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3rd International Workshop on
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES

Workshop Programme

Supported by the IEEE Computer Society, Test Technology Technical Committee in cooperation with the THERMINIC CP940922 Copernicus and the BARMINT 8173 ESPRIT Projects and with the European Test Technology Technical Committee and with SPIE, the Society of Photo-Optical Instrumentation Engineers.

Sunday 21st September

14:00 Registration
15:00 Welcome address

B. Courtois
General Chair, TIMA, Grenoble, France

15:10 Opening address

H. Forster
European Commission, Brussels, Belgium

15:20 Invited talk

D. Agonafer
IBM, Poughkeepsie, USA

Chair: H. Forster
European Commission, Brussels, Belgium

APPLICATION OF COMPUTATIONAL FLUID DYNAMICS TO COOLING OF COMPUTER SYSTEMS
16:00 Coffee
16:20 17:40 Session 1

Chair: D. Blackburn
NIST, Gaithersburg, USA

EVALUATION OF THERMAL MEASUREMENTS
16:20 V. Székely, M. Rencz, S. Torok, G. Farkas, Cs. Marta

Techn. Univ. of Budapest, Hungary

ADVANCES IN THE THERMAL TESTING
16:40 V.A. Koval1, S.Y. Yurish2

1State Univ. Lviv Polytechnica, The Ukraine

2Institute of Computer Techn., The Ukraine

PRECISE FREQUENCY METHOD OF MEASUREMENT FOR INTEGRATED FREQUENCY-OUTPUT TEMPERATURE SENSORS
17:00 M. Janicki, M. Zubert, A. Napieralski

Techn. Univ.of Lódz, Poland

APPLICATION OF INVERSE HEAT CONDUCTION PROBLEM SOLUTION WITH ERROR CORRECTION TO ESTIMATION OF IC TEMPERATURE
17:20 Z. Suszynski

Techn. Univ. of Koszalin, Poland

PHOTOACOUSTIC EXAMINATION OF ADHESION IN LAYERED STRUCTURES
17:40 Coffee
18:00

19:20

Poster Session 1

Chair: M. Rencz
Techn. Univ. of Budapest, Hungary


K.O. Petrosjanc, N.I. Rybov

Moscow Univ. of Electr. and Mathematics, Russia

THERMAL RESISTANCE AND CAPACITANCES DETERMINATION FOR ELECTRO-THERMAL CIRCUIT SIMULATION WITH SPICE

W. Wójciak, A. Napieralski, G. Jablonski, T. Poêniak

Techn. Univ. of Lódz, Poland

THERMAL BENCHMARK INTEGRATED CIRCUIT IN BiCMOS TECHNOLOGY

F. Shiwei, X. Xuesong, L. Changzhi

Beijing Polytechnic Univ., PR China

THE NOVEL TEHCHNIQUE OF THERMAL MEASUREMENT FOR SEMICONDUCTOR DEVICE BY ELECTRICAL METHOD

N.M. Ravindra1, O.H. Gokce1, F.M. Tong1, S. Abedrabbo1, V. Rajasekhar1, A. Patel1, G. Williamson2, W. Maszara2, A. Nanda2, T. Speranza2

