Sunday 27 September
14:00	Registration
15:00	Welcome address B. Courtois, General Chair TIMA Laboratory, Grenoble, France
15:10	Opening address H. Rajbenbach European Commission - DGIII, Brussels, Belgium
15:20	Invited talk B. Guenin AMKOR Electronics, Chandler, USA Chair: TBD	CHARACTERIZATION OF A DELAMINATED INTERFACE IN A PLASTIC SEMICONDUCTOR PACKAGE AND ITS EFFECT ON THERMAL PERFORMANCE
16:00	Coffee
16:20 17:40	Session 1 Chair: W. Claeys Univ. Bordeaux, France	DYNAMIC THERMAL MEASUREMENT AND EVALUATION
16:20	V. Szekely, M. Rencz, S. Török, G. Végh, Zs. Benedek, Cs. Marta, J. Mizsei Techn. Univ. of Budapest, Hungary	ADVANCES IN THE THERMAL MEASUREMENT AND EVALUATION TECHNICS
16:40	M. Carmona, S. Marco, J. Palacin, J. Samitier Univ. de Barcelona, Spain	A TIME-DOMAIN METHOD FOR THE ANALYSIS OF THERMAL IMPEDANCE RESPONSE PRESERVING THE CONVOLUTION FORM
17:00	L. Pellegrino1, P.E. Bagnoli2, M. Madella1, A. Piccirillo1 1CSELT, Torino, Italy 2Univ. di Pisa, Italy	SPATIALLY RESOLVED THERMAL CHARACTERIZATION OF PACKAGED VERTICAL CAVITY SURFACE-EMITTING LASERS
17:20	Z. Suszynski Techn. Univ. of Koszalin, Poland	EXAMINATION OF THE BIPOLAR TRANSISTORS SOLDERING QUALITY: THEORY AND EXPERIMENT
17:40	Coffee
18:00 19:00	Poster session 1 Chair: M. Rencz Techn. Univ. of Budapest, Hungary
	G. Hajas, L. Liptak-Fego Techn. Univ. of Budapest, Hungary	CHARACTERIZATION OF SUBMICRON BULK AND SOI MOS TRANSISTORS FOR ELECTROTHERMAL AND LOGI-THERMAL SIMULATION
	U. Dillner, M. Zieren, J.M. Köhler IPHT, Jena, Germany	THERMAL DESIGN OF MICROCALORIMETERS BASED ON FINITE ELEMENT SIMULATION
	P. Bratek, P. Dziurdzia, A. Kos Univ. of Mining and Metallurgy, Krakow, Poland	OPTIMISATION OF COOLING PROCESS WITH ACTIVE HEAT SINKS
	S. Narasimhan, B. Kusha Fluent Inc., Santa Clara, USA	CHARACTERIZATION AND VERIFICATION OF COMPACT HEAT SINK MODELS
	M. K. Berhe, R. Nair Fluent Inc., Lebanon, USA	NUMERICAL SIMULATIONS OF HEAT SINKS AND THEIR REPRESENTATION BY COMPACT HEAT SINK MODELS
	S. Di Pascoli1, P.E. Bagnoli1, C. Casarosa1, V. Ciuti2, A. Lorelli1 1Univ. of Pisa, Italy 2Accademia Navale, Livorno, Italy	THERMAL PROPERTIES OF INSULATED METAL SUBSTRATE TECHNOLOGY
	V. Lysenko1,2,3,Ph. Roussel1, B. Remaki1, G. Delhomme1, A. Dittmar1, D. Barbier1, C.Martelet2, V. Strikha3 1INSA Lyon, France 2Ecole Centrale Lyon, France 3Kyiv. T. Shevchenko Univ., The Ukraine	FORMATION OF THICK OXIDIZED MESO-POROUS SILICON LAYERS WITH LOW THERMAL CONDUCTIVITY FOR THERMAL ISOLATION APPLICATIONS
