Sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the DETERMIN Project supported by the European Commission.

Tuesday 25 September 2001
8:00	Registration
9:30	Welcome address: B. Courtois, TIMA Laboratory, Grenoble, France
9:40	Invited talk 1: High-Power Robust Semiconductor Electronics Technologies in the New Millennium K. Shenai, U. of Illinois, Chicago, USA Chair: V. Székely, BUTE, Budapest, Hungary
10:20	Session 1: Dynamic Compact Models Chair: H. Pape, Infineon, Munich, Germany
10:20	Y.C. Gerstenmaier1, G. Wachutka2 1Siemens AG, Munich, Germany 2Institute for Physics of Electrotechnology, Munich, Germany	Rigorous Model and Network for Transient Thermal Problems
10:40	W. Batty, A.J. Panks, S. David, R.G. Johnsonand, C.M. Snowden U. of Leeds, United Kingdom	Series Acceleration o a Compact Thermal Model and Fast Non Linear Optimisation of Electrothermal Device Design
11:00	T. Franke1, U. Froehler2 1Siemens AG, Munich, Germany 2Infineon, Munich, Germany	Boundary Independent Model for Multichip Packages
11:20	L. Codecasa, D. D'Amore, P. Maffezzoni Politecnico di Milano, Italy	Moment Matching Order Reduction of Discretized Thermal Network
11:40	Break
12:00	Session 2: System Level Thermal Analysis Chair: K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA
12:00	J. Parry1, J. Rantala2, C. Lasance3 1Flomerics, Hampton Court, United Kingdom 2Nokia, Helsinki, Finland 3Philips, Eindhoven, The Netherlands	Embedded Tutorial: Temperature and Reliability in Electronics Systems - The Missing Link ?
12:20	V. Eveloy1, J. Lohan1, P. Rodgers2 1Galway-Mayo Institute of Technology, Ireland 2Advanced Thermal Solutions, Norwood, USA	On Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection
12:40	H. Pape Infineon, Munich, Germany	Treatment of Convection and Radiation without CFD in Thermal Resistance Calculations
13:00	Lunch
14:30	Vendor's session: B. Courtois, TIMA Laboratory, Grenoble, France
15:30	Session 3: Advances in Package Cooling Solutions-I Chair: A. Ortega, U. Arizona, USA
15:30	V. Sartre, M. Lallemand Centre de Thermique de Lyon, France	Embedded Tutorial: State of the Art in Theoretical Investigations on Micro Heat Pipes for the Thermal Control of Microelectronics
15:50	Y. Avenas1, B. Mallet1, C. Gillot2, A. Bricard4, C. Schaeffer1, G. Poupon3, E. Fournier2 1LEGrenoble, France 2CNES, Toulouse, France 3CEA/LETI, Grenoble, France 4CEA/GRETh, Grenoble, France	Thermal Spreaders for High Heat Flux Power Devices
16:10	O. Karim, M. Hugon, M. Vergnes, C. Gillot, J-C. Crebier, C. Schaeffer Laboratoire d'Electrotechnique de Grenoble, France	Cooling Device 'Moducal' Thermal Characterisation
16:30	Break
16:50	Posters session Posters are introduced by one slide in 3 minutes each Chair: M. Rencz, BUTE, Budapest, Hungary
	P. Fürjes1, Zs. Vizváry2, Cs. Dücsó1, I. Bársony1 1Research Inst. for Technical Physics and Materials Science - MFA, Budapest, Hungary 2BUTE, Budapest, Hungary	Thermal Investigation on a Micro Gas-Flow Sensor
	N. Semmar, C. Boulmer-Leborgne GREMI, Orléans, France	Thermal Behaviour of Electric Component Coating Irradiated by a Laser Beam
	A.N. Shmyryeva1, K.D. Scurtul1, N.V. Starodub2 1National TU of Ukraine "KPI", Kiev, The Ukraine 2Institute of Biochemistry of Ukrainian National Academy of Sciences, Kiev, The Ukraine	Temperature Sensors of Composition Thin Films Based of Cerium Oxide
	N.V. Starodub1, A.N. Shmyryeva2, K.D. Scurtul2 1Institute of Biochemistry of Ukrainian National Academy of Sciences, Kiev, The Ukraine 2National TU of Ukraine "KPI", Kiev, The Ukraine	Thin-Film Temperature Sensors
	I. Khorunzhii1, A. Ulyashin1, R. Job1, H. Gabor1, W.R. Fahrner1, D. Brunner2, U. Peschek2 1FernU., Hagen, Germany 2ANCeram GmbH & Co.KG, Bindlach, Germany	Raman Spectra Iinvestigation for AlN Ceramics with Different Thermal Conductivity
	M. Janicki1,2, P. Kawka1,2, O. Leon2, G. de Mey2, A. Napieralski1 1TU of Lódz, Poland 2Ghent U., Belgium	Investigation of Circuit Forced Convection Air Cooling in Low Speed Wind Tunnel