1New Jersey Inst. of Techno., Newark, USA

2SEMATECH, Austin, USA

TEMPERATURE AND WAVELENGTH DEPENDENT EMISSIVITY OF SIMOX

Z. Suszynski

Techn. Univ. of Koszalin, Poland

THE MEASUREMENT METHOD OF THE OPTICALLY NON-OPAQUE MATERIALS THERMAL PARAMETERS

I. Stoian, P. Ungureanu, L. Cipcigan, C. Buduru

IPA CLUJ, Cluj-Napoca, Romania

SYSTEM FOR TEMPERATURE MAPPING AND EVALUATION OF THE ENERGIZED HYBRID ICs AND IMICROPROCESSORS

V. Székely, Cs. Marta, M. Rencz, G. Vegh, Zs. Benedek, S. Torok

Techn. Univ. of Budapest, Hungary

THERMAL BENCHMARK CIRCUIT

A.G. Madera

Russia Academy of Science, Moscow, Russia

ANALYSIS AND COMPUTATION OF ACTUAL TEMPERATURE FIELDS IN ICs AND ELECTRON MODULES

W. Pawelski, A. Napieralski, M. Grecki

Techn. Univ. of Lódz, Poland

THE IGBT CIRCUIT-ORIENTED ISOTHERMIC MODEL

M. Wiklund

Lund Univ., Sweden

CALCULATION OF REAL POWER FLOW FROM A MOS TRANSISTOR MODEL

Z. Lisik, J. Podgórski, M. Kaluza, M. Kopec

Techn. Univ. of Lódz, Poland

3-D SIMULATOR OF HEAT TRANSFER IN SEMICONDUCTORS DEVICES


V.A. Koval, D.V. Fedasyuk, I.Y. Kazymyra, M.B. Blyzniuk

State Univ. Lviv Polytechnic, The Ukraine

PROVIDING OF ELECTRO-THERMAL COMPATIBILITY OF HYBRID MICROCIRCUITS IN CAD ENVIRONMENT

J. Akhtar

CEERI, Pilani, India

A QUANTITATIVE STUDY FOR OPTIMISATION OF DISCRETISING AND OVER-RELAXATION PARAMETERS IN THE FINITE-DIFFERENCE SOLUTION OF TRANSIENT HEAT FLOW EQUATION

E. Lavitska

State Univ. Lviv Polytechnic, The Ukraine

TEMPERATURE-DEPENDENT STRAIN OF SEMICONDUCTOR ELEMENTS AND ITS TECHNICAL APPLICATIONS

J. Coughlan, S. Foley, A. Mathewson

NMRC, Cork, Ireland

THE DISTRIBUTION OF STRESS IN TUNGSTEN-FILLED VIA STRUCTURES - INVESTIGATIONS USING FINITE ELEMENT ANALYSIS

A. Druzhinin, E. Lavitska, I. Maryamova, Y. Pankov, V. Voronin

State Univ. Lviv Polytechnic, The Ukraine

INFLUENCE OF THERMAL STRESSES ON TEMPERATURE-DEPENDENT CHARACTERISTICS OF SEMICONDUCTOR FILM RESISTORS
19:30 Reception

Monday 22nd September

08:40

11:00

Session 2

Chair: J. Parry
Flomerics Ltd, Surrey, United Kingdom

THERMAL AND ELECTRO-THERMAL MODELLING AND SIMULATION
8:40 P.E. Raad1, J.S. Wilson2, D.C. Price2

1Southern Methodist Univ., Dallas, USA

2Texas Instruments, Dallas, USA

ADAPTIVE MODELING OF THE TRANSIENTS OF SUBMICRON INTEGRATED CIRCUITS
9:00 V.Székely

Techn. Univ. of Budapest, Hungary

SUNRED: A NEW THERMAL SIMULATOR AND TYPICAL APPLICATIONS
9:20 F. Christiaens1, B. Vandevelde1, E. Beyne1, J. Roggen1, R. Mertens1, J. Van Puymbroeck2, M. Heerman2, J. Berghmans3

1IMEC vzw, Leuven, Belgium

2Siemens LPT, Oostkamp, Belgium

3KU Leuven, Belgium

THERMAL MODELLING OF THE POLYMER STUD GRID ARRAY (PSGATM) STEADY-STATE ANALYSIS
9:40 T. Veijola, L. Costa, M. Valtonen

Helsinki Univ. of Techn., Finland

AN IMPLEMENTATION OF ELECTROTHERMAL COMPONENT MODELS IN A GENERAL PURPOSE CIRCUIT SIMULATION PROGRAM
10:00 S. Nooshabadi1, G.S. Visweswran2, D. Nagchoudhuri2, K. Eshraghian3

