6th International Workshop on THERMal INvestigations of ICs and Systems plus a special half-day on compact models

THERMAL STRESS FAILURES IN MICROELECTRONICS PACKAGING:

PREDICTIVE MODELING AND PREVENTION

E. Suhir,
Bell Laboratories, Physical Sciences and Engineering Research Division,
Murray Hill, New Jersey, USA

A tutorial is being offered on Sunday 24 September, from 9.30 a.m. to 5 p.m.. Registrations will be guarantied on a first come first serve basis, upon maximum capacity is reached.

SCOPE / OBJECTIVES:

• Examine typical failure modes and mechanisms occurring in microelectronics and photonics materials and structures, and present easy-to-use formulas indicating the role of the major factors affecting their reliability.

• Discuss how to choose the appropriate materials for a particular package design and how to change, if necessary, the geometrical characteristics of the design for a viable and reliable product.

LEVEL:

The course will be taught with the emphasis on the physics of the phenomena, stresses and failures. No in-depth knowledge of the mechanical, materials or structural engineering is required.

CONTENTS:

• Materials, structures and loading conditions in microelectronics packaging,
• Thermal and mechanical stress, and thermal stress failures,
• Predictive modeling: what could one gain by using it ?
• Predictive modeling: its role, merits and shortcomings with respect to, and interaction with, experiment,
• Analytical ("mathematical") and finite-element modeling,
• Die-substrate and other adhesively bonded assemblies,
• Recommendations for improved fatigue life of adhesively bonded and soldered assemblies,
• Thin film structures,
• Thermal stresses due to "global" and "local" mismatch,
• Thermally matched assemblies,
• Thermal stress in solder joints: flip-chip designs in thermally matched assemblies,
• Thermal stress in plastic packages of IC devices: its role and interaction with moisture induced loading,
• Thermal stress in ceramic packages: application of a probabilistic approach,
• Thermal stress in photonics packaging.

INSTRUCTOR:

Dr. E. Suhir is Distinguished Member of Technical (Research) Staff at Bell Laboratories, Physical Sciences and Engineering Research Division. He is Technical Editor of the ASME Journal of Electronic Packaging. Dr. Suhir is Fellow of the Institute of Electrical and Electronics Engineers (IEEE), American Society of Mechanical Engineers (ASME) and the Society of Plastics Engineers (SPE) and Senior Member of the American Physical Society (APS). He is Distinguished Lecturer with IEEE and ASME. Dr. Suhir has authored more than 200 papers, patents, book chapters and books on mechanics and reliability of microelectronics and photonics materials, packages and systems. He received numerous professional and distinguished services awards, including the 1999 National Tau Pi Sigma and ASME Charles Russ Richards Memorial award for outstanding contributions to mechanical engineering, the 2000 IEEE-CPMT award for outstanding pioneering, sustained and continuing contributions to the fields Materials and Mechanical Engineering related to microelectronics and fiber-optics packages and structures, and the 2000 International SPE Fred O. Conley Award for outstanding contributions to plastics engineering and technology. Dr. Suhir organized many successful conferences, symposia and workshops on microelectronic and photonic materials, packages and structures.