	E. Kehoe, R. Grimes, M. Davies U. of Limerick, Ireland	Mixed Convection Criteria for a Printed Circuit Board
	J.A. Liburdy Oregon State U., Corvallis, USA	Enhanced Heat Transfer Potential Using Jet Arrays and Contoured Surfaces
	Z. Suszynski TU of Koszalin, Poland	Infrared Investigation of Power Transistor
	D.G. Wang NCR Corp., San Diego, USA	Methodology for Junction Temperature Evaluation
	J. Altet1, A. Rubio1, S. Dilhaire2, J-M. Rampnoux2, S. Grauby2, S. Jorez2, L.D. Patino Lopez2, W. Claeys2, J-C. Batsale3 1U. Politècnica de Catalunya, Barcelona, Spain 2CMOPH/U. Bordeaux I, Talence, France 3LEPT/ENSAM/CNRS, Talence, France	Characterisation of the Thermal Disturbance Generated by a Periodic Feat Source in an Integrated Circuit: Application to Defect Diagnosis
	X. Chauffleur1, J-P. Fradin1, F. Beaudoin2, P.E. Perdu2, R. Desplats2, D. Lewis3 1Epsilon Ingénierie, Labège, France 2CNES-THALES laboratory, Toulouse, France 3IXL, U. Bordeaux 1, Talence, France	Modeling Thermal Laser Stimulation
	Zs. Vizváry1, P. Fürjes2, I. Bársony2 1BUTE, Budapes, Hungary 2Research Inst. for Technical Physics and Materials Science - MFA, Budapest, Hungary	Thermomechanical Analysis And Optimisation Of Two Beam-Type Hotplates
	W. Batty1, A.J. Panks1, C.E. Christoffersen2, S. David1, R.G. Johnson1, C.M. Snowden1, M.B. Steer2 1U. of Leeds, United Kingdom 2NCSU, Raleigh, USA	Fully Analytical Compact Ther al Model of Complex Electronic Power Devices and Packages in Coupled Electrother al CAD
	V. d'Alessandro, N. Rinaldi U. of Naples "Federico II", Italy	Achieving Accuracy in Device and Circuit Electro-Thermal Simulation
	M. Checchetti Microptronics, Milano, Italy	Miniaturised High Power Electronics on THSs: The Indirect Advantages
18:30	Cocktail
Wednesday 26 September 2001
8:30	Invited talk 2: The Use of H-Adiabatic in Electronics Cooling and other Applications R.J. Moffat, Stanford U., USA Chair: C.J.M. Lasance, Philips Research Laboratories, Eindhoven, The Netherlands
9:10	Session 4: Advances in Package Cooling Solutions-II Chair: G. De Mey, Ghent U., Belgium
9:10	S. Kalahasti, Y.K. Joshi U. of Maryland, College Park, USA	Performance Characterization of a Novel Flat Plate Micro Heat Pipe Spreader
9:30	G. Pandraud1, V. Sartre1, M. Lallemand1, F. Michard2 1Centre de Thermique de Lyon, France 2Alcatel Space Industries, Toulouse, France	Modeling of Heat Spreaders Micromachined in Silicon Substrates for Electronics Cooling
9:50	V. Travkin, K.H. Ivan Catton U. of California, Los Angeles, USA	Optimal Design of Heat Rejection Devices
10:10	A. Ortega U. of Arizona, USA	Augmentation of Slot Jet Impingement Cooling of Electronics by Introduction of Controlled Disturbances to the Flow
10:30	Break
10:50	Panel, Dynamic compact modeling: Where are we and where to go ? Moderator: M. Rencz, MicRed, Budapest, Hungary Panelists: J. Parry, Hampton Court, United Kingdom M-N. Sabry, Mentor Graphics, Cairo, Egypt H. Pape, Infineon, Munich, Germany V. Székely, BUTE, Budapest, Hungary C.J.M. Lasance, Philips Research Laboratories, The Netherlands
12:00	Lunch
13:50	Session 5: Static Measurements Chair: P.E. Raad, Southern Methodist U., Dallas, USA
13:50	J. Engel1, E.G.T. Bosch2, A.M. Zoutenbier1 1CQM, Eindhoven, The Netherlands 2Philips Research, Eindhoven, The Netherlands	Embedded Tutorial: Uncertainty analysis
14:10	S. Dilhaire, S. Jorez, S. Grauby, L.D. Patino Lopez, J-M. Rampnoux, W. Claeys CPMOH/U. Bordeaux 1, France	Thermal Stress Analysis of Thermoelectric Devices Studied by Speckle Interferometry
14:30	S. Lopez-Buedo, J. Garrido, E. Boemo U. Autónoma de Madrid, Spain	Measurement of FPGA Die Temperature Using Run-time Reconfiguration
14:50	K. Tworus, G. De Mey Ghent U., Belgium	New Approach to Thermal Monitoring of Integrated Circuits
15:10	Z. Suszynski, R. Arsoba, P. Majchrzak TU of Koszalin, Poland	Thermal Diagnostic of Power Thyristor
15:30	C. Brusca1, A. Caddemi2, N. Donato2 1U. di Palermo, Italy 2U. di Messina, Italy	On Wafer Thermal Investigation of GaAs-Based Microwave Transistors by a Thermoelectric System