1Northern Territory Univ., Australia

2India Institute of Techn. - N.Delhi, India

3Edith Cowan Univ., Australia

MODELLING OF THE MOS TRANSISTOR WITH SPATIALLY NON-UNIFORM TEMPERATURE PROFILE
10:20 S. Rzepka1, K. Banerjee2, C. Hu2

1Techn. Univ. of Dresden, Germany

2 Univ. of California, Berkeley, USA

CHARACTERIZATION OF SELF-HEATING IN ADVANCED VLSI INTERCONNECT LINES BASED ON THERMAL FINITE ELEMENT SIMULATION
10:40 D. de Cogan

Univ. of East Anglia, United Kingdom

PROPAGATION ANALYSIS FOR THERMAL MODELLING
11:00 Coffee
11:20

12:20

Vendor presentations
12:30 Lunch
14:00

16:00

Free time
16:00

17:20

Session 3

Chair: A. Ortega
Univ. of Arizona, USA

TEMPERATURE MAPPING
16:00

B.C. Forget1, S. Grauby1, D. Fournier1, P. Gleyzes1, A.C. Boccara1, A.M. Mansanares2

1ESPCI, Paris, France

2DEQ-IFGW-UNICAMP, Campinas, Brazil

50 kHz MODULATED PHOTOTHERMAL MICROSCOPIC RESOLUTION IMAGING USING A 256x256 PIXELS CAMERA COUPLED TO A MULTICHANNEL LOCK-IN DETECTION
16:20 G. Breglio1, S. Pica2, S. Spirito1, A. Tartaglia1

1Univ. of Napoli "Federico II", Italy

2Ansaldo Trasporti, Napoli, Italy

EXPERIMENTAL DETECTION OF TIME DEPENDENT TEMPERATURE MAPS IN POWER BIPOLAR TRANSISTORS
16:40 J.A. Batista1, A.M. Mansanares1, E.C. da Silva1, M.B.C. Pimentel2, N. Jannuzzi2, D. Fournier3

1Univ. Estadual de Campinas, Brazil

2Institut de Microeletrônica, Campinas, Brazil

3UPMC, Paris, France

SUBSURFACE MICROSCOPY OF BIASED MOS-FET STRUCTURES: PHOTOTHERMAL AND ELECTROREFLECTANCE IMAGES
17:00 O. Breitenstein, M. Langenkamp

Max-Planck Institut für Mikrostrukturphysik Halle, Germany

LOCK-IN CONTACT THERMOGRAPHY INVESTIGATION OF LATERAL ELECTRONIC INHOMOGENEITIES IN SEMICONDUCTOR DEVICES
17:20 Coffee
18:00

19:00

Poster Session 2

Chair: M. Rencz
Techn. Univ. of Budapest, Hungary


P. Dupuy, K. Bellil, P. Tounsi, J.M. Dorkel

LAAS, Toulouse, France

THERMAL AND ELECTROTHERMAL SIMULATION OF INTEGRATED POWER CIRCUITS USING SMODTHERM SOFTWARE

V. Székely, M. Rencz, A. Poppe, A. Pahi, G. Hajas, L. Liptak-Fego

Techn. Univ. of Budapest, Hungary

UNCOVERING THERMALLY INDUCED BEHAVIOR OF ANALOG AND DIGITAL CIRCUITS WITH THE SISSI SIMULATION PACKAGE

M. Wiklund

Lund Univ., Sweden

ELECTRO-THERMAL SIMULATION USING WAVEFORM RELAXATION

W. Wójciak, M. Orlikowski, M. Zubert, A. Napieralski

Techn. Univ. of Lódz, Poland

THE DESIGN AND ELECTRO-THERMAL MODELING OF MICRODEVICES IN CMOS COMPATIBLE MEMS TECHNOLOGY

D. Allal, B. Bocquet

IEMN, Lille, France

THERMOMETRIC MICRO-SENSOR BASED ON MICROWAVE CORRELATION RADIOMETRY

K. Somogyi, G. Sáfrán

Hungarian Academy of Sciences, Budapest, Hungary

FIRST ORDER PHASE TRANSITION FOR CRITICAL TEMPERATURE DETECTION

C. S. Roumenin, A. Ivanov, P. Nikilova

Bulgarian Academy of Sciences, Sofia, Bulgaria

A LINEAR MICROSENSOR FOR TEMPERATURE AND MAGNETIC FIELD USING FUNCTIONAL PRINCIPLE

J. Verkelis1, Z. Bliznikas2, K. Breive2, V.Dikinis3, R. .armaitis3

1Semiconductor Physics Institute, Vilnius, Lithuania

2Institute of Materials Science and Applied Research of Vilnius University, Lithuania

