6th International Workshop on

THERMal INvestigations of ICs and Systems

a special half-day on compact models

Sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the DETERMIN Project supported by the European Commission.

Monday 25 September 2000

8:00 Registration
9:30 Welcome address: B. Courtois,
General Chair, TIMA Laboratory, Grenoble, France

9:40 Invited talk: W. Claeys,
U. Bordeaux 1, Talence, France

Chair: V. Székely,
BUTE, Budapest, Hungary

Characterisation of the thermal behaviour of microelectronic components by laser probing
10:20 Session 1

Chair: C. Villa,
STMicroelectronics, Agrate Brianza, Italy

Measurement techniques
10:20 V. Székely1, G. Farkas1, E. Nikodémusz1, M. Rencz1, S. Ress2, S. Török2
1MicReD Ltd, Budapest, Hungary
2BUTE, Budapest, Hungary
New procedures for thermal transient testing
10:40 G. Storti Gajani, A. Brambilla, A. Premoli
DEI - Politecnico di Milano, Italy
Exploiting Electro-Thermal Oscillations for identifying MOSFET Thermal Parameters
11:00 V. Székely1, M. Rencz2, S. Török1, S. Ress1, B. Vizy1
1BUTE, Budapest, Hungary
2MicReD Ltd, Budapest, Hungary
Experiments on Effective board thermal conductivity measurements
11:20 R.C. Campbell, S.E. Smith
Holometrix Micromet, Bedford, USA
Laser Flash Measurements of Adhesive Bondline Effective Thermal Conductivity and Contact Resistance Using Multilayer Methods
11:40 Break
12:00 Session 2

Chair: D. de Cogan,
U. of East Anglia, Norwich, UK

Temperature mapping
12:00 S. Dilhaire1, S. Jorez1, L-D. Patino Lopez1, W. Claeys1, E. Schaub2
1U. Bordeaux 1, Talence, France
2National Research Laboratory of Metrology, Ibaraki, Japan
Measurement of Laser Diode Light Efficiency by Thermoreflectance Microscopy
12:20 S. Holé, G. Tessier, S. Grauby, D. Fournier
ESPCI, Paris, France
Quantitative thermal imaging by thermoreflectance using a CCD array
12:40 A. Trigg
Institute of Microelectronics, Singapore
Temperature mapping of ICs and MEMs devices using an Infrared Microscope
13:00 Lunch
14:30 Vendor's session: B. Courtois,
TIMA Laboratory, Grenoble, France

15:30 Session 3

Chair: M. Baelmans,
K.U.Leuven, Heverlee, Belgium

Thermal simulation
15:30 D. de Cogan1, A. Kos2
1U. of East Anglia, Norwich, UK
2U. of Mining and Metallurgy, Krakow, Poland
TLM Solutions for Static Thermal Problems
15:50 Y.C. Gerstenmaier1, G. Wachutka2
1Siemens, München, Germany
2München U. of Techn., München, Germany
Time dependent temperature fields calculated using eigenfunctions and eigenvalues of the heat conduction equation
16:10 M. Zubert, A. Napieralski
TU of Lòdz, Poland
The New General Method for Thermal and Electro-Thermal Model Reduction
16:30 Break
17:00 Posters session
Posters are introduced by one slide in 3 minutes each

Chair: M. Rencz,
BUTE, Budapest, Hungary

  S. Tzanova, V. Videkov
TU of Sofia, Bulgaria
A New Undergraduate Course on Thermal Design of MCMs
  M. Pesare, A. Giorgio, A.G. Perri
Politecnico di Bari, Italy
Analytical Solution to the Non-linear 3-D Heat Flow Equation for the Optimized Electrothermal Design of Integrated Devices
  M. Janicki, W. Tylman, T. Pozniak, A. Napieralski
TU of Lòdz, Poland
Influence of Power Device Placement on Integrated Circuit Temperature
  O. Vanék, M. Drzík, B. Hucko, A. Kromka, M. Remis
Slovak U. of Techn., Bratislava, Slovakia
Stresses in Diamond and SiO2 Films Deposited on Silicon Substrates
  F. Charlet, V. Gehanno, S. Putot, A. Fargeix
LETI, Grenoble, France
An efficient numerical method to calculate the thermal distribution in multilayer media: application to optical recording
  A. Ebongue1,2, F. Brachelet1,3, F. Polet1,4, B. Bêche4,5, E. Gaviot4,5
1IEMN, Villeneuve d'Ascq, France
2Jay Electronique, Montbonnot Saint Martin, France
3S.A.R.L Captec, Villeneuve d'Ascq, France
4ENSIM, Le Mans, France
5LAUM, Le Mans, France
Rugged Infrared Sensors for Use in Safety-Related Industrial Environment
  M. Malinski1, L. Bychto1, S. Legowski2, J. Szatkowski2, J. Zakrzewski2
1TU of Koszalin, Poland
2Nicolaus Copernicus U., Torun, Poland
Photoacoustic Spectroscopy Studies of Zn1-xBexSe Mixed Crystals
  P. Dziurdzia, A. Kos
U. of Mining and Metallurgy, Kraków, Poland
Electro-thermal Simulations of Power Feedback in Active Cooling of Microstructures
  P.G. Tucker, Z. Pan
The U. of Warwick, Coventry, UK
Turbulence Modelling for Unsteady Flow Complex Systems
  B. Wiecek
TU of Lòdz, Poland
Heat transfer modelling and IR measurements of electronic devices in enclosures
  P. Miribel-Català, E. Montané, S.A. Bota, M. Puig-Vidal, J. Samitier
U. of Barcelona, Spain
Mosfet-only temperature sensor for standard BCD smart power technology
  W. Szczesniak
TU of Gdansk, Poland
Influence of Tasks Scheduling on Average and Peak Temperatures of CMOS Circuits
  Z. Huszka
Austria Mikro Systeme Intl, Budapest, Hungary
Self-heating at the Parameter Extraction of SiGe HBTs
  M. Zubert, A. Napieralski
TU of Lódz, Poland
Application of RESCUER software for Smart Power Circuits Design
  Z. Suszynski
TU of Koszalin, Poland
Photoacoustic Amplitude Method of Determination of Thermal Diffusivity of Non-Opaque Materials
  S. Ress, E. Kollar
BUTE, Budapest, Hungary
Comparison of various thermal transient measurement methods on a benchmark package
19:00 Bus to dinner

