8th International Workshop on
THERMal INvestigations of ICs and Systems

1-4 October 2002,
Madrid, Spain.

Sponsored by the IEEE Computer Society, Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the IEEE Solid-State Circuits Society French Chapter.

Wednesday 2 October 2002

8:00 Registration
9:30 Welcome address: B. Courtois,
TIMA Laboratory, Grenoble, France

9:40 Invited talk 1: Thermal management of CPUs: A perspective on trends, needs and solution opportunities
R. Mahajan
, INTEL Group, Chandler, AZ, USA

Chair: C.J.M. Lasance, Philips Research Laboratories, Eindhoven, The Netherlands

10:20 Session 1: Thermal measurements and modelling

Chair: P. Rodgers, Electronics Thermal Management, Ireland

10:20 P.L. Komarov, M.G. Burzo, G. Kaytaz, P.E. Raad, Southern Methodist U., Dallas, USA Transient thermo-reflectance measurements of the thermal conductivity and interface resistance of metallized natural and isotopically-pure silicon
10:40 M. Rencz, MicReD, Budapest, Hungary
V. Székely, TU Budapest, Hungary
Studies on the error resulting from neglecting nonlinearity effects in dynamic compact model generation
11:00 D. Schweitzer, H. Pape, Infineon Technologies AG, München, Germany Thermal transient modeling and experimental validation of power packages
11:20 S. Carubelli, K. Oulahoum, Z. Khatir, INRETS, Arcueil, France Experimental validation of a new thermal modelling method dedicated to a multichip power module under working condition
11:40 Break
12:00 Posters session 1
Posters are introduced by one slide in 2 minutes each

Chair: M. Rencz, BUTE, Budapest, Hungary

  M. Ivanova, Y. Avenas, K. Ouattara, G. Kapelski, Ch. Schaeffer, LEG, Saint Martin d'Hères, France Application of sintered metal powder in power electronics cooling
  J. Broadbent, S. Lin, Thermacore Europe, Northumberland, United Kingdom Therma-bus®, next generation telecom cabinet cooling solution
  G.E. Cossali, D.A. Di Pietro, M. Marengo, TFHT - U. of Bergamo, Dalmine, Italy Design of a cooling system with microchannels for a high energy physics particle detector
  M. Checchetti, MicrOptronics, Milano, Italy HMW THS - large heat sinks with forced internal convection
  P. He, L. Liu, L. Tian, Z. Li, Tsinghua U., Beijing, China Measurement of thermal conductivity of buried oxides of SOI by SIMOX
  E. Driessens, B. Vandevelde, E. Beyne, IMEC, Heverlee Belgium
D. Corlatan, E. Roose, Alcatel Bell, Antwerpen, Belgium
Experimental validation of a star-shaped thermal compact model of underfilled flip chip assemblies
  Z. Suszynski, R. Arsoba, TU. of Koszalin, Poland
A. Napieralski, W. Tylman, TU. of Lódz, Poland
Infrared detection of delaminations using induction heating
  P. Pruja, B. Claudet, M. Polit, LP2A Perpignan, France
O. Gagliano, J-J. Serra, DGA/CTA/LOT/GHF, Font Romeu, France
Photothermal microanalysis of thermal discontinuities in metallic samples
  E. Montané, J-L. Merino, M. Puig-Vidal, S. Bota, J. Samitier, U. de Barcelona, Spain An electronic system to control the ignition of an array of mpyrotechnic nodes
  G.T. Penalva, A.A. López, À.B. del Campo, F-J.O. González, UPM, Madrid, Spain New indirect electrical method for thermal characterisation of MMIC power amplifiers
  W. Nailong, Z. Runde, L. Miao, IME of Tsinghua U., Beijing, China Cell-level thermal placement optimization for high-performance VLSI chips design
  S. Koziel, W. Szczesniak, TU of Gdansk, Poland Reducing average and peak themperatures of VLSI CMOS circuits by means of evolutionary algorithm
  T. Joo Goh, Intel Products, Kedah Darul Aman, Malaysia
K.N. Seetharamu, G.A. Quadir, Z.A. Zainal, U. Sains Malaysia, Penang, Malaysia
Thermal investigations of multiple heat sources within silicon chip
  S.P Matova, K.A.A. Makinwa, J.H. Huijsing, Delft U. of Technology, The Netherlands Modeling and compensation of packaging asymmetry in a 2-D wind sensor
  K. Górecki, W.J. Stepowicz, A. Loziñski, Gdynia Maritime U., Poland Thermal performance of LSCO and LSFO films for IR detectors
  V. Guarnieri, A. Bagolini, V. Micheli, M. Filippi, F. Moscon, F. Giacomozzi, B. Margesin, M. Zen, ITC-IRST, Povo, Italy
R. Pal, M. Decarli, G. Soncini, U. of Trento, Mesiano, Italy
Cr/Ni/Au multilayer films for high temperature MEMS applications
13:30 Lunch
15:00 Vendor's session: B. Courtois,
TIMA Laboratory, Grenoble, France

