4th International Workshop on
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES
September 27-29,
Cannes, "Côte d'Azur",
France.

Proceedings

Informal Proceedings will be made available to attendees, based on papers provided by authors. Formal Proceedings will be constitued by Special Issue of Journals.

The Special issue of Microelectronics Journal will collect papers dealing with thermal simulation, measuring and monitoring of thermal states. The submissions should be approximately 4,000 words, but longer or shorter contributions may be accepted. Detailed specifications for the submissions may be found in any issue of the Journal (back cover).

The Special section of the IEEE Transactions on Components, Packaging, and Manufacturing Technology will focus on thermal aspects relating to packaging. The submissions should be type written or printed double-spaced, one side only, using a font size of 11 points or larger, and include an informative 100-250 word abstract. Detailed specifications for the submissions may be found in any issue of the Journal (back cover).

The deadline to submit to either of the Special Issues is 31 October 1998. Authors should indicate the Journal they submit to. They will be notified about their papers by 31 December 1998. Final versions will be due by 31 January 1999, along the instructions that will be provided in due time.

Submit 6 copies to either of the Guest Editors (specifying the Journal you submit to):

Bernard COURTOIS
TIMA
46 Avenue Félix Viallet
38031 Grenoble cedex, France
Tel: +33 4 76 57 46 15
Fax: +33 4 76 47 38 14
E-mail: Bernard.Courtois@imag.fr
Valdimir SZEKELY
Marta RENCZ

TU Budapest
Dept of Electron Devices
Fac. of Electr. Eng. & Infor.
Goldmann György tér 3
H-1521 Budapest XI, Hungary
Tel: +36 1 463 2702
Fax: +36 1 463 2973
E-mail: szekely@eet.bme.hu
rencz@eet.bme.hu

Last Updated June 25, 1998.

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