Tuesday 26 September 2000

8:30 Session 4

Chair: M-N. Sabry,
Mansoura U., Egypt

Electro-thermal simulation
8:30 W. Batty1, C. E. Christoffersen2, S. David1, R. G. Johnson1, A. J. Panks3, C. M. Snowden1,3
1U. of Leeds, UK
2NCSU, Raleigh, USA
3Filtronic plc., Shipley, UK
Steady_state and transient electro_thermal simulation of power devices and circuits based on a fully physical thermal model
8:50 L. Codecasa, D. D'Amore, P. Maffezzoni
Politecnico di Milano, Italy
Electro thermal networks for the analysis of power devices
9:10 M-N. Sabry1, W. Fikry2, Kh. Abdel Salam3, M.M. Awad1, A.I. Nasser3
1Mansoura U., Egypt
2Ain Shams U., Egypt
310th of Ramadan Techn. Inst., Egypt
Lumped Compact Transient Thermal Model of Self-Heating in MOSFETs
9:30 G. Breglio, N. Rinaldi, P. Spirito
U. di Napoli "Federico II", Italy
3D dynamic electro-thermal simulator applied to a new cellular power MOS affected by Electro-Thermal instability
9:50 D.D.L. Wijngaards, E. Cretu, S.H. Kong, R.F. Wolffenbuttel
Delft U. of Techn. / DIMES, The Netherlands
Modelling of integrated polySiGe Peltier elements
10:10 Break
10:40 Session 5

Chair: G. De Mey,
U. Gent, Belgium

Thermal management I
10:40 P. Tadayon
Intel Corporation, USA
Thermal Challenges During Microprocessor Testing
11:00 F. Blanc, F. Clermidy, T. Collette
DEIN-CEA, Gif-sur-Yvette, France
Thermal Management impact in a fault-tolerant architecture
11:20 D. Copeland
Showa Aluminum Corp., USA
Fundamental Performance Limits of Heatsinks
11:40 O. Karim1, C. Gillot1, C. Schaeffer1, E. Gimet2, S. Derou2
1LEGrenoble, Saint-Martin d'Hères, France
2PSA, Peugeot Citroën, Paris, France
Heat Sink Exchanger Dimensioning for Hybrid Vehicle Inverter
12:00 Lunch
14:30 Session 6

Chair: D. Agonafer,
IBM Corp., Poughkeepsie, USA

Thermal management II
14:30 M-N. Sabry
Mansoura U., Egypt
Transverse Temperature Gradient Effect on Fin Efficiency for Micro-Channel Design
14:50 K. Nevelsteen, T. Persoons, M. Baelmans
K.U.Leuven, Heverlee, Belgium
Heat transfer coefficients of forced convection cooled Printed Circuit Boards
15:10 J. Legierski, B. Wiecek
TU of Lòdz, Poland
Heat Pipes for Cooling Electronic Circuits
15:30 H. Chiueh, J. Draper, J. Choma Jr.
U. of Southern California, USA
A Programmable Thermal Management Interface Circuit for PowerPC Systems
15:50 Break
16:10 C.J.M. Lasance
Philips Research Laboratories, Eindhoven, The Netherlands

Chair: T. Reibe,
European Commission, Brussels, Belgium

The PROFIT project.

