9th International Workshop on
24-26 September 2003,
Aix-en-Provence, France

Tuesday 23 September 2003


A Professional Development Course/Tutorial is being offered on

Tuesday 23 September from 9.30 to 17.00.

Registrations will be guarantied on a first come first serve basis, upon maximum capacity is reached.


Compact Modelling: Theory and Practice

Who should attend

All people who are involved in thermal management of electronic parts and systems will benefit from the course. The course covers all aspects of compact thermal modelling, from the history to the most recent innovations including software and standardisation aspects.
Designers will learn how to apply compact models in their daily life, providing them increased confidence in junction and solder joint temperature estimations.

Course layout

We have seen tremendous progress in the field of compact thermal models over the past eight years. The interest is driven by the need for increasingly accurate temperature prediction at board and system level thermal analysis. For this to be successful, a number of conditions should be fulfilled, among which the knowledge of sufficiently accurate component thermal data, most importantly junction and solder joint temperatures.
It is increasingly realised that the task of providing meaningful component thermal data should be the responsibility of the supplier, not of the customer. Hence, the most important aim of compact models is to replace the common thermal metrics such as Rth j-c and Rth j-a.
Many papers have been published demonstrating again and again the impressive accuracy that can be realized, dedicated optimization software is commercially available, novel test equipment has been developed for the purpose of calibrating detailed models, the theory is well understood including its limitations, compact model libraries are emerging, board and system level software increasingly accept CTMs, and recently the application area has been extended to the time domain. Last but not least, standardization protocols have been written and are currently discussed by the JEDEC 15.1 Thermal Characterization Standardization Committee.
It seems the right time to present a course highlighting all important aspects of compact modelling.

The following topics will be discussed:
  • History and background
  • Rth j-a and Rth j-c metrics
  • Boundary Condition Independent compact models
  • The creation of CTMs
  • Measurements for calibrating detailed models
  • On the achievable accuracy of CTMs
  • Software to create CTMs
  • Software supporting CTMs
  • Alternative approaches
  • Dynamic compact models
  • Standardisation aspects
  • Practical instructions

The course will be presented by Clemens Lasance (Philips Research), one of the 'godfathers' of compact model theory and John Janssen, (Philips Semiconductors) who was heavily involved in the practical aspects of compact model generation from a manufacturer's point of view and who is responsible for package characterisation within Philips Semiconductors.

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