12th International Workshop on
THERMAL INVESTIGATIONS of ICs and SYSTEMS
27-29 September 2006, Nice,
Côte d'Azur, France.
Program Schedule
Wednesday 27 September 2006
08:00–09:30 Registration & Welcome Coffee
09:30–09:40 Welcome Address
Chair: Bernard Courtois, TIMA Labs, Grenoble, France
09:40-10:20 Invited Talk I: ENABLING ELECTRONIC PROGNOSTICS USING THERMAL DATA
Michael Pecht, CALCE Electronic Products and Systems Center, U. of Maryland, College Park, USA
Chair: Clemens Lasance, Philips Research Laboratories, Eindhoven, The Netherlands
10:20-11:40 Session 1: TEMPERATURE MEASUREMENTS
Chair: Gilbert De Mey, Ghent U., Belgium
   10:20 [1007] - THERMAL PROPERTIES OF HIGH POWER LASER BARS INVESTIGATED BY THERMOREFLECTANCE AND MICRO-RAMAN SPECTROSCOPY
Dorota Pierscinska, Kamil Pierscinski, Tomasz Ochalski, Maciej Bugajski, Institute of Electron Technology, Poland
Jens W. Tomm, Max Born Institute, Germany
   10:40 [1055] - CCD THERMOREFLECTANCE THERMOGRAPHY SYSTEM: METHODOLOGY AND EXPERIMENTAL VALIDATION
Pavel Komarov, Mihai Burzo, Peter Raad, Southern Methodist U., Dallas, USA
   11:00 [1021] - -55°C TO 170°C HIGH LINEAR VOLTAGE REFERENCES CIRCUITRY IN 0.18µM CMOS TECHNOLOGY
Joseph Tzuo-sheng Tsai, Herming Chiueh, National Chiao Tung U., Taiwan
   11:20 [1046] - TEMPERATURE MEASUREMENT IN THE INTEL® CORETM DUO PROCESSOR
Efraim Rotem, Aviad Cohen, Harel Cain, Intel, Haifa, Israel
11:40     Coffee Break
12:00-13:00 POSTER INTRODUCTION SESSION
Chair: Márta Rencz, Budapest U. of Technology and Economics, Hungary

The posters will be introduced by one slide in maximum 3 minutes each.
   12:00 [1001] - REDUCING THE POSSIBILITY OF SUBJECTIVE ERROR IN THE DETERMINATION OF THE STRUCTURE-FUNCTION-BASED EFFECTIVE THERMAL CONDUCTIVITY OF PCBS
Erno Kollar, BUTE, Hungary
   12:03 [1015] - THE APPLICATION OF ARTIFICIAL NEURAL NETWORK FOR THE ASSESSMENT OF THERMAL PROPERTIES OF MULTI-LAYER SEMICONDUCTOR STRUCTURE
Zbigniew Suszynski, Mateusz Kosikowski, Radoslaw Duer, U. of Technology Koszalin, Poland
   12:06 [1028] - A TEMPERATURE ANALYSIS OF HIGH-POWER ALGAN/GAN HEMTS
Jo Das, Herman Oprins, Wouter Ruythooren, Joff Derluyn, Marianne Germain, Gustaaf Borghs, IMEC, Leuven, Belgium
Hangfeng Ji, Andrei Sarua, Martin Kuball, U. of Bristol, UK
   12:09 [1027] - FLOW VISUALIZATION OF THE BUOYANCY-INDUCED CONVECTIVE HEAT TRANSFER IN ELECTRONICS COOLING
Carmine Sapia, U. "Roma TRE", Italy
   12:12 [1049] - CONTACTLESS THERMAL CHARACTERIZATION METHOD OF PCB-S USING DIFFERENT IR SENSOR ARRAYS
György Bognár, Vladimír Székely, Márta Rencz, BUTE, Hungary
   12:15 [1013] - THE METHOD OF NON-LINEAR DISTORTIONS ELIMINATION IN PHOTOACOUSTIC INVESTIGATION OF LAYERED SEMICONDUCTOR STRUCTURE
Zbigniew Suszynski, Radoslaw Duer, Mateusz Kosikowski, U. of Technology, Koszalin, Poland
   12:18 [1042] - REPRESENTATIONS OF MULTI-PORT PASSIVE DYNAMIC THERMAL NETWORKS
Lorenzo Codecasa, Dario D'Amore, Paolo Maffezzoni, Politecnico di Milano, Italy
   12:21 [1047] - THERMAL MODELING OF HIGH POWER LED MODULES
Dany Benoy, Philips Lighting, Eindhoven, The Netherlands
   12:24 [1050] - CREATING TEMPERATURE DEPENDENT NI-MH BATTERY MODELS FOR LOW POWER MOBILE DEVICES
Domokos D. Szente-Varga, Gyula Horvath, Márta Rencz, BUTE, Hungary
   12:27 [1017] - ELECTRONICS COOLING FAN NOISE PREDICTION
