| 7th International Workshop on THERMal INvestigations of ICs and Systems
plus a special |
Monday 24 September
Two Professional Development Courses/Tutorials (A and B) are being offered on Monday 24 September, from 9.30 a.m. to 5 p.m. They will run in parallel. Registrations will be guarantied on a first come first serve basis, upon maximum capacity is reached.
A. "Thermal Design Basics and Calculation of Air Cooling Limits"
K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA
From the inception of electronics, cooling by air has been the most desired and broadly implemented method in the industry. As materials, function, configuration and power dissipation of electronic systems have gone through, and will continue to experience broad changes, the question of effectiveness/practicality of air-cooling continues to surface. This is further amplified by data from different industry sectors claiming to have reached the limits of air-cooling. Hence, uttering heat flux data that beyond which higher mode of cooling is necessary! Such product-specific data has caused a concern in the industry as to whether air-cooling is a limiting option thus, higher modes of cooling are required. In this course a methodical procedure is presented for the designers to quickly calculate system performance with a given cooling option and determine the most suitable technique for the system at hand. The course is presented in two parts, the first part is designed to provide the basic calculation methodologies, and the second part address the issue of air-cooling as an option. The first part of the course will deal with basic calculations for thermal design. The second part will deal with the limits of air cooling.
About Kaveh Azar:
Dr. Kaveh Azar is the President and CEO of Advanced Thermal Solutions, Inc. (ATS). Prior to this new appointment, Dr. Azar was the founder and manager of Lucent Technologies thermal management center, responsible for developing the next generation of cooling systems. In addition, Dr. Azar has authored Lucent's thermal roadmap and served as the corporate thermal consultant. While at Lucent, he developed a state-of-the- art thermal/fluids laboratory for simulation of components, boards and systems. Since 1985, Dr. Azar has been an active participant in electronics thermal community and has served as the organizer, general chair and the keynote speaker at the national and international conferences sponsored by ASME, IEEE and AIAA. He has also been an invitee to national bodies such as NSF, NIST and NEMI for organizing government and industry research goals in electronics cooling. Dr. Azar has been an adjunct professor at a number of universities, and lecturers worldwide in analytical and experimental methods in electronics cooling. He holds more than 26 national and international patents, has published more than 58 articles, 3 book chapters and a book entitled, "Thermal Measurements in Electronics Cooling". In addition, he serves as the Editor-in-Chief of the Electronics Cooling Magazine, and was awarded IEEE SEMITHERM Significant Contributor Award in the thermal management of electronics systems.
W. Nakayama, ThermTech International, Kanagawa, Japan
Shrinking system dimensions and higher packaging density are the norm in the evolution of electronic equipment. From portable computers to massively parallel processors, the internal space of the system box becomes a precious commodity to be shared by the electronic components and the cooling media. The space availed for cooling media, the power input to the electronic devices, and the allowable temperature potential are mutually affecting design parameters, and they can be regarded as tradable resources in an effort to maximize the system performance and reliability. While such concept helps to capture the technical aspects of product design from a strategic viewpoint, the management of time, human, and capital resources is also needed to streamline the design jobs. A particularly important step in the job stream is quick assessment of the impacts of new cooling devices and techniques on the product design on hand. The following topics will be covered: evolution of hardware morphologies, resource allocation in the system design, effectiveness of various cooling methods in tight space, possible impacts of micro-fabrication based cooling technologies, development of an infrastructure to support product innovation.
About Wataru Nakayama:
Wataru Nakayama is an internationally recognized expert on thermal management of electronic equipment. He has developed his expertise on the subject from his experience of about thirty years in the industry and the universities. He received the Dr. of Engineering degree from the Tokyo Institute of Technology in 1966. He worked for Hitachi, Ltd. as a Heat Transfer Specialist from 1970 to 1993. From 1989 to 1996, he taught at the Tokyo Institute of Technology and conducted research on power and thermal management of computers. He was associated with CALCE Electronic Packaging Research Center, University of Maryland, from 1996 to 1998. Dr. Nakayama has authored and co-authored more than 200 technical papers, 4 books, and several handbooks. He received several prominent awards including the JSME Technology Award in 1978, the ASME Heat Transfer Memorial Award in 1992, the ASME Electrical & Electronic Packaging Division Award in 1996, the JSME Longstanding Contributions Award in 1997, and the ITHERM Achievement Award in 2000. He is an Honorary Member of the Heat Transfer Society of Japan, a Fellow of ASME and a Senior Member of IEEE. He served as co-chairs of conferences and on boards of the societies including the President of the Heat Transfer Society of Japan, 1990. Dr. Nakayama is currently running an independent consulting firm specializing in thermal management of electronic equipment. He is also associated with Department of Mechanical Engineering, University of Maryland.
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