, R. Schmidt1, A. Free2 1IBM, Poughkeepsie, USA 2Maya Heat Transfer Technologies, USA	A coupled conjugate model of the internal and external resistance of a TCM
13:15-14:15	Lunch
14:30-16:00	Vendors' Session
16:00-17:20	Session 6 Chair: J.B. Saulnier, ENSMA, Poitiers, France	STUDIES ON THERMAL MATERIAL PARAMETERS
16:00	M. Malinski, L. Bychto TU of Koszalin, Poland	Photoacoustic studies of the absorption coefficient of CdTe
16:20	M. Malinski, L. Bychto TU of Koszalin, Poland	The influence of the quality of the semiconductor surface on the photoacoustic signal characteristics on the example of CdTe studies
16:40	A. Drushinin, Y. Pankov, I. Maryamova, Y. Khoverko Lviv Polytech. State U., The Ukraine	The Piezo-seebeck effect in p-type silicon
17:00	J. Zakrzewski1, F. Firszt1, S. Legowski1, H. Meczynska1, B. Sekulska1, J. Szatkowski1, W. Paszkowicz2 1Inst. of Physics, Torun, Poland 2Polish Academy of Sciences, Warsaw, Poland	Photoacoustic investigations of beryllium containing wide gap II-VI mixed crystals
17:20-17:40	Coffee
17:40-18:40	Poster session 2 Chair: M. Rencz, Techn. Univ. of Budapest, Hungary
	V.Székely1, A. Nagy1, S. Török1, E. Nikodemusz-Székely2, M.Rencz3 1TU of Budapest, Hungary 2Res. Inst. for Comp. Automation, Budapest, Hungary 3MicRed, Budapest, Hungary	Electrically controlled thermal resistance: an experiment
	G.C. Albright1, J.A. Stump1, J.D. McDonald1, H. Kaplan2 1Quantum Focus Instr., Shelton, USA 2Honeyhill Techn. Comp., Norwalk	"True" temperature measurements on microscopic semiconductor targets
	R. Houlihan, G. Kelly, C. Lyden NMRC, Cork, Ireland	Development of behavioural models of resonant sensor elements subject to residual stress
	V. Golembo, V. Kotlarov, S. Kharytonov State U. "Lviv Polytechnic", The Ukraine	The piezoquartz temperature sensor's interfac modules
	N.F. Strarodub, V.M. Starodub NASU, Kyiv, The Ukraine	Microthermal enzymatic sensor for the express monitoring of the cyanide content in water
	Yu.P. Dotsenko, T.Ya. Gorbach, L.O. Matveeva, P.S. Smertenko, S.V. Svechnikov, E.F. Venger NASU, Kyiv, The Ukraine	Dimensionless sensitivity as a base for modeling of thermometric characteristics of thermodiode sensors
	M. Davies, E. Kehoe, J. Punch U. of Limerick, Ireland	Thermal gradients and electronic component reliability
	N.R. Kamat Chartered Semiconductor, Singapore	Investigating reliability on the 5 metal single poly 0.25um CMOS process
	S. Volz1, J.B. Saulnier1, G. Chen2, P. Beauchamp3 1LET, Poitiers, France 2UCLA, Los Angeles, USA 3U. of Poitiers, Futuroscope, France	Computation thermal conductivity of superlattices by molecular dynamics technique
	R.A. Bianchi, J.M. Karam, B. Courtois TIMA, Grenoble, France	Pressure and temperature integrated measurement system for high temperature oil well applications based on ALC crystal oscillators
	Ch. S. Roumenin, A. Ivanov, P. Nikolova Inst. of Control & System Research, Sofia, Bulgaria	Thermogradiometer sensor based on differential microdiode
	M. Strasser1,2, F. Flötz1, R. Aigner1, G. Wachutka2 1Infineon, München, Germany 2München U. of Techno., Germany	Device performance of CMOS low power thermoelectric generators
19:00-20:30	Diner
20:30	Panel Moderator: D. Agonafer, IBM, Poughkeepsie, USA Panelists: J. Parry, Flomerics, Hampton Court, United Kingdom J. Rantala, Nokia, Helsinki, Finland K. Azar, Lucent Technologies, Andover, USA H. Pape, Infeneon, München, Germany J. Janssen, Philips, Nijmegen, The Netherlands C. Villa, STMicroelectronics, Agrate Brianza, Italy T. Tarter, AMD, Sunnyvale, USA	WHAT ARE THE EXPECTATIONS OF THE ELECTRONICS INDUSTRY FROM THE THERMAL ACADEMIC COMMUNITY ?
