Sponsored by
	IEEE Computer Society Test Technology Technical Council	Components, Packaging, and Manufacturing Technology Society
In cooperation with Thermal Committee of IEEE CMPT

General Chair B. Courtois TIMA Labs Grenoble, France Vice General Chair M. Rencz BUTE Budapest, Hungary Programme Chairs C. Lasance Philips, The Netherlands V. Székely BUTE Budapest, Hungary Special Topic Chair E. Suhir UC Santa Cruz, USA Programme Committee (To include) T. Baba NMI of Japan, Tsukuba/Japan M. Baelmans KUL/Belgium A. Bar-Cohen U. of Maryland, College Park/USA I. Barsony KFKI-ATKI/Hungary D. Blackburn NIST/USA B. Charlot TIMA Labs./France H. Chiueh National Chiao Tung U./Taiwan F. Christiaens Alcatel Bell/Belgium W. Claeys U. Bordeaux/France L. Codecasa Polit. di Milano/Italy D. Copeland Fujitsu/USA G. De Mey Ghent U./Belgium G. Digele The Boston Cltg/Germany E. Driessens IMEC/Belgium W. Faris IIUM/Malaysia S. Garimella Purdue U., West Lafayette/USA Y.C. Gerstenmaier Siemens/Germany Y. Gianchandani U. of Michigan/USA A. Glezer The Georgia Inst. of Techn./USA K.E. Goodson Stanford Univ/USA B. Guenin SUN/USA J. Janssen Philips/The Netherlands Y. Joshi The Georgia Inst. of Techn./USA M. Kimura Tohoku-Gakuin U./Japan A. Napieralski TU Lodz/Poland H. Pape Infineon Techn./Germany J. Parry Flomerics/UK P. Raad South. Methodist U./USA Z. Radivojevic Nokia/Finland J. Rantala Nokia/Finland P. Rodgers CALCE EPS Center/USA A. Rubio UPC/Spain M-N. Sabry U. Française d'Egypte/Egypt J. Samitier U. Barcelona/Spain J.B. Saulnier ENSMA/France Y. Scudeller Lab. Thermocinétique/France A. Shakouri U. of California/USA M-W. Shin Myong Ji U./Korea A. Siebert Rolls-Royce/UK O. Slattery NMRC/Ireland E. Suhir UC Santa Cruz/USA A. Tay NUS/Singapore B. Vandevelde IMEC/Belgium S. Volz Ecole Centr. Paris/France G. Wachutka TU München/Germany C.P. Wong The Georgia Inst. of Techn./USA

Call for Papers THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. This year THERMINIC will address in addition to the “traditional” thermal management problems, also stress and thermal-stress-related-reliability issues, both in micro- and opto-electronics fields. These issues, including various nanotechnology applications, are of significant importance and of high interest to the engineering community engaged in the field of thermal phenomens in “high-tech” systems. The Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society, the IEEE Computer Society, Test Technology Technical Council and TIMA Laboratory in cooperation with the Thermal Committee of IEEE CMPT. Areas of interest The areas of interest range from thermal investigations in microstructures to thermal management of electronic systems. Thermal and Temperature Sensors Thermal Simulation Electro-thermal Simulation Thermal Modelling and Investigation of Packages Reliability Issues High Temperature Electronics Heat Transfer Education Flow Visualisation Techniques Turbulence Modelling in Complex Geometrics Measurement of Thermal Properties Acquisition and Analysis of Thermal data Temperature Mapping Novel and Advanced Cooling Techniques Thermal Performance of Interconnects Heat Transfer Enhancement Validation of Thermal Software Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects Defect and Failure Modelling Thermal Stress: Theory and Experiment Thermal Stress Failures: Prediction and Prevention Reliability Evolution and Prediction Multiphysics Simulation Nanoengineering Issues Nanotechnology Applications Education. Technical Programme The programme will include oral talks, posters presentations, a panel discussion and invited talks given by prominent speakers. Invited talks will include: Are thermal problems with chips solved with architectural aspects ? T. Nakamura, U. of Tohoku, Japan. It is productive to think of how thermal problems on chips are dealt with in designing COOL Chips with low-power and high-speed. In terms of architectural aspects, the problems are somehow solved. We could save energy on chip computing, using high efficient chip technologies in hardware and software. Information for the authors Authors are invited to submit electronic papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status. Submission will be electronically only. Only papers of PDF (.pdf), MS Word (.doc), RTF (.rtf) or PS (.ps) formats can be submitted. Compressed paper versions (.zip or .gz) are highly recommended. You are allowed to submit at most 2 formats of your paper. Detailed information about the submission process will be made available on the THERMINIC web page In case you experience any problems with the submission procedure, please contact the General Chair, Bernard Courtois, TIMA Laboratory, Grenoble, France. Accepted contributions will be included in Workshop Proceedings. Submission deadline 30 April 2005 Notification of acceptance 20 June 2005 Submission of manuscripts for distribution at the Workshop 24 August 2005 Vendors and book exhibitions The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books. Special Issue and Special Sections Special Issues and special sections of leading periodicals have been organised regarding the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging). It is again expected to have special issues and special sections of leading periodicals as follow up of the Workshop 2005. Professional Development Course/Tutorial A Tutorial will be offered on 27 September, prior to the Workshop. Details will be published in the Programme booklet. Venue The Workshop will take place in the Best Western Hotel Villa Carlotta, in Belgirate in Italy. The Best Western Hotel Villa Carlotta is located between a charming private park of 40,000 square metres and the Lake Maggiore. Best Western Hotel Villa Carlotta Via Sempione 121/125 Belgirate Lake Maggiore I-28832 Italy Phone: 39 0322 76461 Fax: 39 0322 76705 Access   Airplane : The recent International Airport of Malpensa is situated at 35 km, with daily flies from and to all sides in the world. You can fly also to Milan Linate, the other airport of Milan, near the city but farther from the Lake. Malpensa information, tel. +39 02.74852200 Malpensa news for the travellers, tel. +39 02.26800613   Train : The FS, Ferrovie dello Stato, is the official name of national railways in Italy. It is easy to reach the Maggiore Lake from Milan or foreign countries.   Car : It's so easy to come for a beautiful holiday from everywhere in Europe. The Maggiore Lake is near Switzerland, therefore easy also to reach from Germany and France. From Milan: Motorway A8 Milano-Laghi. First choose Varese and reject Como. Then, in Gallarate, reject Varese (and the A8) and follow A26 to Gravellona Toce; exit in Vergiate-Sesto Calende or Arona, Gravellona Toce, Verbania; the SS 33 (State road) "Sempione" follows the Piedmont lakeshore from Castelletto Ticino to the Switzerland. From Genoa: Motorway A26 Genova-Gravellona Toce, via Alessandria and Vercelli-Novara; go forward and exit in Castelletto Ticino, Arona, Gravellona Toce or Verbania. From Switzerland: Swiss Motorway N 2 from Basel to Lugano, through the Gotthard tunnel. Exit in South-Bellinzona and follow to Lago Maggiore, Locarno and Ascona, or to the Lombard Italian frontier to Maccagno and Luino. You can also exit in Ponte Tresa (nearby Lugano and the Lugano Airport), then follow to Luino or Laveno or Varese. .

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