| 12th International Workshop on |
|
THERMAL
INVESTIGATIONS of
ICs and SYSTEMS 27-29 September 2006, Nice, Côte d'Azur, France. |
Program Schedule
Wednesday 27 September 2006 | |||||||||
| 08:00–09:30 | Registration & Welcome Coffee | ||||||||
| 09:30–09:40 | Welcome Address Chair: Bernard Courtois, TIMA Labs, Grenoble, France | ||||||||
| 09:40-10:20 | Invited Talk I: ENABLING ELECTRONIC PROGNOSTICS USING THERMAL DATA Michael Pecht, CALCE Electronic Products and Systems Center, U. of Maryland, College Park, USA Chair: Clemens Lasance, Philips Research Laboratories, Eindhoven, The Netherlands | ||||||||
| 10:20-11:40 | Session 1: TEMPERATURE MEASUREMENTS Chair: Gilbert De Mey, Ghent U., Belgium | ||||||||
| 10:20 [1007] - THERMAL PROPERTIES OF HIGH POWER LASER BARS INVESTIGATED BY THERMOREFLECTANCE AND MICRO-RAMAN SPECTROSCOPY Dorota Pierscinska, Kamil Pierscinski, Tomasz Ochalski, Maciej Bugajski, Institute of Electron Technology, Poland Jens W. Tomm, Max Born Institute, Germany | |||||||||
| 10:40 [1055] - CCD THERMOREFLECTANCE THERMOGRAPHY SYSTEM: METHODOLOGY AND EXPERIMENTAL VALIDATION Pavel Komarov, Mihai Burzo, Peter Raad, Southern Methodist U., Dallas, USA | |||||||||
| 11:00 [1021] - -55°C TO 170°C HIGH LINEAR VOLTAGE REFERENCES CIRCUITRY IN 0.18µM CMOS TECHNOLOGY Joseph Tzuo-sheng Tsai, Herming Chiueh, National Chiao Tung U., Taiwan | |||||||||
| 11:20 [1046] - TEMPERATURE MEASUREMENT IN THE INTEL® CORETM DUO PROCESSOR Efraim Rotem, Aviad Cohen, Harel Cain, Intel, Haifa, Israel | |||||||||
| 11:40 |  Coffee Break | ||||||||
| 12:00-13:00 | POSTER INTRODUCTION SESSION Chair: Márta Rencz, Budapest U. of Technology and Economics, Hungary The posters will be introduced by one slide in maximum 3 minutes each. | ||||||||
| 12:00 [1001] - REDUCING THE POSSIBILITY OF SUBJECTIVE ERROR IN THE DETERMINATION OF THE STRUCTURE-FUNCTION-BASED EFFECTIVE THERMAL CONDUCTIVITY OF PCBS Erno Kollar, BUTE, Hungary | |||||||||
| 12:03 [1015] - THE APPLICATION OF ARTIFICIAL NEURAL NETWORK FOR THE ASSESSMENT OF THERMAL PROPERTIES OF MULTI-LAYER SEMICONDUCTOR STRUCTURE Zbigniew Suszynski, Mateusz Kosikowski, Radoslaw Duer, U. of Technology Koszalin, Poland | |||||||||
| 12:06 [1028] - A TEMPERATURE ANALYSIS OF HIGH-POWER ALGAN/GAN HEMTS Jo Das, Herman Oprins, Wouter Ruythooren, Joff Derluyn, Marianne Germain, Gustaaf Borghs, IMEC, Leuven, Belgium Hangfeng Ji, Andrei Sarua, Martin Kuball, U. of Bristol, UK | |||||||||
| 12:09 [1027] - FLOW VISUALIZATION OF THE BUOYANCY-INDUCED CONVECTIVE HEAT TRANSFER IN ELECTRONICS COOLING Carmine Sapia, U. "Roma TRE", Italy | |||||||||
| 12:12 [1049] - CONTACTLESS THERMAL CHARACTERIZATION METHOD OF PCB-S USING DIFFERENT IR SENSOR ARRAYS György Bognár, Vladimír Székely, Márta Rencz, BUTE, Hungary | |||||||||
| 12:15 [1013] - THE METHOD OF NON-LINEAR DISTORTIONS ELIMINATION IN PHOTOACOUSTIC INVESTIGATION OF LAYERED SEMICONDUCTOR STRUCTURE Zbigniew Suszynski, Radoslaw Duer, Mateusz Kosikowski, U. of Technology, Koszalin, Poland | |||||||||
| 12:18 [1042] - REPRESENTATIONS OF MULTI-PORT PASSIVE DYNAMIC THERMAL NETWORKS Lorenzo Codecasa, Dario D'Amore, Paolo Maffezzoni, Politecnico di Milano, Italy | |||||||||