	A. Merticaru, V. Moagar-Poladian National Inst. of Microtechnology, Bucharest, Romania	THERMO-MECHANICAL PROPERTIES OF HOLLOW INSULATOR THIN FILM
	L. Boarino1, G. Lerondel1, E. Monticone1, R. Steni1, G. Amato1, G. Benedetto1, V. Lacquaniti1, R. Spagnolo1, P. Roussel2, V. Lysenko2, B. Remaki2, G. Delhomme2, A. Dittmar2, D. Barbier2 1IEN "Galileo Ferraris", Torino, Italy 2INSA Lyon, France	DESIGN AND FABRICATION OF METAL BOLOMETERS ON HIGH POROSITY SILICON LAYERS
	K.S. Teh, L. Lin The Univ. of Michigan, Ann Arbor, USA	TIME-DEPENDENT BUCKLING PHENOMENON OF POLYSILICON MICRO BEAMS
	F. Jablonski, M. Napieralska Techn. Univ. of Lodz, Poland	MICROMACHINED ELECTRO-THERMAL CONVERTER: MEASUREMENTS AND PARAMETER EXTRACTION
	D. Veychard1, Ph. Hazard2, J-M. Karam1 1TIMA Lab., Grenoble, France 2Schneider Electric SA, Nanterre, France	ELECTRO-THERMAL CONVERTER WITH HIGH TIME CONSTANT
19:30	Reception
Monday 28 September
9:00 10:20	Session 2 Chair: G. De Mey Univ. of Gent, Belgium	SENSORS AND ACTUATORS
9:00	C. Shafai1, M.I. Brett2 1Univ. of Manitoba, Winnipeg, Canada 2Univ. of Alberta, Edmonton, Canada	ON-CHIP THIN FILM PELTIER HEAT PUMPS
9:20	L. Langley1, G. Matijasevic2, P. Gandhi2 1Vatell Corp., Blacksburg, USA 2Ormet Corp., Carlsbad, USA	HIGH SENSISTIVITY, LARGE AREA HEAT FLUX SENSORS FABRICATED USING A NOVEL MATERIALS AND PATTERNING TECHNOLOGY
9:40	M. Kimura, J.I. Hayasaka, C. Sawai, T. Aizawa Tohoku-Gakuin Univ., Miyagi, Japan	CHARACTERIZATION OF THE MICRO-THERMAL ANALYSIS SENSOR AND PROPOSAL OF TRANSISTOR-THERMISTOR FOR TEMPERATURE MEASUREMENT OF ITS SI-SUBSTRATE
10:00	A.V. Korlyakov1, V.V. Luchinin1, I.V. Nikitin1, V. Busch2, H.D. Liess2, J. Lademann3 1St Petersburg State Electr. Univ., Russia 2Univ. of German Armed Forces, Muenchen, Germany 3Humboldt Univ. Berlin, Germany	STABLE INTEGRATED SiC-BASED MICROSYSTEMS: HEATER/TEMPERATURE SENSOR
10:20	Coffee
10:40	Vendor presentations
12:00	Lunch
13:30	Free time
16:00 17:20	Session 3 Chair: U. Dillner IPHT, Jena, Germany	ELECTRO-THERMAL SIMULATION
16:00	M.N. Sabry Mansoura Univ., Egypt	STATIC AND DYNAMIC THERMAL MODELLING OF IC'S
16:20	G. Digele1,2, S. Lindenkreuz1, E. Kasper 1Robert Bosch GmbH, Reutlingen, Germany 2Univ. of Stuttgart, Germany	FAST ELECTRO-THERMAL CIRCUIT SIMULATION USING REDUCED ORDER MODELS
16:40	V. Szekely, A. Poppe, M. Rencz, A. Pahi, Sz. Hajder, G. Hajas Techn. Univ. of Budapest, Hungary	STRUCTURAL AND ALGORITHMIC QUESTIONS OF A PLATFORM INDEPENDENT ELECTRO-THERMAL SIMULATOR
17:00	H. Laiz1, M. Klonz2 1INTI,San Martin, Argentina 2PTB, Braunschweig, Germany	DYNAMIC NONLINEAR ELECTRO-THERMAL SIMULATION OF A THIN-FILM THERMAL CONVERTER
