The Special issue of Microelectronics Journal will collect papers dealing with thermal simulation, measuring and monitoring of thermal states. The submissions should be approximately 4,000 words, but longer or shorter contributions may be accepted. Detailed specifications for the submissions may be found in any issue of the Journal (back cover).

The Special section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology will focus on thermal aspects relating to packaging. The submissions should be type written or printed double-spaced, one side only, using a font size of 11 points or larger, and include an informative 100-250 word abstract. Detailed specifications for the submissions may be found in any issue of the Journal (back cover).

The deadline to submit to either of the Special Issues is 31 October 1998. Authors should indicate the Journal they submit to. They will be notified about their papers by 31 December 1998. Final versions will be due by 31 January 1999, along the instructions that will be provided in due time.

Submit 6 copies to either of the Guest Editors (specifying the Journal you submit to):

Bernard COURTOIS TIMA 46 Avenue Félix Viallet 38031 Grenoble cedex, France Tel: +33 4 76 57 46 15 Fax: +33 4 76 47 38 14 E-mail: Bernard.Courtois@imag.fr

Valdimir SZEKELY Marta RENCZ TU Budapest Dept of Electron Devices Fac. of Electr. Eng. & Infor. Goldmann György tér 3 H-1521 Budapest XI, Hungary Tel: +36 1 463 2702 Fax: +36 1 463 2973 E-mail: szekely@eet.bme.hu rencz@eet.bme.hu

Last Updated June 25, 1998.

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