9th International Workshop on
24-26 September 2003,
Aix-en-Provence, France



IEEE Computer Society

The Institute of Electrical & Electronics Engineers, Inc.

Test Technology Technical Council


IEEE Components, Packaging and Manufacturing Technology Society

General Chair
B. Courtois
TIMA Grenoble, France

Vice General Chair
M. Rencz
BUTE Budapest, Hungary

Programme Chairs
C. Lasance
Philips, The Netherlands

V. Székely
BUTE Budapest, Hungary

Programme Committee
H. Pape
Infineon Techn./Germany

W. Batty
U. of Leeds/UK

D. Blackburn

A. Shakouri
U. of California/USA

J. Parry

G. De Mey
Ghent U./Belgium

P. Raad
South. Methodist U./USA

Y. Scudeller
Lab. Thermocinétique/France

W. Claeys
U. Bordeaux/France

A. Tay

K. Azar

G. Wachutka
TU München/Germany

M. Baelmans

A. Napieralski
TU Lodz/Poland

E. Jones
US Air Force/USA

Y. Gianchandani
U. of Michigan/USA

Y. Zorian

D. Agonafer
U. of Texas/USA

M. Kimura
Tohoku-Gakuin U./Japan

P. Tadayon

N. Sabry
Mentor Graphics/Egypt

A. Rubio

J. Rantala

J. Samitier
U. of Barcelona/Spain

F. Christiaens
Alcatel Bell/Belgium

D. Copeland

O. Slattery

G. Digele
The Boston Cltg/Germany

B. Guenin

E. Driessens

P. Rodgers

Y.C. Gerstenmaier

Y. Joshi
the Georgia Institute of Technology/USA

J.B. Saulnier

I. Barsony

J. Janssen
Philips/The Netherlands

Call for Papers

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc..., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.
The Workshop is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the IEEE Solid-State Circuits Society French Chapter.

Areas of interest:

The areas of interest range from thermal investigations in microstructures to thermal management of electronic systems.

  • Thermal and Temperature Sensors
  • Thermal Simulation
  • Electro-thermal Simulation
  • Thermal Modelling and Investigation of Packages
  • Reliability Issues
  • High Temperature Electronics
  • Heat Transfer Education
  • Flow Visualisation Techniques
  • Turbulence Modelling in Complex Geometrics
  • Thermal Characterization
  • Measurement of Thermal Properties
  • Acquisition and Analysis of Thermal data
  • Temperature Mapping
  • Novel and Advanced Cooling Techniques
  • Thermal Performance of Interconnects
  • Heat Transfer Enhancement
  • Validation of Thermal Software
  • Coupled (Thermo-mechanical, Thermo- optical, etc.) Effects.

Technical Programme:

The programme will include oral talks, poster presentation, a panel discussion and invited talks given by prominent speakers.

Invited talks:

Invited talks will include:

"Chip- and package-level thermal management of power modules for field reliability of power systems" by Krishna Shenai, The University of Illinois at Chicago, USA
In the information age, reliability of power systems used in the information processing equipment is of paramount importance. Demands for 99.9999999% reliable operation in the field is not uncommon. This talk will address some fundamental issues on silicon-level and package related thermal management of power modules used in computer/telecommunication power supplies. We will develop a new understanding of the thermal management and highlight the importance of advanced thermal models to accurately predict the long-term reliability of power systems.

"On chip solid state cooling for integrated circuits" by Ali Shakouri, University of California, Santa Cruz, USA
Recent advances in SiGe and InP-based thin film thermoelectric/thermionic coolers will be described. Localized and high cooling power densities exceeding hundreds of watts per centimeter square have been achieved. Prospects for hot spot removal in ICs and temperature stabilization of optoelectronic devices will be discussed.

Information for the authors:

Authors are invited to submit electronic papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status. Submission will be electronically only. Only papers of PDF (.pdf), MS Word (.doc), RTF (.rtf) or PS (.ps) formats can be submitted. Compressed paper versions (.zip or .gz) are highly recommended. You are allowed to submit at most 2 formats of your paper. Detailed information about the submission process will be made available on the THERMINIC web page
In case you experience any problems with the submission procedure, please contact the General Chair, Bernard Courtois TIMA Laboratory, Grenoble, France.

Accepted contributions will be included in Workshop Proceedings.
Submission deadline: 18 April 2003
Notification of acceptance: 6 June 2003
Submission of manuscripts for distribution at the Workshop: 22 August 2003

Vendor and book exhibition:

The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books.

Special Issue of Journals:

Special Issues and special sections of leading periodicals have been organised regarding the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging). It is again expected to have special issues and special sections of leading periodicals as follow up of the Workshop 2003.

Professional Development Course/Tutorial:

A Tutorial will be offered on 23 September, prior to the Workshop. Details will be published in the Programme booklet.


The Workshop will be held in the Holiday Inn in Aix-en-Provence, France.
The Holiday Inn Aix-en-Provence offers leisurely discovery of the central district, including the rich historic and cultural attractions of the famous Mirabeau Square.

Holiday Inn Garden Court Aix-en-Provence is situated at 5 minutes walking from the heart of Cézanne birth place.

Aix-en-Provence, is a charming and yet lively university town, rich in historic and cultural heritage. Once the capital of the Provence region, it possesses magnificent 17th and 18th Century architecture, ranging from town houses, churches and private hotels/museums to the typical grand ancient fountains. The beauty of Aix countryside dominated by Sainte Victoire Mount, has been immortalized by the famous artist Paul Cézanne and this, along with the colourful markets, crowded "café" terraces and the typical "Provence" gourmet food and wine beckons visitors from all over the world to Aix-en-Provence.

The hotel is easily accessible by air (25km from Marseille Provence Airport, by road with motorways A8 and A51 (exit Aix Ouest, Encagnane, Jas de Bouffan) and by rail (1km to the train station).

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