16:00 Session 2: Sensors and MEMS

Chair: P. Raad, Southern Methodist U., Dallas, USA

16:00 V. Székely1, M. Rencz1-2, E. Kollár1, J. Mizsei1
1BUTE, Budapest, Hungary
2MicReD, Budapest, Hungary
Heat-flux sensor for the thermal measurement of IC packages
16:20 D. Meunier, D. Tsamados, J. Boussey, IMEP, ENSERG, Grenoble, France
S. Tardu, LEGI, Grenoble, France
Realization and simulation of wall shear stress integrated sensor
16:40 Break
17:00 L. Chu1, Y. Gianchandani1-2
1U. of Wisconsin, Madison, USA
2U. of Michigan, Ann Arbor, USA
An electrothermally actuated, feedback controlled 2D micropositioner with sub-nanometer resolution
17:20 L. Chu, D. Nelson, A.D. Oliver, Y.B. Gianchandani, U. of Michigan, Ann Arbor, USA Polysilicon grain transformations and performance drift in electrothermal microactuators
17:40 O. Slattery, D. O'Mahoney, E. Sheehan, F.Waldron, NMRC, Cork, Ireland Source of variation in piezoresistive stress sensor measurements
18:00 J.H. Lee1, M.H. Li1, Y.B. Gianchandani1-2
1U. of Wisconsin, Madison, USA
2U. of Michigan, Ann Arbor, USA
Photoresist metrology and microcalorimetry using an ultracompliant micromachined scanning thermal probe
18:30 Cocktail

Thursday 3 October 2002

8:30 Invited talk 2: Advanced cooling concepts and their challenges
K. Azar
, Advanced Thermal Solutions, Inc., Norwood, USA

Chair: G. De Mey, Ghent U., Belgium

9:10 Session 3: Liquid cooling

Chair: A. Ortega, U. of Arizona, USA

9:10 S. Murthy, U. of Maryland, College Park, USA
Y. Joshi, Georgia Institute of Technology, Atlanta, USA
W. Nakayama, ThermTech International, Kanagawa, 255-0004, Japan
Orientation independent two-phase heat spreaders for space constrained applications
9:30 R. Khodabandeh, B. Palm, Royal Institute of Technology, Stockholm, Sweden Thermosyphon concept for cooling of PCB
9:50 S.N. Heffington, W.Z. Black, A. Glezer, Georgia Institute of Technology, Atlanta, USA Two-phase spray cooling thermal management of microelectronic packages using vibration-induced droplet atomization heat transfer cells
10:10 R. Mahalingam, N. Rumigny, A. Glezer, Georgia Institute of Technology, Atlanta, USA Synthetic jet ejector heat sinks for high heat transfer at low flow rates
10:30 Break
11:00 Posters session 2
Posters are introduced by one slide in 2 minutes each