| 12:21 [1047] - THERMAL MODELING OF HIGH POWER LED MODULES Dany Benoy, Philips Lighting, Eindhoven, The Netherlands | |||||||||
| 12:24 [1050] - CREATING TEMPERATURE DEPENDENT NI-MH BATTERY MODELS FOR LOW POWER MOBILE DEVICES Domokos D. Szente-Varga, Gyula Horvath, Márta Rencz, BUTE, Hungary | |||||||||
| 12:27 [1017] - ELECTRONICS COOLING FAN NOISE PREDICTION Antoine Dozolme, Thierry Marchal, Fluent Inc, Wavre, Belgium Hossam Metwally, Fluent Inc, Evanston, USA | |||||||||
| 12:30 [1019] - LIQUID COOLING OF BRIGHT LEDS FOR AUTOMOTIVE APPLICATIONS Yan Lai, Nicolás Cordero, Tyndall National Institute, Cork, Ireland | |||||||||
| 12:33 [1022] - THERMAL DESIGN OF POWER SEMICONDUCTOR MODULES FOR MOBILE COMMUNICATION SYSTEMS Yasuo Osone, Hitachi, Lyd., Ibaraki, Japan | |||||||||
| 12:36 [1025] - FAILURE ANALYSIS AND FIELD FAILURES: A REAL SHORTCUT TO RELIABILITY IMPROVEMENT Mura Giovanna, DIEE/U. of Cagliari, Italy | |||||||||
| 12:39 [1040] - A MORE FLEXIBLE REALIZATION OF THE SUNRED ALGORITHM László Pohl, Vladimir Székely, BUTE, Hungary | |||||||||
| 12:42 [1018] - RELIABILITY EVALUATION METHOD FOR ELECTRONIC DEVICE BGA PACKAGE CONSIDERING THE INTERACTION BETWEEN DESIGN FACTORS Satoshi Kondo, Qiang Yu, Tadahiro Shibutani, Masaki Shiratori, Yokohama National U., Japan | |||||||||
| 12:45 [1032] - MODELING WITH STRUCTURE OF RESINS IN ELECTONIC COMPORNENTS Tsubasa Matsumoto, Msaki Shiratori, Kyouo U, Tadahiro Shibutani, Hikaru Hirota, Yokohama National U., Japan | |||||||||
| 13:00 |  Lunch | ||||||||
| 14:30-16:50 | Session 2: THERMAL SIMULATION Chair: Lorenzo Codecasa, Politecnico di Milano, Italy | ||||||||
| 14:30 [1004] - ELECTRONICS WARMING AND OPTIMIZATION STUDY SUBJECT TO LOW TEMPERATURE ENVIRONMENTS Kevin Khalkhali, Marinela Gombosev, Parker Aerospace, Irvine, USA | |||||||||
| 14:50 [1014] - MODEL REDUCTION FOR POWER ELECTRONICS SYSTEMS WITH MULTIPLE HEAT SOURCES Adam Augustin, Torsten Hauck, Freescale Semiconductor, Munich, Germany Bartosz Maj, Julia Czernohorsky, Continental Teves AG, Frankfurt, Germany Evgenii Rudnyi, Jan Korvink, IMTEK/U. of Freiburg, Germany | |||||||||
| 15:10 [1026] - DYNAMIC COMPACT THERMAL MODEL WITH NEURAL NETWORKS FOR RADAR APPLICATIONS Grégory Mallet, Philippe Leray, LITIS, Rouen, France Hubert Polaert, Clément Tolant, Philippe Eudeline, THALES AIR DEFENCE, Ymare, France | |||||||||
| 15:30 [1038] - THERMAL TRANSIENT MULTISOURCE SIMULATION USING CUBIC SPLINE INTERPOLATION OF THERMAL IMPEDANCES Dirk Schweitzer, Infineon Technologies AG, Munich, Germany | |||||||||
| 15:50 [1039] - DYNAMIC THERMAL ANALYSIS OF A POWER AMPLIFIER Jedrzej Banaszczyk, Marcin Janicki, Andrzej Napieralski, Tech. U. of Lodz, Poland Gilbert De Mey, Bjorn Vermeersch, Piotr Kawka, Ghent U., Belgium | |||||||||
| 16:10 [1058] - ULTRAFAST TEMPERATURE PROFILE CALCULATION IN IC CHIPS Ali Shakouri, U. of California, USA | |||||||||
| 16:30 [1056] - A COUPLED THERMOREFLECTANCE THERMOGRAPHY EXPERIMENTAL SYSTEM AND ULTRA-FAST ADAPTIVE COMPUTATIONAL ENGINE FOR THE COMPLETE THERMAL CHARACTERIZATION OF THREE-DIMENSIONAL ELECTRONIC DEVICES: VALIDATION Peter Raad, Pavel Komarov, Mihai Burzo, Southern Methodist U., Dallas, USA | |||||||||