3Institute of Chemistry, Vilnius, Lithuania

VO2THIN FILM FIXED TEMPERATURE HEAT SENSOR HAVING ACCIDENT MEMORY

M.J. Marongiu1, A. Watwe2, B. Kusha2

1MJM Engineering Co., Naperville, USA

2Fluent Inc., Evanston, USA

STUDIES ON THE ENHANCEMENT OF MICROCHANNEL HEAT SINKS WITH MICRO-HEAT PIPES AND OTHER HIGH THERMAL CONDUCTIVTY MATERIALS

A.K. Stubos

NCSR Demokritos, Attikis, Greece

THEORETICAL EVIDENCE AND CONCEPTUAL DESIGN FOR ENHANCED COOLING OF ELECTRONIC COMPONENTS VIA BOILING IN POROUS LAYERS

K. Chung

AI Technology, Inc., Princeton, USA

COMPARATIVE THERMAL MANAGEMENT WITH THERMAL GREASES, GASKETS, AND "PHASE-CHANGE PADS"

P. Dziurdzia, P. Bratek, A. Kos

Univ. of Mining and Metallurgy, Krakow, Poland

POWER FEEDBACK FOR TEMPERATURE CONTROL OF ICs

K. Madani1, G. deTremiolles1&2

1Univ. Paris XII/LERISS, Lieusaint, France

2IBM, Corbeil Essonnes, France

GLOBAL PERTURBATIONS EFFECTS ANALYSIS IN A CMOS ANALOGUE IMPLEMENTATION OF SYNCHRONOUS BOLTZMANN MACHINE

A. Merticaru, N. Moldovan, M. Ilie

Institute of Microtechnology, Bucharest, Romania

THE THERMAL MICROSHIELD OBTAINED BY ANISOTROPIC ETCHING OF SILICON WAFERS

K. Somogyi

Hungarian Academy of Sciences, Budapest, Hungary

SOME CRITICAL CONDITIONS OF THE THERMAL BREAKDOWN IN SEMICONDUCTORS

F. P. Shih, T.Y. Wu, CH.H. Chen, T.L. Sung, C.Y. Tsai

De Montfort Univ., Leicester, United Kingdom

EFFECTS OF NONEQUILIBRIUM LO PHONONS ON THE CARRIER HEATING IN SEMICONDUCTOR QUANTUM-WELL LASERS

A. Belache1, T. Gautier1, J.C. de Jaeger2, M. Lefebvre2, G. Salmer2

1Thomson-CSF, Elancourt, France

2IEMN, Lille, France

ELECTRO-THERMAL INVESTIGATIONS OF GaAs MESFETs
19:00 Banquet
20:30

22:00

PANEL

Moderator: T. Williams
IBM, Boulder, USA

THERMAL MANAGEMENT: A LONELY FIGHT OR CONCURRENT ENGINEERING ?

Panelists:

D. Agonafer, IBM, Poughkeepsie, USA

G. De Mey, University of Ghent, Belgium

G. Kromann, Motorola, Austin, USA

N. Sabry, Anacad/Mentor Graphics, Meylan, France

T. Tarter, AMD, Sunnyvale, USA

The panel intends to put together experts from various disciplines in connection with thermal issues like circuit design, testing, packaging, cooling, thermal management education, etc., in order to discuss to which extent the thermal issues in microelectronics may or may not be treated independently today and in the near future.