Chair: M. Rencz, BUTE, Budapest, Hungary

  L. Codecasa, D. D'Amore, P. Maffezzoni, Politecnico di Milano, Italy
W. Batty, U. of Leeds, United Kingdom
Multi-point moment matching reduction of distributed thermal networks
  L. Codecasa, D. D'Amore, P. Maffezzoni, Politecnico di Milano, Italy Parameters for multi-point moment matching reduction of thermal networks
  Y. Tal, A. Nabi, Rafael, Haïfa, Israel Generating engineering-boundary-condition-independent two-resistors compact-thermal-model by means of the MTSA approach
  L-D. Patino-Lopez, S. Dilhaire, S. Grauby, J-M. Rampnoux, S. Jorez, W. Claeys, U. Bordeaux I, France Thermal self induction in PN thermoelectric couple. Determination of the dynamic electrical equivalent model
  S. Du, Andrew Corporation, Addison, USA A new effective thermal resistance parameter for RF transistors
  K. Skadron, M. Stan, M. Barcella, A. Dwarka, W. Huang, Y. Li, Y. Ma, A. Naidu, D. Parikh, P. Re, G. Rose, K. Sankaranarayanan, R. Suryanarayan, S. Velusamy, H. Zhang, Y. Zhang, U. of Virginia, Charlottesville, USA HotSpot: techniques for modeling thermal effects at the processor-architecture level
  N. Cordero, J. West, H. Berney, NMRC, Cork, Ireland Thermal modelling of ohmic heating micro-reactors
  T.S. Shelar, G.S. Visweswaran, Indian Institute of Technology Delhi, New Delhi, India Electro thermal modeling of MOSFET and it's application to analog integrated circuit simulation
  M. Macchiaroli, V. d'Alessandro, G. Breglio, N. Rinaldi, P. Spirito, U. of Naples "Federico II", Italy Improved electro-thermal simulation of power devices
  J. Palacín, M. Salleras, S. Marco, J. Samitier, U. de Barcelona, Spain Optimization of dynamic compact thermal models using genetic algorithms
  X. Lin, P. He ,L. Tian, Y. Dong, M. Chen, X. Wang, Tsinghua U., Beijing, China Thermal analysis of DSOI (Drain/Source On Insulator) MOSFETs
  M. Malinski, TU of Koszalin, Poland A modified approach to the analysis of piezoelectric photoacoustic spectra
  N. Semmar, C. Georges, C. Boulmer-Leborgne, GREMI-CNRS-U. d'Orléans, France The melting kinetics of thin film coatings irradiated by nanosecond pulsed lasers
  I. Godovitsyn, O. Sveen, U. of Oslo, Norway Electro-thermo-mechanical simulation of surface-micromachined piezoresistive pressure sensors
13:00 Lunch
14:30 Session 4: Thermal and Electro thermal simulation

Chair: A. Poppe, BUTE, Budapest, Hungary

14:30 L. Codecasa, D. D'Amore, P. Maffezzoni, Politecnico di Milano, Italy Electro-thermal analysis of silicon junctions at second breakdown
14:50 W. Batty, C.M. Snowden, U. of Leeds, United Kingdom
C.E. Christoffersen, Lakehead U., Ontario, Canada
A.B. Yakovlev, The U. of Mississippi, Oxford, USA
J.F. Whitaker, A. Mortazawi, R. Reano, K. Yang, L.P.B. Katehi, U. of Michigan, Ann Arbor, USA
A. Al-Zayed, M. Ozkar, S. Ortiz, M.B. Steer, North Carolina State U., Raleigh, USA
Electro-thermal simulation a complex design example: the spatial power combining MMIC array
15:10 M.R. Casu, M. Graziano, G. Masera, G. Piccinini, M. Zamboni, Politecnico di Torino, Italy Coupled electro-thermal modeling and optimization of clock networks
15:30 X. Jorda, M. Vellvehi, F. Madrid, P. Godignon, S. Hidalgo, Centre Nacional de Microelectronica, Cerdanyola del Valles, Spain
N. Schofield, U. of Sheffield, Sheffield, United Kingdom
Thermal characterisation and simulation of water-cooled igbt power modules for electric vehicle application
15:50 Break
16:10 Session 5: Thermal modelling

Chair: D. Blackburn, NIST Gaithersburg, USA

16:10 Embedded tutorial: Dynamic compact thermal models: an overview of current and potential advances

M.N. Sabry, Mentor Graphics, Egypt

16:40 L. Codecasa, D. D'Amore, P. Maffezzoni, Politecnico di Milano, Italy
W. Batty, U. of Leeds, United Kingdom
Multi-point moment matching reduction of distributed thermal networks
17:00 M. Janicki, A. Napieralski, TU of Lòdz, Poland Analytical transient solution of heat equation with variable heat transfer coefficient
17:20 V. Kyyhkynen, Nokia Research Center, Helsinki, Finland
J. Valtanen, R. Heikkilä, E. Ristolainen, Tampere U. of Technology, Finland
Synthesis of thermal RC-networks for system-in-packages
20:30 Social event: Café de Chinitas