| 16:50 | Coffee Break | ||||||||
| 17:10–18:10 | VENDORS SESSION Chair: Bernard Courtois, TIMA Labs, Grenoble, France | ||||||||
| 18:10 | EXHIBITION & POSTER VIEWING | ||||||||
| 18:30 |  Cocktail | ||||||||
Thursday 28 September 2006 | |||||||||
| 08:45 | Coffee | ||||||||
| 09:00-09:40 | Invited Talk II: MICROFLUIDIC TECHNOLOGIES FOR INTEGRATED THERMAL MANAGEMENT Ari Glezer, Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, USA Chair: Vladimir Székely, BUTE, Budapest, Hungary | ||||||||
| 09:40-10:40 | Session 3: MEASUREMENT OF THERMAL PROPERTIES Chair: Wilfrid Claeys, U. of Bordeaux, France | ||||||||
| 09:40 [1002] - CHARACTERISATION OF THERMAL INTERFACE MATERIALS FOR THERMAL SIMULATION Ralph Schacht, Daniel May, Astrid Gollhardt, Olaf Wittler, Bernhard Wunderle, Bernd Michel, Fraunhofer IZM, Berlin, Germany Herbert Reichl, Technical U. Berlin, Germany | |||||||||
| 10:00 [1003] - MEASUREMENTS OF THERMOPHYSICAL PROPERTY OF THIN FILMS BY LIGHT PULSE HEATING THERMOREFLECTANCE METHODS Baba Tetsuya, Ishikawa Kazuko, Yagi Takashi, Taketoshi Naoyuki, National Metrology Institute of Japan/AIST, Ibaraki, Japan | |||||||||
| 10:20 [1031] - THERMAL TRANSIENT CHARACTERIZATION OF PACKAGED THIN FILM MICROCOOLERS Kazuhiko Fukutani, Rajeev Singh, Ali Shakouri, U. of California, Santa Cruz, USA | |||||||||
| 10:40 | Coffee Break | ||||||||
| 11:10-11:50 | Session 4: RELIABILITY Chair: Zoran Radivojevic, Nokia Research Center, Helsinki, Finland | ||||||||
| 11:10 [1005] - OPTIMIZED CURING PROCESS AND STRESS ANALYSIS OF INK-JET BASED PRINTED ELECTRONICS Zoran Radivojevic, Klas Andersson, Markku Heino, Nokia Research Center, Helsinki, Finland Hahizume Kenichi, Kaoru Tanaka, Akiko Kamigori, Nokia Research Center, Tokyo, Japan Paullina Mansikkamaki, Matti Mantysalo, Tampere U. of Technology, Finland | |||||||||
| 11:30 [1048] - THERMAL STRESS FAILURES: A NEW EXPERIMENTAL APPROACH FOR PREDICTION AND PREVENTION Michael Hertl, INSIDIX, Seyssins, France | |||||||||
| 12:00 | Lunch | ||||||||
| 13:30-15:00 | EXHIBITION & POSTER VIEWING | ||||||||
Social event: visit of The Villa Ephrussi de Rothschild
| |||||||||
Friday 29 September 2006 | |||||||||
| 08:30-10:30 | Session 5: THERMAL MODELING AND INVESTIGATION OF PACKAGES Chair: John Janssen, Philips Semiconductors, The Netherlands | ||||||||
| 08:30 [1006] - LOCALIZED LNA COOLING IN VACUUM Frans Schreuder, Jan Geralt Bij de Vaate, ASTRON, Dwingeloo, The Netherlands | |||||||||
| 08:50 [1041] - NOVEL PROJECTION-BASED APPROACH TO EXTRACT COMPACTS MODELS OF NONLINEAR THERMAL NETWORKS Lorenzo Codecasa, Dario D'Amore, Paolo Maffezzoni, Politecnico di Milano, Italy | |||||||||
| 09:10 [1044] - DESIGN ISSUES OF A VARIABLE THERMAL RESISTANCE Vladimir Székely, Gabor Mezosi, BUTE, Hungary | |||||||||
| 09:30 [1052] - THERMAL MEASUREMENT AND MODELING OF MULTI-DIE PACKAGES Yan Zhang, John Wilson, Flomerics Inc., USA Gabor Farkas, Peter Szabo, MicReD, Budapest, Hungary Andras Poppe, MicReD/BUTE, Hungary John Parry, Flomerics Ltd., UK | |||||||||
