7th International Workshop on

THERMal INvestigations of ICs and Systems

plus a special

September 24-27, 2001,
Paris, France.



IEEE Computer Society

The Institute of Electrical & Electronics Engineers, Inc.

Test Technology Technical Council


IEEE Components, Packaging and Manufacturing Technology Society

General Chair
B. Courtois
TIMA Grenoble,

Vice General Chair
M. Rencz
BUTE Budapest,

Programme Chairs
C. Lasance
The Netherlands

V. Székely
BUTE Budapest,

Programme Committee
M. Baelmans

A. Bar-Cohen
U. of Minnesota/USA

W. Claeys
U. Bordeaux/France

I. Barsony

D. Blackburn
NIST Gaithersburg/USA

K. Azar
QATS, Norwood, USA

G. De Mey
U. Gent/Belgium

E. Suhir
Bell Laboratories/USA

E. Jones
US Air Force/USA

Y. Zorian

A. Tay
NU Singapore/Singapore

U. Dillner

J.M. Dorkel,

A. Rubio

B. Siegal
Thermal Eng. Ass./USA

J. Parry

M. Kimura
U. Tohoku/Japan

J. Rantala

Y. Joshi
U. of Maryland/USA

N. Sabry
U. Mansoura/Egypt

J.B. Saulnier

H. Pape
Infineon Technologies/Germany

A. Napieralski
TU Lodz/Poland

D. De Cogan
U. of East Anglia/UK

H. Jaouen

K. Chakrabarty
Duke U./USA

J. Samitier
U. Barcelona/Spain

D. Copeland
Showa Aluminum/Japan

P. Tadayon

K. Shenai
U. of Illinois/USA

M. Iyer

F. Christiaens
Alcatel Bell/Belgium

J. Janssen
Philips/The Netherlands

G. Digele
The Boston Cltg/Germany

E. Driessens

B. Guenin

P. Raad
Southern Methodist U./USA

T. Tarter
Lightwave Microsystems/USA

O. Slattery

D. Agonafer

S. Ramminger

P. Rodgers
QATS, Norwood, USA

Call for Papers

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system.

The Workshop is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the IEEE Solid-State Circuits Society French Chapter.

Areas of interest:

The areas of interest range from thermal investigations in microstructures to thermal management of electronic systems.

Thermal and Temperature Sensors
Thermal Simulation
Electro-thermal Simulation
Thermal Modelling and Investigation of Packages
Reliability Issues
High Temperature Electronics
Heat Transfer Education
Flow Visualisation Techniques
Turbulence Modelling in Complex Geometrics
Thermal Characterization
Measurement of Thermal Properties
Acquisition and Analysis of Thermal Data
Temperature Mapping
Novel and Advanced Cooling Techniques
Thermal Performance of Interconnects
Heat Transfer Enhancement
Validation of Thermal Software
Coupled (thermo-mechanical, thermo-optical, etc.) Effects.

Technical Programme:

The programme will include oral talks, poster presentation, a panel discussion and invited talks given by prominent speakers.

Vendor and book exhibition:

The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books.

Invited talk:

Three prominent speakers have accepted to give an invited talk:

K. Shenai, University of Illinois at Chicago, USA, "Chip and package-level thermal management of power modules for field reliability of power systems".

In the information age, reliability of power systems used in the information processing equipment is of paramount importance. Demands for 99.9999999% reliable operation in the field is not uncommon. This talk will address some fundamental issues on silicon-level and package related thermal management of power modules used in computer/telecommunication power supplies. We will develop a new understanding of the thermal management and highlight the importance of advanced thermal models to accurately predict the long-term reliability of power systems.

R.J. Moffat, Stanford University, USA, "The use of h-adiabatic in electronics cooling and other applications".

The concept of h-adiabatic was first defined experimentally, in research at Stanford University. The concept was quickly adopted by some cooling system designers in the US and Europe to guide their thinking, but it remained difficult to use quantitatively until it was incorporated into practical computational methods. The most recent developments have linked h-adiabatic to conjugate Green's functions in a commercial code, yielding fast solutions to realistic problems. Present research at Stanford is focused on extending the concept by measuring (and calculating) all of the terms in the fluid-mechanic Green's Function. Example problems in gas turbine blade cooling will be described, as well as electronics cooling results.

W. Nakayama, ThermTech International, Kanagawa, Japan, "Emerging new roles of CFD simulation in competitive market environment".

In a proposed scheme the CFD simulation is performed on a set of template designs in the product planning phase. From the solution body a fast-to-use design code is developed. The objective is to improve the productivity of thermal design analysis.

Special Issue of Journals:

Special Issues and special sections of leading periodicals have been organised regarding the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components and Packaging Technologies, Journal of Electronic Packaging). It is again expected to have special issues and special sections of leading periodicals as follow up of the Workshop 2001.

Professional Development Courses/Tutorials:

Two Tutorials (A and B) will be offered on Monday 24 September, prior to the Workshop. They will run in parallel.