17:20	Coffee
17:40 18:40	Poster session 2 Chair: M. Rencz Techn. Univ. of Budapest, Hungary
	T. Dalton, J. Punch, M. Davies Univ. of Limerick, Ireland	AN EXPERIMENTAL METHODOLOGY FOR THE DETERMINATION OF COMPACT THERMAL MODELS OF ELECTRONIC DEVICES
	M. Furmanczyk1, A. Napieralski1, E. Yu, A. Przekwas2, M. Turowski1,2 1Techn. Univ. of Lodz, Poland 2CFD Research Corp., Huntsville, USA	THERMAL MODEL REDUCTION FOR INTEGRATED CIRCUITS
	K.O. Petrosjanc1, P.P. Maltcev1, N.I. Rjabov1, V.N. Gridin2, L.N. Kravtchenko3 1Moscow Univ. of Electr. & Maths, Russia 2Russian Acad. of Sciences, Odintsovo, Russia 3SRIM, Moscow, Russia	THERMAL INVESTIGATIONS OF HIGH-SPEED DIGITAL GaAs ICs
	A. Kaminski, J. Jouglar, C. Volle, S. Natalizio, P.L. Vuillermoz, A. Laugier INSA Lyon, France	NON DESTRUCTIVE CHARACTERIZATION OF DEFECTS IN DEVICES USING INFRARED THERMOGRAPHY
	M. Malinski1, L. Bychto1, R. Kisiel2 1Techn. Univ. of Koszalin, Poland 2Techn. Univ. of Warsaw, Poland	PHOTOACOUSTIC MEASUREMENTS OF THE THERMAL PROPERTIES OF THE ELECTRICALLY CONDUCTING ADHESIVES USED IN THE ASSEMBLY OF ELECTRONIC COMPONENTS
	Z. Suszynski Techn. Univ. of Koszalin	PHOTOACOUSTIC DIAGNOSTIC OF THE POWER TRANSISTORS ENCAPSULATION
	C. A. dos Reis Filho State Univ. of Campinas, Brasil	CURRENT-FEEDBACK LINEARIZATION TECHNIQUE FOR Pt100 RTD’s
	J.E. Duarte1, F.H Fernandez Morales1, J. Sieiro2, S. Leseduarte2, M. Moreno2 1Univ. Pedag. Y Tecno., Boyaca, Colombia 2Univ. de Barcelona, Spain	THERMO-MECHANICAL MODELING OF A THERMO-OPTICALLY ACTUATED SILICON MEMBRANE
	S. Tuli, A. Gupta, A. Moghe Indian Inst. of Techno., New Delhi, India	MIRAGE BASED PROFILING OF CURRENT CARRYING MICROCONDUCTORS
	Ch. S. Roumenin, A. Ivanov, P. Nikolova Inst. of Control and System Research, Sofia, Bulgaria	TEMPERATURE INDUCED ANISOTROPY EFFECT IN DIODE MICROSTRUCTURES BASED MAGNETIC SENSORS
	S.Q. Ling, B.Q. Le, R.F. Conde Johns Hopkins Univ., Laurel, USA	THERMAL ASSESSMENT OF A MINIATURIZED SPACEBORNE COMMAND & DATA HANDLING IN YOUR PALM (C&DHIYP)
	A. Morrissey1, J.Alderman1, G. Kelly1, Zs.Kohari2, A. Pahi2, M. Rencz2 1NMRC, Cork, Ireland 2Techn. Univ. of Budapest, Hungary	3D PACKAGING OF A MICROSYSTEM WITH SPECIAL THERMAL CONSTRAINTS
18:45	Banquet
20:30	Panel Moderator: B. Guenin AMKOR Electronics, Chandler, USA	INDUSTRY NEED FOR AN INTEGRATED THERMAL ANALYSIS/CAD ENVIRONMENT: FROM CHIP TO PACKAGE TO SYSTEM
Tuesday 29 September
9:00 9:40	Invited talk R. Mahajan Intel Corp., Hillsboro, USA Chair: V. Székely Techn. Univ. of Budapest, Hungary	THERMAL INTEGRATION CHALLENGES IN COMPUTING: THE NEED FOR PREDICTIVE CAPABILITIES
