8th International Workshop on
THERMal INvestigations of ICs and Systems

1-4 October 2002,
Madrid, Spain.



IEEE Computer Society

The Institute of Electrical & Electronics Engineers, Inc.

Test Technology Technical Council


IEEE Components, Packaging and Manufacturing Technology Society

General Chair
B. Courtois
TIMA Grenoble, France

Vice General Chair
M. Rencz
TU Budapest, Hungary

Programme Chairs
C. Lasance
Philips, The Netherlands

V. Székely
TU Budapest, Hungary

Programme Committee
W. Claeys
U. Bordeaux/France

I. Barsony

D. Blackburn
NIST Gaithersburg/USA

G. De Mey
U. Gent/Belgium

E. Suhir
Bell Laboratories/USA

E. Jones
US Air Force/USA

Y. Zorian

A. Tay
NU Singapore/Singapore

U. Dillner

J. Parry

J. Rantala

Y. Joshi
U. of Maryland/USA

N. Sabry
Mentor Graphics/Egypt

H. Pape
Infineon Technologies/Germany

J. Samitier
U. Barcelona/Spain

D. Copeland

P. Tadayon

K. Shenai
U. of Illinois/USA

F. Christiaens
Alcatel Bell/Belgium

J. Janssen
Philips/The Netherlands

G. Digele
The Boston Cltg/Germany

E. Driessens

P. Raad
Southern Methodist U./USA

D. Agonafer
U. of Texas/USA

P. Rodgers

Y.C. Gerstenmaier

W. Batty
U. of Leeds/UK

Y. Scudeller
Lab. Thermocinétique, Nantes/France

J.B. Saulnier

A. Napieralski
TU Lodz/Poland

G. Wachutka
TU München/Germany

M. Kimura
U. Tohoku/Japan

A. Nabi

O. Slattery

D. De Cogan
U. of East Anglia/UK

A. Bar-Cohen
U. of Minnesota/USA

M. Baelmans

A. Rubio

Call for Papers

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.

The Workshop is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the IEEE Solid-State Circuits Society French Chapter.

Areas of interest:

The areas of interest range from thermal investigations in microstructures to thermal management of electronic systems.

Thermal and Temperature Sensors
Thermal Simulation
Electro-thermal Simulation
Thermal Modelling and Investigation of Packages
Reliability Issues
High Temperature Electronics
Heat Transfer Education
Flow Visualisation Techniques
Turbulence Modelling in Complex Geometrics
Thermal Characterization
Measurement of Thermal Properties
Acquisition and Analysis of Thermal Data
Temperature Mapping
Novel and Advanced Cooling Techniques
Thermal Performance of Interconnects
Heat Transfer Enhancement
Validation of Thermal Software
Coupled (thermo-mechanical, thermo-optical, etc...) Effects

Technical Programme:

The programme will include oral talks, poster presentation, a panel discussion and invited talks given by prominent speakers.

Invited talks:

Invited talks are scheduled.

"Thermal Management of CPUs: A Perspective on Trends, Needs and Solution Opportunities", by R. Mahajan, INTEL Group, Chandler, AZ, USA.

This talk will trace the evolution of thermal management requirements for CPUs and extrapolate them into the future. It will highlight the consequences of proceeding along current trends and demonstrate the existence and impact of a power wall as a result of technical, cost and performance trends. Opportunities for basic and applied work in thermal management will then be identified and elucidated.

"Emerging Thermal Challenges in Electronics Driven by Performance, Reliability and Energy Efficiency" by Y. Joshi, Georgia Institute of Technology, Atlanta, GA, USA. This talk will be an embedded tutorial, that will be given just in front of a panel dealing with 'How well can we assess thermally driven reliability issues in electronics systems today ?".

The talk will focus on: i) MEMS - based high performance cooling, ii) a reliability based framework for power electronics, and iii) issues of energy efficiency. Some information from the upcoming NEMI roadmap will also be included.

Professional Development Course/Tutorial:

A Tutorial will be offered on Tuesday 1st October, prior to the Workshop.

"Thermal Design Basics and Calculation of Air Cooling Limits", by K Azar, Advanced Thermal Solutions, Inc., Norwood, USA.

From the inception of electronics, cooling by air has been the most desired and broadly implemented method in the industry. As materials, function, configuration and power dissipation of electronic systems have gone through, and will continue to experience broad changes, the question of effectiveness/practicality of air-cooling continues to surface. This is further amplified by data from different industry sectors claiming to have reached the limits of air-cooling. Hence, uttering heat flux data that beyond which higher mode of cooling is necessary ! Such product-specific data has caused a concern in the industry as to wether air-cooling is a limiting option thus, higher modes of cooling are required. In this course a methodical procedure is presented for the designers to quickly calculate system performance with a given cooling option and determine the most suitable technique for the system at hand. The course is presented in two parts, the first part is designed to provide the basic calculation methodologies, and the second part address the issue of air-cooling as an option. The first part of the course will deal with basic calculations for thermal design. The second part will deal with the limits of air cooling.

Vendor and book exhibition:

The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books.


The Workshop will be held in Hotel Husa Princesa in Madrid, Spain. Hotel Husa Princesa is located in a lively shopping and entertainment area, within walking distance from the cultural attractions, such as the Palacio Real (The Royal Palace), Teatro de la Opera (The Opera House), Plaza Mayor (The Main Square), very close to the University and to Madrid's business centre.

Information for the authors:

Authors are invited to submit electronic papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status. Submission will be electronically only, through the Web page (click on "Submit a Paper"). Fill in the questionnaire and attach your PDF file where appropriate. Don't submit multiple files for a single paper. Once your submission has been checked (viewing and printing quality), you will receive an acknowledgement by e-mail. You should first prepare a file in PDF format, corresponding to either an extended summary or to the full paper. Please note that uncompressed unencapsulated postscript is the single alternative format and should be used only when absolutely necessary. Use the contact author's last name as file name; add numerals in the case of multiple submissions (e.g., lo1, lo2).

In case you experience any problems with the submission procedure, please contact the General Chair.

Accepted contributions will be included in Workshop Proceedings.

Submission deadline: 19 April 2002
Notification of acceptance: 7 June 2002
Submission of manuscripts for distribution at the Workshop: 23 August 2002

Special Issue of Journals:

Special Issues and special sections of leading periodicals have been organised regarding the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging). It is again expected to have special issues and special sections of leading periodicals as follow up of the Workshop 2002.

Copyright © 2002 Laboratoire TIMA.
Tous droits réservés.