Antoine Dozolme, Thierry Marchal, Fluent Inc, Wavre, Belgium
Hossam Metwally, Fluent Inc, Evanston, USA
   12:30 [1019] - LIQUID COOLING OF BRIGHT LEDS FOR AUTOMOTIVE APPLICATIONS
Yan Lai, Nicolás Cordero, Tyndall National Institute, Cork, Ireland
   12:33 [1022] - THERMAL DESIGN OF POWER SEMICONDUCTOR MODULES FOR MOBILE COMMUNICATION SYSTEMS
Yasuo Osone, Hitachi, Lyd., Ibaraki, Japan
   12:36 [1025] - FAILURE ANALYSIS AND FIELD FAILURES: A REAL SHORTCUT TO RELIABILITY IMPROVEMENT
Mura Giovanna, DIEE/U. of Cagliari, Italy
   12:39 [1040] - A MORE FLEXIBLE REALIZATION OF THE SUNRED ALGORITHM
László Pohl, Vladimir Székely, BUTE, Hungary
   12:42 [1018] - RELIABILITY EVALUATION METHOD FOR ELECTRONIC DEVICE BGA PACKAGE CONSIDERING THE INTERACTION BETWEEN DESIGN FACTORS
Satoshi Kondo, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori, Yokohama National U., Japan
   12:45 [1032] - MODELING WITH STRUCTURE OF RESINS IN ELECTONIC COMPORNENTS
Tsubasa Matsumoto, Msaki Shiratori, Kyouo U, Tadahiro Shibutani, Hikaru Hirota, Yokohama National U., Japan
13:00     Lunch
14:30-16:50 Session 2: THERMAL SIMULATION
Chair: Lorenzo Codecasa, Politecnico di Milano, Italy
   14:30 [1004] - ELECTRONICS WARMING AND OPTIMIZATION STUDY SUBJECT TO LOW TEMPERATURE ENVIRONMENTS
Kevin Khalkhali, Marinela Gombosev, Parker Aerospace, Irvine, USA
   14:50 [1014] - MODEL REDUCTION FOR POWER ELECTRONICS SYSTEMS WITH MULTIPLE HEAT SOURCES
Adam Augustin, Torsten Hauck, Freescale Semiconductor, Munich, Germany
Bartosz Maj, Julia Czernohorsky, Continental Teves AG, Frankfurt, Germany
Evgenii Rudnyi, Jan Korvink, IMTEK/U. of Freiburg, Germany
   15:10 [1026] - DYNAMIC COMPACT THERMAL MODEL WITH NEURAL NETWORKS FOR RADAR APPLICATIONS
Grégory Mallet, Philippe Leray, LITIS, Rouen, France
Hubert Polaert, Clément Tolant, Philippe Eudeline, THALES AIR DEFENCE, Ymare, France
   15:30 [1038] - THERMAL TRANSIENT MULTISOURCE SIMULATION USING CUBIC SPLINE INTERPOLATION OF THERMAL IMPEDANCES
Dirk Schweitzer, Infineon Technologies AG, Munich, Germany
   15:50 [1039] - DYNAMIC THERMAL ANALYSIS OF A POWER AMPLIFIER
Jedrzej Banaszczyk, Marcin Janicki, Andrzej Napieralski, Tech. U. of Lodz, Poland
Gilbert De Mey, Bjorn Vermeersch, Piotr Kawka, Ghent U., Belgium
   16:10 [1058] - ULTRAFAST TEMPERATURE PROFILE CALCULATION IN IC CHIPS
Ali Shakouri, U. of California, USA
   16:30 [1056] - A COUPLED THERMOREFLECTANCE THERMOGRAPHY EXPERIMENTAL SYSTEM AND ULTRA-FAST ADAPTIVE COMPUTATIONAL ENGINE FOR THE COMPLETE THERMAL CHARACTERIZATION OF THREE-DIMENSIONAL ELECTRONIC DEVICES: VALIDATION
Peter Raad, Pavel Komarov, Mihai Burzo, Southern Methodist U., Dallas, USA
16:50     Coffee Break
17:10–18:10 VENDORS SESSION
Chair: Bernard Courtois, TIMA Labs, Grenoble, France
18:10 EXHIBITION & POSTER VIEWING
18:30     Cocktail
Thursday 28 September 2006
08:45     Coffee
09:00-09:40 Invited Talk II: MICROFLUIDIC TECHNOLOGIES FOR INTEGRATED THERMAL MANAGEMENT
Ari Glezer, Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, USA
Chair: Vladimir Székely, BUTE, Budapest, Hungary
09:40-10:40 Session 3: MEASUREMENT OF THERMAL PROPERTIES
Chair: Wilfrid Claeys, U. of Bordeaux, France
   09:40 [1002] - CHARACTERISATION OF THERMAL INTERFACE MATERIALS FOR THERMAL SIMULATION