WEDNESDAY 6 OCTOBER
9:00-9:40	Invited talk: E. Suhir, Lucent Technologies, Murray Hill, USA Chair: B. Courtois, TIMA, Grenoble, France	THERMAL STRESS IN MICROELECTRONICS PACKAGING: PROBABILISTIC APPROACH
9:40-10:00	Coffee
10:00-10:20	Embedded Tutorial C. Lasance, Philips, Eindhoven, The Netherlands Chair: T. Tarter, AMD, Sunnyvale, USA	THERMAL CHARACTERISATION BY COMPACT MODELS: WHERE ARE WE ?
10:20-12:00	Session 7 Chair: T. Tarter, AMD, Sunnyvale, USA	THERMAL AND THERMOMECHANICAL CHARACTERISATION
10:20	J.M. Bosc1, P. Dupuy1, J. Gil1, J.M. Dorkel2, G. Sarrabayrouse2 1Motorola, Toulouse, France 2LAAS, Toulouse, France	Thermal characterization: a key element for accelerating stress testing
10:40	D. Giusti, G. Verzellesi, G.U. Pignatel U. of Trento, Italy	Thermo-mechanical analysis of microstructures for chemoresistive gas sensors
11:00	S. Leseduarte1, S. Marco1, E. Beyne2, R. van Hoof2, A. Marty3, S. Pinel3, O. Vendier4, A. Coello-Vero4 1U. of Barcelona, Spain 2IMEC, Leuven, Belgium 3LAAS, Toulouse, France 4Alcatel Space Industries, Toulouse, France	Residual thermo-mechanical stresses in thinned chip assemblies
11:20	S. Van Dooren1, B. Vandevelde1, E. Beyne1, F. Christiaens2, D. Corlatan2 1IMEC, Leuven, Belgium 2Alcatel Bell, Antwerpen, Belgium	Parametric compact models for flip chip assemblies
11:40	L. Gleton1, P. Lybaert1, B. Dessart2, D. Petitjean2, A. Sturbois2 1Fac Polytech. of Mons, Belgium 2Alcatel ETCA, Charleroi, Belgium	Static and dynamic thermal characterization of a 28 J-lead ceramic package-application of the DELPHI methodology
12:00-13:00	Lunch
13:00-14:20	Session 8 Chair: M.N. Sabry, Mansoura U., Egypt	MEMS
13:00	A. Kruusing, S. Leppävuori, A. Uusimäki, H. Moilanen U. of Oulu, Finland	Piezoelectric drive for agitation and pumping of coolant in ltcc multilayer modules
13:20	U. Dillner, E. Kessler, J. Müller IPHT, Jena, Germany	High sensitivity micromachined heat flux sensor: the problem of heat flow field distortion
13:40	J.E. Duarte1,2, M. Moreno2, E. Martin-Badosa2 1TU of Colombia, Colombia, 2U. of Barcelona, Spain	Design and characterization of thermally actuated bimetallic membrane
14:00	E. Burian1, T. Lalinsky1, M. Drzik2 1Inst. of EE, Bratislava, Slovakia 2Inst. of Constr. & Archit., Bratislava, Slovakia	Simulation of thermally exited GaAs micromachined microactuator
14:20-14:40	Coffee
14:40-15:40	Session 9 Chair: J. Parry, Flomerics, Hampton Court, United Kingdom	THERMAL ANALYSIS TECHNIQUES
14:40	V.Székely1, A. Pàhi1, A. Poppe1, M. Rosental1, T. Teszéri1, M. Rencz2 1TU of Budapest, Hungary 2MicRed, Budapest, Hungary	Thermal time constant analysis and implementation in the THERMAN and SUNRED thermal simulation tools
15:00	M. Bologna, E. Dallago, G. Venchi U. of Pavia, Italy	Thermal analysis of a portable PC
15:20	S. Koziel, W. Szczesniak TU of Gdansk, Poland	Application of evolutionary algorithms to VLSI circuits partitioning with reduction of thermal interactions between elements
15:40	Closing remarks