| 11th International Workshop on |
| THERMAL INVESTIGATIONS of ICs and Systems |
| Wednesday 28, September 2005 | Thursday 29, September 2005 | Friday 30, September 2005 |
 08:00–09:30 Registration 09:30–09:40 Welcome Address  09:40-10:20 Invited Talk I: ARE THERMAL PROBLEMS WITH CHIPS SOLVED WITH ARCHITECTURAL ASPECTS ?  10:20-12:20 Session 1: TEMPERATURE AWARE DESIGN  12:20 COFFEE BREAK  12:40-13:10 Poster Introductions session I 13:10 LUNCH  14:40-16:00 Special session: THERMAL STRESS AND THERMAL STRESS FAILURES: PREDICTION AND PREVENTION Part I: PREDICTIVE MODELING 16:00 COFFEE BREAK 16:20-17:20 Session 2: SENSORS 17:20-17:50 Poster Introductions session II  17:50–18:20 Vendors session  18:20-20:00 Exhibition and Poster Viewing 19:00 COCKTAIL
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08:30-10:10 Special session: THERMAL STRESS AND THERMAL STRESS FAILURES: PREDICTION AND PREVENTION Part II: THERMO-MECHANICAL BEHAVIOR AND RELIABILITY OF MATERIALS AND INTERFACES 10:10 COFFEE BREAK 10:30-12:10 Session 3: THERMAL AND TEMPERATURE MEASUREMENT METHODS 12:30 LUNCH 14:00-15:20 Session 4: THERMAL TRANSIENT TESTING 15:20 COFFEE BREAK 15:40-16:40 Exhibition and Poster Viewing  17:00 Departure from the Hotel Villa Carlotta 20:00 Typical dinner at the Hotel Milano
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09:00-09:40 Invited Talk II: CARBON NANOTUBES AS THERMAL SENSING ELEMENTS 09:40-10:40 Session 5: HEAT TRANSFER AND COOLING 10:40 COFFEE BREAK 11:00-12:40 Special session: MICRO TO NANO SCALE THERMAL MEASUREMENTS ON ICS: BENCHMARKING THE UP-TO-DATE METROLOGIES 12:40 LUNCH
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