Sponsored by		In cooperation with
	IEEE Computer Society Test Technology Technical Council	The Institute of Electrical & Electronics Engineers, Inc.

General Chair B. Courtois TIMA Labs Grenoble, France Vice General Chair M. Rencz BUTE Budapest, Hungary Programme Chairs C. Lasance Philips, The Netherlands V. Székely BUTE Budapest, Hungary Programme Committee K. Azar ATS/USA D. Blackburn NIST/USA M. Baelmans KUL/Belgium J. Janssen Philips/The Netherlands H. Pape Infineon Techn./Germany A. Tay NUS/Singapore E. Driessens IMEC/Belgium O. Slattery NMRC/Ireland G. De Mey Ghent U./Belgium L. Codecasa Polit. di Milano/Italy D. Copeland Fujitsu/USA G. Digele The Boston Cltg/Germany Y. Scudeller Lab. Thermocinétique/France P. Tadayon Intel/USA P. Raad South. Methodist U./USA P. Rodgers CALCE EPS Center/USA A. Shakouri U. of California/USA M-N. Sabry U. Française d'Egypte/Egypt I. Barsony KFKI-ATKI/Hungary W. Claeys U. Bordeaux/France G. Wachutka TU München/Germany F. Christiaens Alcatel Bell/Belgium A. Rubio UPC/Spain Y. Joshi The Georgia Inst. of Techn./USA B. Guenin SUN/USA M. Kimura Tohoku-Gakuin U./Japan J. Samitier U. Barcelona/Spain Y. Gianchandani U. of Michigan/USA A. Napieralski TU Lodz/Poland A. Glezer The Georgia Inst. of Techn./USA A. Siebert Rolls-Royce/UK B. Charlot TIMA Labs./France J. Rantala Nokia/Finland Z. Radivojevic Nokia/Finland E. Suhir UC Santa Cruz/USA S. Volz Ecole Centr. Paris/France J. Parry Flomerics/UK C. Nicole Philips/The Netherlands Y.C. Gerstenmaier Siemens/Germany W. Batty U. of Leeds/UK J.B. Saulnier ENSMA/France V. Eveloy Electronics Thermal Management /Ireland

Call for Papers THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. The Workshop is sponsored by the IEEE Computer Society, Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Solid-State Circuits Society French Chapter. The Committee will celebrate this year the 10th anniversary of the Workshop. Areas of interest The areas of interest range from thermal investigations in microstructures to thermal management of electronic systems. Thermal and Temperature Sensors Thermal Simulation Electro-thermal Simulation Thermal Modelling and Investigation of Packages Reliability Issues High Temperature Electronics Heat Transfer Education Flow Visualisation Techniques Turbulence Modelling in Complex Geometrics Thermal Characterization Measurement of Thermal Properties Acquisition and Analysis of Thermal data Temperature Mapping Novel and Advanced Cooling Techniques Thermal Performance of Interconnects Heat Transfer Enhancement Validation of Thermal Software Coupled (Thermo-mechanical, Thermo- optical, etc.) Effects. Technical Programme The programme will include oral talks, poster presentation, a panel discussion and invited talks given by prominent speakers. Invited talks Invited talks will include: Micro & Nanoscale Thermal Engineering of Electronic Systems K. E. Goodson, Stanford U., USA Heat transfer at small scales has a large impact on the performance and reliability of electronic systems. This seminar describes progress on a variety of projects including electrothermal simulations of nanotransistors, thermomechanical imprint data storage, and the characterization of low-k dielectrics, CVD diamond, and polymer-carbon nanotube composite interface materials. The talk will also provide an overview of the electroosmotic (EO) microchannel cooling systems developed at Stanford, which feature two-phase flow in micromachined heat sinks and silent EO pumping without moving parts. Femtosecond Laser Techniques for the Thermal Characterisation of Layered Nanoscale Structures W. Claeys, Bordeaux U., France Femtosecond laser based measurements allow deriving important data in the field of thermal nanometrology. Both acoustic wave propagation and thermal diffusion after laser impact are used to develop nanoscale thin film metrology. The method is based upon a pump-probe experimental set-up coupled to two different signal analysis instruments we have developed. Enabling Meso-Scale Thermal Management Technologies for Next-Generation Microelectronics Systems S.V. Garimella, Purdue U., West Lafayette, USA Novel, high-performance cooling techniques for use in emerging electronics applications will be presented. A number of critical enabling thermal management technologies such as single- and two-phase microchannel transport, micropumping techniques, smart piezoelectric fans, miniaturized heat pipes, transient phase change energy storage systems, and enhancement of interface contact conductance will be covered. The discussion will include feasibility demonstration, experimental characterization, and design and optimization of these techniques. General needs on nanoscale thermal metrology and the Japanese program on this subject T. Baba, Nat. Metrology Institute of Japan Reliable thermophysical property values of thin films are important to develop advanced industrial technologies such as highly-integrated electric devices, optical disks, magneto-optical disks, and thermoelectric devices. In order to meet this requirement, we have developed a picosecond thermoreflectance method to measure thermal diffusivity of thin films of 100 nm thick and boundary thermal resistances between two layers. Information for the authors Authors are invited to submit electronic papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status. Submission will be electronically only. Only papers of PDF (.pdf), MS Word (.doc), RTF (.rtf) or PS (.ps) formats can be submitted. Compressed paper versions (.zip or .gz) are highly recommended. You are allowed to submit at most 2 formats of your paper. Detailed information about the submission process will be made available on the THERMINIC web page In case you experience any problems with the submission procedure, please contact the General Chair, Bernard Courtois, TIMA Laboratory, Grenoble, France. Accepted contributions will be included in Workshop Proceedings. Submission deadline 15 May 2004 Notification of acceptance 30 June 2004 Submission of manuscripts for distribution at the Workshop 24 August 2004 Vendor and book exhibition The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books. Special Issue of Journals Special Issues and special sections of leading periodicals have been organised regarding the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging). It is again expected to have special issues and special sections of leading periodicals as follow up of the Workshop 2004. Professional Development Course/Tutorial A Tutorial will be offered on 28 September, prior to the Workshop. Details will be published in the Programme booklet. Venue and Access The Workshop will be held in the Sophia Country Club Grand Hotel Mercure. Sophia Country Club Grand Hotel Mercure is situated in a 30-acre landscaped park in the heart of the Valmasque forest. At 15 minutes from Cannes and from Nice Côte d'Azur international airport, poised between the sea and the hills, Sophia Country Club Grand Hotel Mercure is a haven of greenery in the very heard of Sophia Antipolis, the world-famous site for business and leisure. At 15 minutes from Cannes famous Croisette. At 10 minutes from the beaches of Juan les Pins.

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