4th International Workshop on
THERMAL
INVESTIGATIONS of
ICs and MICROSTRUCTURES
| September 27-29, | Cannes, "Côte d'Azur", France. |
General Chair
B. Courtois
TIMA Grenoble/France
Vice General Chair
M. Rencz
TU Budapest/Hungary
Programme Chair
V. Székely
TU Budapest/Hungary
Programme Committee
G. De Mey
U. Ghent/Belgium
D. Blackburn
NIST Gaithersburg/USA
M. Glesner
TH Darmstadt/Germany
J.B. Saulnier
ENSMA/France
N. Sabry
U. Mansoura/Egypt
A. Ortega
U. Arizona/USA
R. Vahrmann
TEMIC/Germany
U. Dillner
IPHT/Germany
M. Kimura
U. Tohoku/Japan
J. Rantala
Nokia/Finland
C. Lasance
Philips/The Netherlands
J. Parry
Flomerics/UK
D. Agonafer
IBM/USA
T. Tarter
AMD/USA
Y. Zorian
LogicVision/USA
J.M. Dorkel
LAAS/France
S. Chew
IME/Singapore
D. De Cogan
U. of East Anglia/UK
A. Rubio
UPC/Spain
V. Luchinin
Microtechno. Ctre/Russia
Z. Suszynski
TU Koszalin/Poland
I. Barsony
KFKI-ATKI/ Hungary
P. Tuerkes
Siemens/Germany
H. Jaouen
SGS Thomson/France
O. Slattery
NMRC/Ireland
E. Jones
US Air Force/USA
K. Eshraghian
Edith Cowan U./Australia
A. Napieralski
TU Lodz/Poland
D. Balageas
ONERA/France
W. Claeys
U. Bordeaux/France
G. Gielen
KU Leuven/Belgium
J. Rai-Choudhury
SPIE/USA
P. Raad
Southern Methodist U./USA
A. Bar-Cohen
U. of Minnesota/USA
A. Majumdar
U. Of California/USA
Last Updated June 25, 1998.
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