3rd International Workshop on
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES

Sunday 21st September
14:00	Registration
15:00	Welcome address B. Courtois General Chair, TIMA, Grenoble, France
15:10	Opening address H. Forster European Commission, Brussels, Belgium
15:20	Invited talk D. Agonafer IBM, Poughkeepsie, USA Chair: H. Forster European Commission, Brussels, Belgium	APPLICATION OF COMPUTATIONAL FLUID DYNAMICS TO COOLING OF COMPUTER SYSTEMS
16:00	Coffee
16:20 17:40	Session 1 Chair: D. Blackburn NIST, Gaithersburg, USA	EVALUATION OF THERMAL MEASUREMENTS
16:20	V. Székely, M. Rencz, S. Torok, G. Farkas, Cs. Marta Techn. Univ. of Budapest, Hungary	ADVANCES IN THE THERMAL TESTING
16:40	V.A. Koval1, S.Y. Yurish2 1State Univ. Lviv Polytechnica, The Ukraine 2Institute of Computer Techn., The Ukraine	PRECISE FREQUENCY METHOD OF MEASUREMENT FOR INTEGRATED FREQUENCY-OUTPUT TEMPERATURE SENSORS
17:00	M. Janicki, M. Zubert, A. Napieralski Techn. Univ.of Lódz, Poland	APPLICATION OF INVERSE HEAT CONDUCTION PROBLEM SOLUTION WITH ERROR CORRECTION TO ESTIMATION OF IC TEMPERATURE
17:20	Z. Suszynski Techn. Univ. of Koszalin, Poland	PHOTOACOUSTIC EXAMINATION OF ADHESION IN LAYERED STRUCTURES
17:40	Coffee
18:00 19:20	Poster Session 1 Chair: M. Rencz Techn. Univ. of Budapest, Hungary
	K.O. Petrosjanc, N.I. Rybov Moscow Univ. of Electr. and Mathematics, Russia	THERMAL RESISTANCE AND CAPACITANCES DETERMINATION FOR ELECTRO-THERMAL CIRCUIT SIMULATION WITH SPICE
	W. Wójciak, A. Napieralski, G. Jablonski, T. Poêniak Techn. Univ. of Lódz, Poland	THERMAL BENCHMARK INTEGRATED CIRCUIT IN BiCMOS TECHNOLOGY
	F. Shiwei, X. Xuesong, L. Changzhi Beijing Polytechnic Univ., PR China	THE NOVEL TEHCHNIQUE OF THERMAL MEASUREMENT FOR SEMICONDUCTOR DEVICE BY ELECTRICAL METHOD
	N.M. Ravindra1, O.H. Gokce1, F.M. Tong1, S. Abedrabbo1, V. Rajasekhar1, A. Patel1, G. Williamson2, W. Maszara2, A. Nanda2, T. Speranza2 1New Jersey Inst. of Techno., Newark, USA 2SEMATECH, Austin, USA	TEMPERATURE AND WAVELENGTH DEPENDENT EMISSIVITY OF SIMOX
	Z. Suszynski Techn. Univ. of Koszalin, Poland	THE MEASUREMENT METHOD OF THE OPTICALLY NON-OPAQUE MATERIALS THERMAL PARAMETERS
	I. Stoian, P. Ungureanu, L. Cipcigan, C. Buduru IPA CLUJ, Cluj-Napoca, Romania	SYSTEM FOR TEMPERATURE MAPPING AND EVALUATION OF THE ENERGIZED HYBRID ICs AND IMICROPROCESSORS
	V. Székely, Cs. Marta, M. Rencz, G. Vegh, Zs. Benedek, S. Torok Techn. Univ. of Budapest, Hungary	THERMAL BENCHMARK CIRCUIT