| 09:50 [1053] - ELECTRICAL, THERMAL AND OPTICAL CHARACTERIZATION OF POWER LED ASSEMBLIES Andras Poppe, MicReD/BUTE, Hungary Shatil Haque, Philips-Lumileds Gabor Farkas, MicReD, Hungary Gyorgy Horvath, BUTE, Hungary | |||||||||
| 10:10 [1054] - THERMAL BENCHMARK SOFTWARE Marius Marcu, Politehnica U. of Timisoara, Romania | |||||||||
| 10:30 | Coffee Break | ||||||||
| 11:00-13:00 | Special session: ADVANCED TEMPERATURE MEASUREMENTS AT SUB-MICRON SCALES
| ||||||||
| 11:00 INTRODUCTION Sebastian Volz, Ecole Centrale Paris, Châtenay-Malabry, France Peter Raad, Southern Methodist U., Dallas, USA
Temperature levels and gradients are governing the reliability and life time of ICs. Due to size reduction, new metrologies are required to probe temperature at nanoscales (10-500nm). The session features the advancements in the main fields of Scanning Thermal Microscopy and Photothermal techniques. | |||||||||
| 11:10 PICOSECOND THERMAL IMAGING Stefan Dilhaire, U. Bordeaux 1, Talence, France | |||||||||
| 11:30 RECENT ADVANCEMENTS IN PHOTOTHERMAL MEASUREMENTS Gilles Tessier, ESPCI, Paris, France | |||||||||
| 11:50 LEVERAGING MEASUREMENTS, MODELS, AND NUMERICS Peter Raad, Southern Methodist U., Dallas, USA | |||||||||
| 12:10 [1020] - QUANTITATIVE ANALYSIS OF 3W-SCANNING THERMAL MICROSCOPY IN VACUUM Pierre-Olivier Chapuis, Sebastian Volz, Ecole Centrale Paris, Châtenay-Malabry, France | |||||||||
| 12:30 THERMAL CHARACTERIZATION OF MICROREFRIGERATORS ON A CHIP Ali Shakouri, U. of California Santa Cruz, Santa Cruz, USA | |||||||||
| 13:00 | Lunch | ||||||||
| 14:00-16:20 | Session 6: ELECTROTHERMAL SIMULATION AND MODELINGS Chair: Andrzej Napieralski, Tech. U. of Lodz, Poland> | ||||||||
| 14:00 [1008] - THE HOT-SPOT PHENOMENON AND ITS COUNTERMEASURES IN BIPOLAR POWER TRANSISTORS BY ANALYTICAL ELECTRO-THERMAL SIMULATION Fabio Stefani, Paolo Emilio Bagnoli, U. of Pisa, Italy | |||||||||
| 14:20 [1010] - LUMPED ELECTRO-THERMAL MODEL OF ON-CHIP INTERCONNECTS Nadia Spennagallo, Lorenzo Codecasa, Dario D'Amore, Paolo Maffezzoni, Politecnico di Milano, Italy | |||||||||
| 14:40 [1011] - ADVANCED COMPACT THERMAL MODELING BY USING VHDL-AMS Wasim Habra, Patrick Tounsi, Jean-Marie Dorkel, LAAS-CNRS, Toulouse, France | |||||||||
| 15:00 [1029] - THERMAL AND SENSITIVITY ANALYSIS OF MULTI-FIN DEVICES Brian Swahn, Tufts U., USA | |||||||||
| 15:20 [1033] - HEATRING - SMART INVESTIGATION OF TEMPERATURE IMPACT ON INTEGRATED CIRCUIT DEVICES Alexandre Nentchev, Wien U. of Technology, Austria | |||||||||
| 15:40 [1045] - AN EXTENDABLE MULTI-PURPOSE SIMULATION AND OPTIMIZATION FRAMEWORK FOR THERMAL PROBLEMS IN TCAD APPLICATIONS Stefan Holzer, Wien U. of Technology, Austria | |||||||||
| 16:00 [1024] - THERMOS3, A TOOL FOR 3D ELECTROTHERMAL SIMULATION OF SMART POWER MOSFETS Giovanni Buonaiuto, Andrea Irace, Giovanni Breglio, Paolo Spirito, U. of Naples Federico II, Italy | |||||||||
| 16:20-16:30 | Closing Remarks Chair: Bernard Courtois, TIMA Labs, Grenoble, France | ||||||||
Copyright© 2006 Laboratoire TIMA.
Tous droits réservés.
Tous droits réservés.