Ralph Schacht, Daniel May, Astrid Gollhardt, Olaf Wittler, Bernhard Wunderle, Bernd Michel, Fraunhofer IZM, Berlin, Germany
Herbert Reichl, Technical U. Berlin, Germany
   10:00 [1003] - MEASUREMENTS OF THERMOPHYSICAL PROPERTY OF THIN FILMS BY LIGHT PULSE HEATING THERMOREFLECTANCE METHODS
Baba Tetsuya, Ishikawa Kazuko, Yagi Takashi, Taketoshi Naoyuki, National Metrology Institute of Japan/AIST, Ibaraki, Japan
   10:20 [1031] - THERMAL TRANSIENT CHARACTERIZATION OF PACKAGED THIN FILM MICROCOOLERS
Kazuhiko Fukutani, Rajeev Singh, Ali Shakouri, U. of California, Santa Cruz, USA
10:40     Coffee Break
11:10-11:50 Session 4: RELIABILITY
Chair: Zoran Radivojevic, Nokia Research Center, Helsinki, Finland
   11:10 [1005] - OPTIMIZED CURING PROCESS AND STRESS ANALYSIS OF INK-JET BASED PRINTED ELECTRONICS
Zoran Radivojevic, Klas Andersson, Markku Heino, Nokia Research Center, Helsinki, Finland
Hahizume Kenichi, Kaoru Tanaka, Akiko Kamigori, Nokia Research Center, Tokyo, Japan
Paullina Mansikkamaki, Matti Mantysalo, Tampere U. of Technology, Finland
   11:30 [1048] - THERMAL STRESS FAILURES: A NEW EXPERIMENTAL APPROACH FOR PREDICTION AND PREVENTION
Michael Hertl, INSIDIX, Seyssins, France
12:00     Lunch
13:30-15:00 EXHIBITION & POSTER VIEWING
  Social event: visit of The Villa Ephrussi de Rothschild
 15:30  Buses departure in front of the Hotel
Visit of The Villa Ephrussi de Rothschild
 18:00  Cocktail
 18:30  Buses departure to Nice
  Free time in Nice
Friday 29 September 2006
08:30-10:30 Session 5: THERMAL MODELING AND INVESTIGATION OF PACKAGES
Chair: John Janssen, Philips Semiconductors, The Netherlands
   08:30 [1006] - LOCALIZED LNA COOLING IN VACUUM
Frans Schreuder, Jan Geralt Bij de Vaate, ASTRON, Dwingeloo, The Netherlands
   08:50 [1041] - NOVEL PROJECTION-BASED APPROACH TO EXTRACT COMPACTS MODELS OF NONLINEAR THERMAL NETWORKS
Lorenzo Codecasa, Dario D'Amore, Paolo Maffezzoni, Politecnico di Milano, Italy
   09:10 [1044] - DESIGN ISSUES OF A VARIABLE THERMAL RESISTANCE
Vladimir Székely, Gabor Mezosi, BUTE, Hungary
   09:30 [1052] - THERMAL MEASUREMENT AND MODELING OF MULTI-DIE PACKAGES
Yan Zhang, John Wilson, Flomerics Inc., USA
Gabor Farkas, Peter Szabo, MicReD, Budapest, Hungary
Andras Poppe, MicReD/BUTE, Hungary
John Parry, Flomerics Ltd., UK
   09:50 [1053] - ELECTRICAL, THERMAL AND OPTICAL CHARACTERIZATION OF POWER LED ASSEMBLIES
Andras Poppe, MicReD/BUTE, Hungary
Shatil Haque, Philips-Lumileds
Gabor Farkas, MicReD, Hungary
Gyorgy Horvath, BUTE, Hungary
   10:10 [1054] - THERMAL BENCHMARK SOFTWARE
Marius Marcu, Politehnica U. of Timisoara, Romania
10:30     Coffee Break
11:00-13:00 Special session: ADVANCED TEMPERATURE MEASUREMENTS AT SUB-MICRON SCALES
Chairs: Sebastian Volz, Ecole Centrale Paris, Châtenay-Malabry, France
  Peter Raad, Southern Methodist U., Dallas, USA
   11:00  INTRODUCTION
Sebastian Volz, Ecole Centrale Paris, Châtenay-Malabry, France
Peter Raad, Southern Methodist U., Dallas, USA
Temperature levels and gradients are governing the reliability and life time of ICs. Due to size reduction, new metrologies are required to probe temperature at nanoscales (10-500nm). The session features the advancements in the main fields of Scanning Thermal Microscopy and Photothermal techniques.