	A.G. Madera Russia Academy of Science, Moscow, Russia	ANALYSIS AND COMPUTATION OF ACTUAL TEMPERATURE FIELDS IN ICs AND ELECTRON MODULES
	W. Pawelski, A. Napieralski, M. Grecki Techn. Univ. of Lódz, Poland	THE IGBT CIRCUIT-ORIENTED ISOTHERMIC MODEL
	M. Wiklund Lund Univ., Sweden	CALCULATION OF REAL POWER FLOW FROM A MOS TRANSISTOR MODEL
	Z. Lisik, J. Podgórski, M. Kaluza, M. Kopec Techn. Univ. of Lódz, Poland	3-D SIMULATOR OF HEAT TRANSFER IN SEMICONDUCTORS DEVICES
	V.A. Koval, D.V. Fedasyuk, I.Y. Kazymyra, M.B. Blyzniuk State Univ. Lviv Polytechnic, The Ukraine	PROVIDING OF ELECTRO-THERMAL COMPATIBILITY OF HYBRID MICROCIRCUITS IN CAD ENVIRONMENT
	J. Akhtar CEERI, Pilani, India	A QUANTITATIVE STUDY FOR OPTIMISATION OF DISCRETISING AND OVER-RELAXATION PARAMETERS IN THE FINITE-DIFFERENCE SOLUTION OF TRANSIENT HEAT FLOW EQUATION
	E. Lavitska State Univ. Lviv Polytechnic, The Ukraine	TEMPERATURE-DEPENDENT STRAIN OF SEMICONDUCTOR ELEMENTS AND ITS TECHNICAL APPLICATIONS
	J. Coughlan, S. Foley, A. Mathewson NMRC, Cork, Ireland	THE DISTRIBUTION OF STRESS IN TUNGSTEN-FILLED VIA STRUCTURES - INVESTIGATIONS USING FINITE ELEMENT ANALYSIS
	A. Druzhinin, E. Lavitska, I. Maryamova, Y. Pankov, V. Voronin State Univ. Lviv Polytechnic, The Ukraine	INFLUENCE OF THERMAL STRESSES ON TEMPERATURE-DEPENDENT CHARACTERISTICS OF SEMICONDUCTOR FILM RESISTORS
19:30	Reception
Monday 22nd September
08:40 11:00	Session 2 Chair: J. Parry Flomerics Ltd, Surrey, United Kingdom	THERMAL AND ELECTRO-THERMAL MODELLING AND SIMULATION
8:40	P.E. Raad1, J.S. Wilson2, D.C. Price2 1Southern Methodist Univ., Dallas, USA 2Texas Instruments, Dallas, USA	ADAPTIVE MODELING OF THE TRANSIENTS OF SUBMICRON INTEGRATED CIRCUITS
9:00	V.Székely Techn. Univ. of Budapest, Hungary	SUNRED: A NEW THERMAL SIMULATOR AND TYPICAL APPLICATIONS
9:20	F. Christiaens1, B. Vandevelde1, E. Beyne1, J. Roggen1, R. Mertens1, J. Van Puymbroeck2, M. Heerman2, J. Berghmans3 1IMEC vzw, Leuven, Belgium 2Siemens LPT, Oostkamp, Belgium 3KU Leuven, Belgium	THERMAL MODELLING OF THE POLYMER STUD GRID ARRAY (PSGATM) STEADY-STATE ANALYSIS
9:40	T. Veijola, L. Costa, M. Valtonen Helsinki Univ. of Techn., Finland	AN IMPLEMENTATION OF ELECTROTHERMAL COMPONENT MODELS IN A GENERAL PURPOSE CIRCUIT SIMULATION PROGRAM
10:00	S. Nooshabadi1, G.S. Visweswran2, D. Nagchoudhuri2, K. Eshraghian3 1Northern Territory Univ., Australia 2India Institute of Techn. - N.Delhi, India 3Edith Cowan Univ., Australia	MODELLING OF THE MOS TRANSISTOR WITH SPATIALLY NON-UNIFORM TEMPERATURE PROFILE