Tuesday 23rd September

09:00 Invited talk

A. Majumdar
Univ. of California, Berkeley, USA

Chair: V. Székely
Techn. Univ. of Budapest, Hungary

HIGH-RESOLUTION THERMAL IMAGING OF ELECTRONIC DEVICES AND INTERCONNECTS
09:40 Coffee
10:00

12:00

Session 4

Chair: Y. Zorian
LogicVision, Princeton, USA

SENSORS AND ACTUATORS
10:00 R.A. Bianchi, F.V. Santos, J.M. Karam, B. Courtois

TIMA, Grenoble, France

CMOS COMPATIBLE TEMPERATURE SENSOR USING LATERAL BIPOLAR TRANSISTOR FOR VERY WIDE TEMPERATURE RANGE APPLICATIONS
10:20 U. Dillner, E. Kessler, V. Baier, R. Güttich, J.Müller

IPHT, Jena, Germany

THERMAL SIMULATION OF MICROMACHINED LINEAR THERMOPILE INFRARED RADIATION SENSOR ARRAYS
10:40 T. Sokoll, V. Norkus, G. Gerlach

Techn. Univ. of Dresden, Germany

THERMAL AND SPATIAL RESOLUTION OF PYROELECTRIC LINEAR ARRAYS
11:00 J.I. Hayasaka, M. Kimura

Tohoku-Gakuin Univ., Miyagi, Japan

PROPOSAL OF AN ULTRAMINIATURIZED THERMAL ANALYSER
11:20 P.R. van der Meer, G.C.M. Meijer, M.J. Vellekoop, H.M.M. Kerkvliet

Delft Univ. of Techno., The Netherlands

A LOW-COST TEMPERATURE-CONTROL SYSTEM FOR SURFACE ACOUSTIC WAVE GAS SENSORS USING SMART TEMPERATURE SENSORS
11:40 G. Cocorullo1&2, F.G. Della Corte1, I. Rendina1

1CNR IRECE, Napoli, Italy

2Univ. della Calabria, Rende, Italy

ALL-SILICON THERMO-OPTIC MICRO-SWITCHES REALIZED BY VLSI TECHNOLOGY
12:15 Lunch
14:00

15:40

Session 5

Chair: W. Claeys
Univ. Bordeaux I, Talence, France

MEASURING THERMAL MATERIAL PARAMETERS
14:00 S. Dilhaire, T. Phan, E. Schaub, W. Claeys

Univ. Bordeaux I, Talence, France

THERMOMECHANICAL STUDIES OF MICROELECTRONIC INTERCONNECTS BY DIFFERENTIAL INTERFEROMETRY
14:20 B. Bonello, B. Perrin, C. Rossignol

Univ. P. & M. Curie, Paris, France

THERMAL PROPERTIES OF SUB-MICROMETER NANOSTRUCTURES IN THE PICOSECOND REGIME
14:40 M. Malinski, L. Bychto

Techn. Univ. of Koszalin, Poland

PHOTOACOUSTIC METHODS OF DETERMINATIONS OF THERMAL PARAMETERS OF ELECTRONIC MATERIALS
15:00 K. Kurabayashi, K.E. Goodson

Stanford Univ., USA

MEASUREMENT OF THE ANISOTROPIC THERMAL CONDUCTIVITY IN POLYMER THIN FILMS FOR LOW-DIELECTRIC-CONSTANT PASSIVATION
15:20 V.V. Luchinin, A.V. Korlyakov

St. Petersburg Electr. Univ., Russia

THE SILICON CARBIDE-ON-INSULATOR STRUCTURE AS A SUBJECT OF THERMAL INVESTIGATIONS
15:40

16:20

Special Session: DELPHI/SEED

Chair: V. Székely
Techn. Univ. of Budapest, Hungary

This special session is dedicated to Harvey Rosten, coordinator of the DELPHI project, who died in June this year. He will be remembered for his many contributions to the industry, and particularly his work on the compact modelling of packages


J. Parry, H. Rosten

Flomerics Ltd, Surrey, United Kingdom

AN UPDATE ON THE INDUSTRIAL EVALUATION OF THE DELPHI RESULTS AND THE PERFORMANCE OF DELPHI COMPACT MODELS
16:20

16:30

Closing remarks

Last Updated August 19, 1997.

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