15:50	Break
16:10	Session 6: Static Compact Models Chair: J. Parry, Flomerics, Hampton Court, United Kingdom
16:10	E.G.T. Bosch Philips, Eindhoven, The Netherlands	Thermal compact models: An alternative approach
16:30	M-N. Sabry Mentor Graphics, Cairo, Egypt	Compact Thermal Models for Electronic Systems
16:50	Y.C. Gerstenmaier1, H. Pape2, G. Wachutka3 1Siemens AG, Munich, Germany 2Infineon, Munich, Germany 3Institute for Physics of Electrotechnology, Munich, Germany	Rigorous Model and Network for Stationary Thermal Problems
17:10	V. Gatto, O. Lottin, Y. Scudeller Laboratoire de Thermocinétique, Nantes, France	3 D Thermal compact model of flexible interconnection systems
17:30	Y. Tal, A. Nabi Heat and Mass Transfer Group, Haifa, Israel	Analytic Derivation of Junction-to-Board Thermal Resistance According to PERIMA
19:00	Banquet "Le Ciel de Paris"
Thursday 27 September 2001
8:30	Invited talk 3: Emerging New Roles of CFD Simulation in Competitive Market Environment W. Nakayama, ThermTech International, Kanagawa, Japan Chair: M. Rencz, BUTE, Budapest, Hungary
9:40	Half-day on Dynamic Measurements
9:40	Chair: C.J.M. Lasance, Philips Research Laboratories, Eindhoven, The Netherlands Introduction: C.J.M. Lasance, Philips Research Laboratories, Eindhoven, The Netherlands This half-day is organized by the partners of the PROFIT European Project to discuss various issues dealing with Dynamic measurements. A discussion time will follow the presentations of papers and demos.
9:50	J. Altet1, S. Dilhaire2, J-M. Rampnoux2, A. Rubio1, S. Grauby2, S. Jorez2, L.D. Patino Lopez2, W. Claeys2, S. Volt3 1U. Politècnica de Catalunya, Barcelona, Spain 2CMOPH/U. Bordeaux I, Talence, France 3Laboratory of Thermal Studies/ENSMA, Futuroscope, France	Four Different Approaches for the Measurement of the IC Surface Temperature: Application to Thermal Testing
10:10	V. Székely1, M. Rencz2, L. Pohl2 1BUTE, Budapest, Hungary 2MicReD Ltd, Budapest, Hungary	Novelties in the Theory and Practice of Thermal Transient Measurements
10:30	H. Pape, D. Schweitzer Infineon, Munich, Germany	Thermal Impedance of Packages in Dual Cold Plate Environments
10:50	Break
11:10	M. Rencz1, V. Székely2 1MicReD Ltd, Budapest, Hungary 2BUTE, Budapest, Hungary	Determining Partial Thermal Resistances in a Heat-Flow Path with the Help of Transient Measurements
11:30	S. Orain1, Y. Scudeller1, T. Brousse2 1Thermique-Energétique, Nantes, France 2Laboratoire de Génie des Matériaux, Nantes, France	Investigation of Structural Effects on Thin Film Thermal Conductivity
11:50	M.G. Burzo, P.L. Komarov, P.E. Raad Southern Methodist U., Dallas, USA	Influence of a Metallic Absorption Layer on the Quality of Thermal Conductivity Measurements by the Transient Thermo-Reflectance Method
12:10	Discussion
12:45	Lunch
14:15	Session 7: Thermal and Electro-Thermal Simulation Chair: M-N. Sabry, Mentor Graphics, Cairo, Egypt
14:15	J. Willemen, M. Gerstenberg, B. Fall, S. Lindenkreuz Robert Bosch GmbH, Reutlingen, Germany	Thermsim: the Integrated Electrothermal ASIC Design Environment
14:25	A. Poppe1, M. Rencz1, V. Székely2, G. Mezei2 1MicReD Ltd, Budapest, Hungary 2BUTE, Budapest, Hungary	Development of a Platform Independent Electro-Thermal Simulator
14:45	M. Macchiaroli, N. Rinaldi, V. d'Alessandro, G. Breglio, P. Spirito U. of Naples "Federico II", Italy	A New Electro-Thermal Simulation Tool for the Analysis of Bipolar Devices and Circuits
15:05	B. Maj, A. Augustin, A. Kostka TU Darmstadt, Germany	Heat Propagation in H-Bridge Smart Power Chips under Switching Conditions
15:25	J. Huertgen1, P. Hille1, A. Kostka2 1DaimlerChrysler AG, Frankfurt, Germany 2TU Darmstadt, Germany	Modeling of Leakage Currents in the High Temperature Range of CMOS-Devices in Silicon Based Technologies
15:45	Closing remarks

Reservation and Registration

Hotel Reservation Form

Workshop Registration Form

Top of Page

Copyright © 2001 Laboratoire TIMA.
Tous droits réservés.