10:20	S. Rzepka1, K. Banerjee2, C. Hu2 1Techn. Univ. of Dresden, Germany 2 Univ. of California, Berkeley, USA	CHARACTERIZATION OF SELF-HEATING IN ADVANCED VLSI INTERCONNECT LINES BASED ON THERMAL FINITE ELEMENT SIMULATION
10:40	D. de Cogan Univ. of East Anglia, United Kingdom	PROPAGATION ANALYSIS FOR THERMAL MODELLING
11:00	Coffee
11:20 12:20	Vendor presentations
12:30	Lunch
14:00 16:00	Free time
16:00 17:20	Session 3 Chair: A. Ortega Univ. of Arizona, USA	TEMPERATURE MAPPING
16:00	B.C. Forget1, S. Grauby1, D. Fournier1, P. Gleyzes1, A.C. Boccara1, A.M. Mansanares2 1ESPCI, Paris, France 2DEQ-IFGW-UNICAMP, Campinas, Brazil	50 kHz MODULATED PHOTOTHERMAL MICROSCOPIC RESOLUTION IMAGING USING A 256x256 PIXELS CAMERA COUPLED TO A MULTICHANNEL LOCK-IN DETECTION
16:20	G. Breglio1, S. Pica2, S. Spirito1, A. Tartaglia1 1Univ. of Napoli "Federico II", Italy 2Ansaldo Trasporti, Napoli, Italy	EXPERIMENTAL DETECTION OF TIME DEPENDENT TEMPERATURE MAPS IN POWER BIPOLAR TRANSISTORS
16:40	J.A. Batista1, A.M. Mansanares1, E.C. da Silva1, M.B.C. Pimentel2, N. Jannuzzi2, D. Fournier3 1Univ. Estadual de Campinas, Brazil 2Institut de Microeletrônica, Campinas, Brazil 3UPMC, Paris, France	SUBSURFACE MICROSCOPY OF BIASED MOS-FET STRUCTURES: PHOTOTHERMAL AND ELECTROREFLECTANCE IMAGES
17:00	O. Breitenstein, M. Langenkamp Max-Planck Institut für Mikrostrukturphysik Halle, Germany	LOCK-IN CONTACT THERMOGRAPHY INVESTIGATION OF LATERAL ELECTRONIC INHOMOGENEITIES IN SEMICONDUCTOR DEVICES
17:20	Coffee
18:00 19:00	Poster Session 2 Chair: M. Rencz Techn. Univ. of Budapest, Hungary
	P. Dupuy, K. Bellil, P. Tounsi, J.M. Dorkel LAAS, Toulouse, France	THERMAL AND ELECTROTHERMAL SIMULATION OF INTEGRATED POWER CIRCUITS USING SMODTHERM SOFTWARE
	V. Székely, M. Rencz, A. Poppe, A. Pahi, G. Hajas, L. Liptak-Fego Techn. Univ. of Budapest, Hungary	UNCOVERING THERMALLY INDUCED BEHAVIOR OF ANALOG AND DIGITAL CIRCUITS WITH THE SISSI SIMULATION PACKAGE
	M. Wiklund Lund Univ., Sweden	ELECTRO-THERMAL SIMULATION USING WAVEFORM RELAXATION
	W. Wójciak, M. Orlikowski, M. Zubert, A. Napieralski Techn. Univ. of Lódz, Poland	THE DESIGN AND ELECTRO-THERMAL MODELING OF MICRODEVICES IN CMOS COMPATIBLE MEMS TECHNOLOGY
	D. Allal, B. Bocquet IEMN, Lille, France	THERMOMETRIC MICRO-SENSOR BASED ON MICROWAVE CORRELATION RADIOMETRY
	K. Somogyi, G. Sáfrán Hungarian Academy of Sciences, Budapest, Hungary	FIRST ORDER PHASE TRANSITION FOR CRITICAL TEMPERATURE DETECTION
	C. S. Roumenin, A. Ivanov, P. Nikilova Bulgarian Academy of Sciences, Sofia, Bulgaria	A LINEAR MICROSENSOR FOR TEMPERATURE AND MAGNETIC FIELD USING FUNCTIONAL PRINCIPLE