On 1 January 2000, a new European project, nicknamed PROFIT, commenced as a successor to the successfully finished EC-funded projects DELPHI, SEED and THERMINIC. PROFIT is aimed at creating methods and tools that enable a sufficiently accurate measurement and prediction of temperature gradients in time and space, which is required for a more accurate and timely assessment of cost, performance, safety and reliability of electronic products in all stages of the product realisation process.
This presentation will discuss its motivation, scope, objectives, advances over the state-of-the-art and the results achieved and expected in 2000.

17:00 Panel

Moderator: Y. Joshi,
U. of Maryland, USA
Panelists: T. Baelmans, KU Leven, Belgium
D. Copeland, Showa Aluminum, Japan
J. Parry, Flomerics, UK
J. Rantala, Nokia, Finland
C.J.M. Lasance, Philips Research Laboratories, The Netherlands

The Status and Challenges in System Level Thermal Fluidic Modelling
19:00 Bus to dinner

Wednesday 27 September 2000

9:00 Half-day on compact models
9:00 Chair: C.J.M. Lasance,
Philips Research Laboratories, Eindhoven, The Netherlands

Introduction: J. Rantala,
Nokia, Helsinki, Finland

This half-day is organized by the partners of the PROFIT European Project to discuss various issues dealing with compact models. A discussion time will follow the presentations of papers and demos.

9:10 T. Franke
Siemens, München, Germany
Thermal modelling of semiconductor packages
9:30 K. Van Damme1, M. Baelmans1, F. Christiaens2, W. Nelemans2
1K.U. Leuven, Heverlee, Belgium
2Alcatel-Bell, Antwerp, Belgium
On the use of compact models for board level thermal simulations
9:50 E. Driessens1, S. Van Dooren1, B. Vandevelde1, E. Beyne1, M. Hereman2, J. Van Puymbroeck2
1IMEC, Heverlee, Belgium
2Siemens, Oostkamp, Belgium
Parametric compact models for Polymer Stud Grid Array Assemblies
10:10 K. Van Damme, M. Baelmans
K.U. Leuven, Heverlee, Belgium
Thermal modelling of welding power supplies with High Power Density in a CAE-environment
10:30 Break
10:45 S. Djadoenath, P. Stehouwer
Centre for Quantitative Methods, Eindhoven, The Netherlands
Creation and Validation of BCI Compact Thermal Models
10:55 J. Janssen1, H. Pape2, C.J.M. Lasance3
1Philips Semiconductors, Nijmegen, The Netherlands
2Infineon, München, Germany
3Philips Research Laboratories, Eindhoven, The Netherlands
Demonstration of the use of compact models
11:05 S. Van Dooren1, E. Driessens1, B. Vandevelde1, E. Beyne1, M. Hereman2, J. Van Puymbroeck2
1IMEC, Heverlee, Belgium
2Siemens, Oostkamp, Belgium
Transient Thermal Characterization of the PSGA or Polymer Stud Grid Array
11:25 T. Hauck, T. Bohm
Motorola, München, Germany
Thermal RC-Network Approach For Multichip Power Packages
11:45 Break
12:00 C.J.M. Lasance
Philips Research Laboratories, Eindhoven, The Netherlands
Two Benchmarks for the Study of Compact Thermal Modelling Phenomena
12:10 M. Rencz, V. Székely, E. Kollar
BUTE, Budapest, Hungary
Measuring dynamic thermal multiport parameters of IC packages
12:30 Discussion
13:00 Lunch
14:30 Session 7

Chair: U. Dillner,
IPHT, Jena Germany

Mems and sensors
14:30 Z. Vizváry1, P. Fürjes2, I. Bársony2
1BUTE, Budapest, Hungary
2Res. Inst. for Techn. Physics and Mat. Science, Budapest, Hungary
Three-Dimensional Finite Element Model For Thermomechanical Analysis Of Hotplates
14:50 V. Milanovi1, M. Hopcroft2, C.A. Zincke3, M. Zaghloul3, K.S.J. Pister1
1U. of California at Berkeley, USA
2Analatom, Incorporated, of Sunnyvale, USA
3The Washington U., USA
Modelling of Thermoelectric Effects in Planar Micromachined Structures Using SPICE
15:10 M. Kimura, Y. Gotoh
Tohoku-Gakuin U., Tagajo, Miyagi, Japan
Transistor-Thermistor Made of a MOSFET
15:30 P. Fürjes1, Z. Vizváry2, M. Rácz1, I. Barsony1
1Res. Inst. for Techn. Physics and Mat. Science, Budapest, Hungary
2BUTE, Budapest, Hungary
Temperature measurement in micro-filament heater
15:50 A. Poppe1,2, G. Farkas1, M. Rencz1,2, Z. Benedek2, L. Pohl2, V. Székely2, K. Torki3, S. Mir3, B. Courtois3
1BUTE, Budapest, Hungary
2MicReD Ltd, Budapest, Hungary
3TIMA Laboratory, Grenoble, France
Design of a scalable multi-functional thermal test die with direct and boundary scan access for programmed excitation and measurement data acquisition
16:10 Closing remarks

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