   11:10 PICOSECOND THERMAL IMAGING
Stefan Dilhaire, U. Bordeaux 1, Talence, France
   11:30 RECENT ADVANCEMENTS IN PHOTOTHERMAL MEASUREMENTS
Gilles Tessier, ESPCI, Paris, France
   11:50 LEVERAGING MEASUREMENTS, MODELS, AND NUMERICS
Peter Raad, Southern Methodist U., Dallas, USA
   12:10 [1020] - QUANTITATIVE ANALYSIS OF 3W-SCANNING THERMAL MICROSCOPY IN VACUUM
Pierre-Olivier Chapuis, Sebastian Volz, Ecole Centrale Paris, Châtenay-Malabry, France
   12:30 THERMAL CHARACTERIZATION OF MICROREFRIGERATORS ON A CHIP
Ali Shakouri, U. of California Santa Cruz, Santa Cruz, USA
13:00     Lunch
14:00-16:20 Session 6: ELECTROTHERMAL SIMULATION AND MODELINGS
Chair: Andrzej Napieralski, Tech. U. of Lodz, Poland>
   14:00 [1008] - THE HOT-SPOT PHENOMENON AND ITS COUNTERMEASURES IN BIPOLAR POWER TRANSISTORS BY ANALYTICAL ELECTRO-THERMAL SIMULATION
Fabio Stefani, Paolo Emilio Bagnoli, U. of Pisa, Italy
   14:20 [1010] - LUMPED ELECTRO-THERMAL MODEL OF ON-CHIP INTERCONNECTS
Nadia Spennagallo, Lorenzo Codecasa, Dario D'Amore, Paolo Maffezzoni, Politecnico di Milano, Italy
   14:40 [1011] - ADVANCED COMPACT THERMAL MODELING BY USING VHDL-AMS
Wasim Habra, Patrick Tounsi, Jean-Marie Dorkel, LAAS-CNRS, Toulouse, France
   15:00 [1029] - THERMAL AND SENSITIVITY ANALYSIS OF MULTI-FIN DEVICES
Brian Swahn, Tufts U., USA
   15:20 [1033] - HEATRING - SMART INVESTIGATION OF TEMPERATURE IMPACT ON INTEGRATED CIRCUIT DEVICES
Alexandre Nentchev, Wien U. of Technology, Austria
   15:40 [1045] - AN EXTENDABLE MULTI-PURPOSE SIMULATION AND OPTIMIZATION FRAMEWORK FOR THERMAL PROBLEMS IN TCAD APPLICATIONS
Stefan Holzer, Wien U. of Technology, Austria
   16:00 [1024] - THERMOS3, A TOOL FOR 3D ELECTROTHERMAL SIMULATION OF SMART POWER MOSFETS
Giovanni Buonaiuto, Andrea Irace, Giovanni Breglio, Paolo Spirito, U. of Naples Federico II, Italy
16:20-16:30 Closing Remarks
Chair: Bernard Courtois, TIMA Labs, Grenoble, France
Copyright© 2006 Laboratoire TIMA.
Tous droits réservés.