	J. Verkelis1, Z. Bliznikas2, K. Breive2, V.Dikinis3, R. .armaitis3 1Semiconductor Physics Institute, Vilnius, Lithuania 2Institute of Materials Science and Applied Research of Vilnius University, Lithuania 3Institute of Chemistry, Vilnius, Lithuania	VO2THIN FILM FIXED TEMPERATURE HEAT SENSOR HAVING ACCIDENT MEMORY
	M.J. Marongiu1, A. Watwe2, B. Kusha2 1MJM Engineering Co., Naperville, USA 2Fluent Inc., Evanston, USA	STUDIES ON THE ENHANCEMENT OF MICROCHANNEL HEAT SINKS WITH MICRO-HEAT PIPES AND OTHER HIGH THERMAL CONDUCTIVTY MATERIALS
	A.K. Stubos NCSR Demokritos, Attikis, Greece	THEORETICAL EVIDENCE AND CONCEPTUAL DESIGN FOR ENHANCED COOLING OF ELECTRONIC COMPONENTS VIA BOILING IN POROUS LAYERS
	K. Chung AI Technology, Inc., Princeton, USA	COMPARATIVE THERMAL MANAGEMENT WITH THERMAL GREASES, GASKETS, AND "PHASE-CHANGE PADS"
	P. Dziurdzia, P. Bratek, A. Kos Univ. of Mining and Metallurgy, Krakow, Poland	POWER FEEDBACK FOR TEMPERATURE CONTROL OF ICs
	K. Madani1, G. deTremiolles1&2 1Univ. Paris XII/LERISS, Lieusaint, France 2IBM, Corbeil Essonnes, France	GLOBAL PERTURBATIONS EFFECTS ANALYSIS IN A CMOS ANALOGUE IMPLEMENTATION OF SYNCHRONOUS BOLTZMANN MACHINE
	A. Merticaru, N. Moldovan, M. Ilie Institute of Microtechnology, Bucharest, Romania	THE THERMAL MICROSHIELD OBTAINED BY ANISOTROPIC ETCHING OF SILICON WAFERS
	K. Somogyi Hungarian Academy of Sciences, Budapest, Hungary	SOME CRITICAL CONDITIONS OF THE THERMAL BREAKDOWN IN SEMICONDUCTORS
	F. P. Shih, T.Y. Wu, CH.H. Chen, T.L. Sung, C.Y. Tsai De Montfort Univ., Leicester, United Kingdom	EFFECTS OF NONEQUILIBRIUM LO PHONONS ON THE CARRIER HEATING IN SEMICONDUCTOR QUANTUM-WELL LASERS
	A. Belache1, T. Gautier1, J.C. de Jaeger2, M. Lefebvre2, G. Salmer2 1Thomson-CSF, Elancourt, France 2IEMN, Lille, France	ELECTRO-THERMAL INVESTIGATIONS OF GaAs MESFETs
19:00	Banquet
20:30 22:00	PANEL Moderator: T. Williams IBM, Boulder, USA	THERMAL MANAGEMENT: A LONELY FIGHT OR CONCURRENT ENGINEERING ?
	Panelists: D. Agonafer, IBM, Poughkeepsie, USA G. De Mey, University of Ghent, Belgium G. Kromann, Motorola, Austin, USA N. Sabry, Anacad/Mentor Graphics, Meylan, France T. Tarter, AMD, Sunnyvale, USA	The panel intends to put together experts from various disciplines in connection with thermal issues like circuit design, testing, packaging, cooling, thermal management education, etc., in order to discuss to which extent the thermal issues in microelectronics may or may not be treated independently today and in the near future.