Friday 4 October 2002

8:30 PROFIT special half-day on reliability

Chair: K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA

8:30 Session 6: Characterisation of thermal systems
8:30 C.J.M. Lasance, Philips Research Laboratory, Eindhoven, The Netherlands About the influence of area-averaged heat transfer coefficients on the accuracy of BCI compact thermal models in CFD simulations
8:50 O. Leon, G. De Mey, E. Dick, U. of Ghent, Belgium Study of the optimal layout of cooling fins in forced convection cooling
9:10 C.A. Tomazeti, C. Altemani, State U. of Campinas, Brazil A compact model for heat sinks with experimental verification
9:30 G. Janssen, A. Leroux, A. Kole, P. Maessen, E. Eggink
R. van Galen, Philips CFT, Eindhoven, The Netherlands
The use of thermal maps in thermal management
9:50 M.N. Poyyapakkam, Y.K. Joshi, Georgia Institute of Technology, Atlanta, USA Computational simulations of server room cooling - a parametric study
10:10 J. Parry, Flomerics Ltd, Hampton Court, United Kingdom
H. Pape, D. Schweitzer, Infineon Technologies, München, Germany
J. Janssen, Philips Semiconductors, Nijmegen, The Netherlands
Transient performance of common modeling assumptions used in detailed thermal package models
10:30 Break
11:00 Embedded tutorial: Emerging thermal challenges in electronics driven by performance, reliability and energy efficiency

Y. Joshi, Georgia Institute of Technology, Atlanta, GA, USA

11:30 Panel: How well can we assess thermally driven reliability issues in electronic systems today ?

Moderator: Yogendra Joshi, Georgia Institute of Technology, Atlanta, GA, USA


  • Dave Blackburn, NIST, USA
  • Clemens Lasance, Philips Research, The Netherlands
  • Kaveh Azar, Advanced Thermal Solutions, Inc., Norwood, USA
  • Ravi Mahajan, Intel, USA
  • Jukka Rantala, Nokia, Finland
13:00 Lunch
14:30 Session 7: Thermal aspects of ICs and PCBs

Chair: M-N. Sabry, Mentor Graphics, Egypt

14:30 Y.C. Gerstenmaier, N. Seliger, Siemens, München, Germany
G. Wachutka, München U. of Technology, Germany
Efficient calculation of transient temperature fields responding to fast changing heat-sources over long duration in high frequency DC/DC converter
14:50 K. Torki, F. Ciontu, TIMA, Grenoble, France IC thermal map from digital and thermal simulations
15:10 I. Kazymyra, M. Blyzniuk, I. Farmaga, Lviv Polytechnic National U., The Ukraine Pre-layout estimation of ICS schematic susceptibility to the non-uniform temperature field distribution
15:30 A. Nabi, L. Keysar, Y. Tal, Rafael, Haïfa, Israel Application of thermal-vias to reduce conduction thermal resistance at the edge of electronic boards
15:50 Closing remarks: B. Courtois,
TIMA Laboratory, Grenoble, France

Friday 4 October 2002

17:00 Tutorial

An Evening Tutorial is being offered on Friday 3rd October 2002 from 17.00 to 19.00. Attendance to the tutorial is free of charge.

  • Raising the awareness of electrical engineering students for thermal issues by A. Poppe, BUTE, Budapest, Hungary.

    This evening tutorial is organised in co-operation with the REASON IST-2000-30193 project of the EU, aiming to raise system designers' awareness of thermal problems in university and continuing education. The topics covered by this tutorial include among others the following subjects: the need to consider thermal dynamics of systems, thermal measurement techniques, evaluation of thermal measurement results, affordable thermal simulation techniques, simulation vs. measurement, thermal model generation, etc. After the discussion, a few case studies will highlight the above-mentioned topics.

    About Andras Poppe:
    Andras Poppe has been with BUTE since 1989. He received his PhD in 1996. He has been a member of Prof. Szekely's thermal research team for more then 7 years. Now he is an associate professor at the Department of Electron Devices of BUTE and is actively participating in the development of different software tools in the thermal field.

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