4th International Workshop on
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THERMAL
INVESTIGATIONS of
ICs and MICROSTRUCTURES
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September 27-29, | Cannes, "Côte d'Azur", France. | ||
4th International Workshop on
|
THERMAL
INVESTIGATIONS of
ICs and MICROSTRUCTURES
|
September 27-29, | Cannes, "Côte d'Azur", France. | ||
Sunday 27 September 1998
Monday 28 September 1998
Tuesday 29 September 1998
Arrival
| 9:00 |
Session 2: | SENSORS AND ACTUATORS 9:00 |
Invited Talk | R. Mahajan Intel Corp., Hillsboro, USA 14:00 |
Registration |
10:20 | Coffee |
9:40 | Coffee | 15:00 |
Welcome address |
10:40 |
Vendor presentations |
10:00 |
Session 4: | THERMAL SIMULATION 15:10 |
Opening adress |
12:00 | Lunch |
12:15 | Lunch | 15:20 |
Invited Talk |
B.Guenin AMKOR Electornics, Chandler, USA 13:30 | Free Time |
14:00 |
Session 5: | THERMAL MEASUREMENT TECHNIQUES 16:00 | Coffee |
16:00 |
Session 3: |
ELECTRO-THERMAL SIMULATION 15:40 |
Special Session: | A FINAL STATUS REPORT ON THE SEED PROJECT: RESULTS AND FUTURE CHALLENGES 16:20 |
Session 1: | DYNAMIC THERMAL MEASUREMENT AND EVALUATION 17:20 | Coffee |
16:20 |
Closing Remarks | 17:40 | Coffee |
17:40 |
Poster Session 2
| 18:00 |
Poster Session 1 |
18:45 | Banquet
| 19:30 | Reception |
20:30 |
Panel: | INDUSTRY NEED FOR AN INTEGRATED THERMAL ANALYSIS/CAD ENVIRONMENT: FROM CHIP TO PACKAGE TO SYSTEM | ||||||||||||
Last Updated August 20, 1998.
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