Tuesday 23rd September
09:00	Invited talk A. Majumdar Univ. of California, Berkeley, USA Chair: V. Székely Techn. Univ. of Budapest, Hungary	HIGH-RESOLUTION THERMAL IMAGING OF ELECTRONIC DEVICES AND INTERCONNECTS
09:40	Coffee
10:00 12:00	Session 4 Chair: Y. Zorian LogicVision, Princeton, USA	SENSORS AND ACTUATORS
10:00	R.A. Bianchi, F.V. Santos, J.M. Karam, B. Courtois TIMA, Grenoble, France	CMOS COMPATIBLE TEMPERATURE SENSOR USING LATERAL BIPOLAR TRANSISTOR FOR VERY WIDE TEMPERATURE RANGE APPLICATIONS
10:20	U. Dillner, E. Kessler, V. Baier, R. Güttich, J.Müller IPHT, Jena, Germany	THERMAL SIMULATION OF MICROMACHINED LINEAR THERMOPILE INFRARED RADIATION SENSOR ARRAYS
10:40	T. Sokoll, V. Norkus, G. Gerlach Techn. Univ. of Dresden, Germany	THERMAL AND SPATIAL RESOLUTION OF PYROELECTRIC LINEAR ARRAYS
11:00	J.I. Hayasaka, M. Kimura Tohoku-Gakuin Univ., Miyagi, Japan	PROPOSAL OF AN ULTRAMINIATURIZED THERMAL ANALYSER
11:20	P.R. van der Meer, G.C.M. Meijer, M.J. Vellekoop, H.M.M. Kerkvliet Delft Univ. of Techno., The Netherlands	A LOW-COST TEMPERATURE-CONTROL SYSTEM FOR SURFACE ACOUSTIC WAVE GAS SENSORS USING SMART TEMPERATURE SENSORS
11:40	G. Cocorullo1&2, F.G. Della Corte1, I. Rendina1 1CNR IRECE, Napoli, Italy 2Univ. della Calabria, Rende, Italy	ALL-SILICON THERMO-OPTIC MICRO-SWITCHES REALIZED BY VLSI TECHNOLOGY
12:15	Lunch
14:00 15:40	Session 5 Chair: W. Claeys Univ. Bordeaux I, Talence, France	MEASURING THERMAL MATERIAL PARAMETERS
14:00	S. Dilhaire, T. Phan, E. Schaub, W. Claeys Univ. Bordeaux I, Talence, France	THERMOMECHANICAL STUDIES OF MICROELECTRONIC INTERCONNECTS BY DIFFERENTIAL INTERFEROMETRY
14:20	B. Bonello, B. Perrin, C. Rossignol Univ. P. & M. Curie, Paris, France	THERMAL PROPERTIES OF SUB-MICROMETER NANOSTRUCTURES IN THE PICOSECOND REGIME
14:40	M. Malinski, L. Bychto Techn. Univ. of Koszalin, Poland	PHOTOACOUSTIC METHODS OF DETERMINATIONS OF THERMAL PARAMETERS OF ELECTRONIC MATERIALS
15:00	K. Kurabayashi, K.E. Goodson Stanford Univ., USA	MEASUREMENT OF THE ANISOTROPIC THERMAL CONDUCTIVITY IN POLYMER THIN FILMS FOR LOW-DIELECTRIC-CONSTANT PASSIVATION
15:20	V.V. Luchinin, A.V. Korlyakov St. Petersburg Electr. Univ., Russia	THE SILICON CARBIDE-ON-INSULATOR STRUCTURE AS A SUBJECT OF THERMAL INVESTIGATIONS
15:40 16:20	Special Session: DELPHI/SEED Chair: V. Székely Techn. Univ. of Budapest, Hungary	This special session is dedicated to Harvey Rosten, coordinator of the DELPHI project, who died in June this year. He will be remembered for his many contributions to the industry, and particularly his work on the compact modelling of packages
	J. Parry, H. Rosten Flomerics Ltd, Surrey, United Kingdom	AN UPDATE ON THE INDUSTRIAL EVALUATION OF THE DELPHI RESULTS AND THE PERFORMANCE OF DELPHI COMPACT MODELS
16:20 16:30	Closing remarks