Therminic'04, Tutorial

Tuesday 28 September 2004

Tutorials

Professional Development Courses/Tutorials are being offered on Tuesday 28 September from 10.00 to 17.00. Registrations will be guarantied on a first come first serve basis, upon maximum capacity is reached.

10:00-12:00

MICROSCALE HEAT TRANSFER IN ELECTRONICS THERMAL MANAGEMENT
Kenneth E. Goodson, Stanford University, USA

Tutorial objectives:

The tutorial would include, but will not be limited to the following topics:

Introduce the many different areas of electronics (interconnects, naotransistors, advanced heat sinks) where microscale heat transfer is important.
Introduce the state of the art of microscale & nanoscale temperature and thermal conductivity measurements as applied to electronic systems.
Introduce the physics and simulation/modelling techniques appropriate for microscale heat transfer in electronic systems.

About K. Goodson:

Ken Goodson is an Associate Professor of Mechanical Engineering at Stanford University. He is a founder and former CTO of Cooligy, a silicon valley startup which has grown to 35 employees working on electroosmotic microchannel cooling systems for integrated circuits. After receiving the Ph.D. in Mechanical Engineering from MIT in 1993, Goodson worked with the Materials Research Group at Daimler-Benz AG on the thermal design of power circuits. In 1994 he joined Stanford, where his research group now includes twenty students and research associates.
He has authored more than 120 journal and conference papers and five book chapters and has been recognized through the ONR Young Investigator Award and the NSF CAREER Award as well as Best Paper Awards at SEMI-THERM (2001), the Multilevel Interconnect Symposium (1998), and SRC TECHCON (1998). Goodson was a 1999 Outstanding Reviewer for the ASME Journal of Heat Transfer and a 1996 JSPS Visiting Professor at the Tokyo Institute of Technology.

14.00-17.00

THERMAL MEASUREMENTS AND QUALIFICATION USING THE TRANSIENT METHOD: PRINCIPLES AND APPLICATIONS
Andràs Poppe, BUTE, Budapest, Hungary

The tutorial covers advanced topics selected from the field thermal measurement of microelectronic structures and MEMS devices and some other types of measurements using the so called transient method. The transient method is based on capturing the real-time thermal transients completed with sophisticated mathematical algorithms to evaluate the measurement results. The evaluation procedure discussed in details is the NID method (network identification by deconvolution). The tutorial will "de-mystify" the famous structure functions - through practical examples it will be shown how they are used in real applications.

The tutorial would include, but will not be limited to the following topics:

Thermal transient testing: measurement methods and available tools.
Evaluation of thermal transients (heating/cooling curves) by the NID method: time-constant spectra, structure functions, RC models derived from transient curves.
Structure functions as models of the physical structure. Using structure functions for heat-flow path reconstruction and for modeling purposes.
Principles of structure function based thermal property measurements and some application examples such as:
o TIM characterization,
o Principles of R_thJC measurements with the transient method.
Non-destructive structure analysis: advanced case studies (e.g. investigation of state-of-the-art stacked die packages, study of high power LED-s).
How to account for heat-losses via parallel heat-flow paths when using the structure function based methods.

About A. Poppe:

András Poppe is an associate-professor at Budapest University of Technology & Economics, Department of Electron Devices.
He is also one of the co-founders of MicReD. Formerly he carried out research in the field of physical device modeling and curcuit simulation. Since the mid 90-ies he has been dealing with thermal issues in microelectronics and MEMS. He contributed to the development of thermal and electro-thermal simulation tools as well as to dedicated software tools used for the evaluation of thermal transient measurements.
He has been actively involved in major EU-funded research projects such as BARMINT, THERMINIC, PROFIT or REASON. In the REASON project he is responsible for the thermal workpackage.
As such, in the recent years he had a number of successful tutorials. András Poppe is co-author of over 80 sicentific publications, most of which deal with thermal issues in microelectronics.

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