3rd International Workshop on
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES

Aim of the Workshop

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics and microstructures. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. The high element density of MCMs and the mobile parts of microsystems raise newer and newer thermal problems to be solved in the near future. Thermal effects on the other hand can be used as bases of sensors or other functional structures.
The first THERMINIC Workshop was held in Grenoble in 1995. About 90 participants from Europe, the USA and Japan attended 43 presentations. The second THERMINIC Workshop was held in Budapest, September 25-27, 1996. From over 60 submissions, the Programme Committee selected 34 contributions for oral presentation and 15 for poster presentation.

The Programme Committee received 72 submissions this year. 28 contributions have been accepted for oral presentation and 33 for poster presentation. Oral contributions consist of 15 min. presentations followed by 5 min. discussion. The posters will be introduced by one slide in 3 minutes each.

The main topics to be discussed during the Workshop are the following:

• Thermal and Temperature Sensors
• Evaluation of Thermal Measurements
• Thermal Simulation
• Temperature Mapping
• Electro-thermal Simulation
• Thermo-mechanical Effects
• Thermal Modelling and Investigation of Packages
• Reliability Issues
• Further related topics presented on posters.

Last Updated July 29, 1997.

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