  A.  "Thermal Design Basics and Calculation of Air Cooling Limits"
    K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA

From the inception of electronics, cooling by air has been the most desired and broadly implemented method in the industry. As materials, function, configuration and power dissipation of electronic systems have gone through, and will continue to experience broad changes, the question of effectiveness/practicality of air-cooling continues to surface. This is further amplified by data from different industry sectors claiming to have reached the limits of air-cooling. Hence, uttering heat flux data that beyond which higher mode of cooling is necessary! Such product-specific data has caused a concern in the industry as to whether air-cooling is a limiting option thus, higher modes of cooling are required. In this course a methodical procedure is presented for the designers to quickly calculate system performance with a given cooling option and determine the most suitable technique for the system at hand. The course is presented in two parts, the first part is designed to provide the basic calculation methodologies, and the second part address the issue of air-cooling as an option. The first part of the course will deal with basic calculations for thermal design. The second part will deal with the limits of air cooling.

About Kaveh Azar:
Dr. Kaveh Azar is the President and CEO of Advanced Thermal Solutions, Inc. (ATS). Prior to this new appointment, Dr. Azar was the founder and manager of Lucent Technologies thermal management center, responsible for developing the next generation of cooling systems. In addition, Dr. Azar has authored Lucent's thermal roadmap and served as the corporate thermal consultant. While at Lucent, he developed a state-of-the- art thermal/fluids laboratory for simulation of components, boards and systems. Since 1985, Dr. Azar has been an active participant in electronics thermal community and has served as the organizer, general chair and the keynote speaker at the national and international conferences sponsored by ASME, IEEE and AIAA. He has also been an invitee to national bodies such as NSF, NIST and NEMI for organizing government and industry research goals in electronics cooling. Dr. Azar has been an adjunct professor at a number of universities, and lecturers worldwide in analytical and experimental methods in electronics cooling. He holds more than 26 national and international patents, has published more than 58 articles, 3 book chapters and a book entitled, "Thermal Measurements in Electronics Cooling". In addition, he serves as the Editor-in-Chief of the Electronics Cooling Magazine, and was awarded IEEE SEMITHERM Significant Contributor Award in the thermal management of electronics systems.

  B.  "Resource Management in Thermal Design of compact Electronic Equipment"
    W. Nakayama, ThermTech International, Kanagawa, Japan

Shrinking system dimensions and higher packaging density are the norm in the evolution of electronic equipment. From portable computers to massively parallel processors, the internal space of the system box becomes a precious commodity to be shared by the electronic components and the cooling media. The space availed for cooling media, the power input to the electronic devices, and the allowable temperature potential are mutually affecting design parameters, and they can be regarded as tradable resources in an effort to maximize the system performance and reliability. While such concept helps to capture the technical aspects of product design from a strategic viewpoint, the management of time, human, and capital resources is also needed to streamline the design jobs. A particularly important step in the job stream is quick assessment of the impacts of new cooling devices and techniques on the product design on hand. The following topics will be covered: evolution of hardware morphologies, resource allocation in the system design, effectiveness of various cooling methods in tight space, possible impacts of micro-fabrication based cooling technologies, development of an infrastructure to support product innovation.

About Wataru Nakayama:
Wataru Nakayama is an internationally recognized expert on thermal management of electronic equipment. He has developed his expertise on the subject from his experience of about thirty years in the industry and the universities. He received the Dr. of Engineering degree from the Tokyo Institute of Technology in 1966. He worked for Hitachi, Ltd. as a Heat Transfer Specialist from 1970 to 1993. From 1989 to 1996, he taught at the Tokyo Institute of Technology and conducted research on power and thermal management of computers. He was associated with CALCE Electronic Packaging Research Center, University of Maryland, from 1996 to 1998. Dr. Nakayama has authored and co-authored more than 200 technical papers, 4 books, and several handbooks. He received several prominent awards including the JSME Technology Award in 1978, the ASME Heat Transfer Memorial Award in 1992, the ASME Electrical & Electronic Packaging Division Award in 1996, the JSME Longstanding Contributions Award in 1997, and the ITHERM Achievement Award in 2000. He is an Honorary Member of the Heat Transfer Society of Japan, a Fellow of ASME and a Senior Member of IEEE. He served as co-chairs of conferences and on boards of the societies including the President of the Heat Transfer Society of Japan, 1990. Dr. Nakayama is currently running an independent consulting firm specializing in thermal management of electronic equipment. He is also associated with Department of Mechanical Engineering, University of Maryland.


The Workshop will be held at the Sofitel Paris Forum Rive Gauche Hotel, located on the left bank of the Seine, only a few minutes from Montparnasse, the Latin Quarter, Place Denfert-Rochereau, Porte d'Orléans and Porte d'Italie. The Sofitel Paris Forum Rive Gauche Hotel is very easy to get to, by private and public transport. More information is available on the hotel and on Paris.

Information for the authors:

Authors are invited to submit electronic papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status.
Please include title, name and affiliations of all authors, an abstract of 50 words or less and suggested topics. Also identify a contact author and include a complete mailing address, phone number, fax number and E-mail address.
Only electronic submissions are accepted. The papers should be prepared in Postscript, text, Microsoft Word or PDF format and should be submitted to the THERMINIC email.

Accepted contributions will be included in Workshop Proceedings.
Submission deadline: 20 April 2001
Notification of acceptance: 08 June 2001
Submission of manuscripts for distribution at the Workshop: 31 August 2001

Submit all paper proposals and/or intentions to participate to:

46 Avenue Félix Viallet
38031 Grenoble cedex

E-mail : Therm2001@imag.fr

Copyright © 2001 Laboratoire TIMA.
Tous droits réservés.