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3rd International Workshop on
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES

Workshop Committee

General Chair B. Courtois TIMA Grenoble/France
Vice General Chair M. Rencz TU Budapest/Hungary
Programme Chair V. Székely TU Budapest/Hungary

Programme Committee G. De Mey U. Ghent/Belgium
W. Claeys U. Bordeaux/France
D. Blackburn NIST Gaithersburg/USA
A. Napieralski TU Lodz/Poland
H. Rosten Flomerics/UK
M. Glesner TH Darmstadt/Germany
J.B. Saulnier ENSMA/France
N. Sabry ANACAD/France
A. Ortega U. Arizona/USA
R. Vahrmann TEMIC/Germany
J. Figueras U. Barcelona/Spain
D. Agonafer IBM/USA
C. Lasance Philips/The Netherlands
Y. Zorian LogicVision/USA
J.G. Ferrante Matra Systèmes & Information/France
S. Chew IME/Singapore
M. Esashi U. Tohoku/Japan
K. Kurzweil ISHM/France
D. Esteve LAAS/France
V. Koval TU Lviv/The Ukraine
U. Dillner IPHT/Germany
G.S. Visweswaran IIT/India
H. Jaouen SGS Thomson/France
O. Slattery NMRC/Ireland
T. Jarvinen Nokia/Finland
K. Eshraghian Edith Cowan U./Australia
W. Van Bokhoven Eindhoven U. of Techno/The Netherlands
W. Temmerman Alcatel Telecom/Belgium
E. Fourgeau Analogy/France
G. Gielen KU Leuven/Belgium
J. Rai-Choudhury SPIE/USA

Last Updated August 14, 1997.

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