9:40	Coffee
10:00 11:40	Session 4 Chair: Y. Zorian LogicVision, Princeton, USA	THERMAL SIMULATION
10:00	L. Ciampolini, P. Regli, W. Fichtner ETH Zurich, Switzerland	SIMULATING THERMAL EFECTS OF SOLDER VOIDS IN LARGE AREA JOINTS
10:20	V. Szekely, A. Pahi, M. Rosenthal, M. Rencz Techn. Univ. of Budapest, Hungary	3D EXTENSION OF THE SUNRED THERMAL FIELD SOLVER
10:40	M. Janicki, M. Zubert, A. Napieralski Techn. Univ. of Lodz, Poland	APPLICATION OF FUNCTION SPECIFICATION METHOD FOR INTEGRATED CIRCUIT TEMPERATURE ESTIMATION
11:00	D. de Cogan Univ. of East Anglia, United Kingdom	THE RELATIONSHIP BETWEEN PARABOLIC AND HYPERBOLIC TLM MODELS FOR HEAT-FLOW
11:20	S. Tzanova, P. Philippov Techn. Univ. of Sofia, Bulgaria	MCM ELEMENT PLACEMENT SATISFYING THE CRITERION FOR OPTIMAL THERMAL CONDITIONS
12:15	Lunch
14:00 15:40	Session 5 Chair: D. de Cogan Univ. of East Anglia, United Kingdom	THERMAL MEASUREMENT TECHNIQUES
14:00	G.B.M. Fiege, L.J. Balk BUGH, Wuppertal, Germany	SCANNING THERMAL MICROSCOPE (SThM): A TOOL FOR THE INVESTIGATION OF THERMAL PROPERTIES AND TEMPERATURE DISTRIBUTIONS IN THE NANOMETER RANGE
14:20	J. Altet1, A. Rubio1, S. Dilhaire2, E. Schaub2, W. Claeys2 1Univ. Polit. De Catalunya, Barcelona, Spain 2Univ. Bordeaux, France	THERMAL CHARACTERIZATION OF DEFECTS IN AN IC: THERMAL TESTING
14:40	Y. Assouad1, T. Gautier1, J.P. Landesman2, E. Martin2, P. Braun3 1Thomson-CSF, Elancourt, France 2LCR, Orsay, France 3United Monolithic Semiconductors GmbH, Ulm, Germany	TEMPERATURE DISTRIBUTION IN POWER GaAs TRANSISTORS USING SPATIALLY RESOLVED PHOTOLUMINESCENCE MAPPING COMPARED WITH FULL THERMAL MODELLING
15:00	K. Nassim1, L. Joannes1, A. Cornet1, S. Dilhaire2, E. Schaub2, W. Claeys2 1Univ. Louvain-La-Neuve, Belgium 2Univ. Bordeaux, France	HIGH RESOLUTION INTERFEROMETRY (HRI) AND ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI) APPLIED TO THE THERMOMECHANICAL SYUDY OF MOS POWER TRANSISTOR
15:20	J. Lohan, R. Lehtiniemi, P. Rodgers, C.M. Fager, P. Tiilikka, J. Rantala Nokia Research Center, Finland	COMPARISON AND VALIDATION OF DIFFERENT EXPERIMENTAL TECHNIQUES TO MEASURE ELECTRONIC COMPONENT OPERATING JUNCTION TEMPERATURE
15:40 16:20	Special session Chair: V. Székely Techn. Univ. of Budapest, Hungary J. Parry Flomerics Ltd, Surrey, United Kingdom	A FINAL STATUS REPORT ON THE SEED PROJECT: RESULTS AND FUTURE CHALLENGES
16:20 16:30	Closing remarks

Last Updated July 2, 1998.

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