6th International Workshop on

THERMAL INVESTIGATIONS of ICs and SYSTEMS

September 24-27, 2000, Budapest, Hungary.

Sponsored by		In cooperation with
	IEEE COMPUTER SOCIETY The Institute of Electrical and Electronics Engineers, Inc.	IEEE Components, Packaging and Manufacturing Technology Society

General Chair B. Courtois TIMA Grenoble, France Vice General Chair M. Rencz TU Budapest, Hungary Programme Chairs C. Lasance Philips, The Netherlands V. Székely TU Budapest, Hungary Local Organization Chair A. Poppe MicRed, Hungary Programme Committee M. Baelmans KUL/Belgium D. Agonafer IBM Corp./USA A. Bar-Cohen U. of Minnesota/USA W. Claeys U. Bordeaux/France I. Barsony KFKI-ATKI/ Hungary D. Blackburn NIST Gaithersburg/USA K. Azar Lucent Techno./USA G. De Mey U. Gent/Belgium E. Suhir Bell Laboratories/USA E. Jones US Air Force/USA Y. Zorian LogicVision/USA P. Tuerkes Siemens/Germany A. Tay NU Singapore/Singapore U. Dillner IPHT/Germany J.M. Dorkel, LAAS/France A. Rubio UPC/Spain B. Siegal Thermal Eng. Ass./USA J. Parry Flomerics/UK M. Kimura U. Tohoku/Japan S. Roumenin Bulgarian Acad. Sc./Bulgaria J. Rantala Nokia/Finland Y. Joshi U. of Maryland/USA N. Sabry U. Mansoura/Egypt J.B. Saulnier ENSMA/France H. Pape Infineon Techno./Germany O. Slattery NMRC/Ireland A. Napieralski TU Lodz/Poland M. Glesner TH Darmstadt/Germany D. De Cogan U. of East Anglia/UK H. Jaouen STMicroelectronics/France P. Raad Southern Methodist U./USA K. Chakrabarty Duke U./USA

Call for Papers THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system's cost. The high element density of MCMs, the growing power dissipated in a package, etc., and the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. The Workshop is sponsored by the IEEE Computer Society Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the DETERMIN Project supported by the European Commission. Areas of interest: The areas of interest range from thermal investigations in microstructures to thermal management of electronic systems. Thermal and Temperature Sensors Thermal Simulation Electro-thermal Simulation Thermal Modelling and Investigation of Packages Reliability Issues High Temperature Electronics Heat Transfer Education Flow Visualisation Techniques Turbulence Modelling in Complex Geometrics Thermal Characterization Measurement of Thermal Properties Acquisition and Analysis of Thermal Data Temperature Mapping Novel and Advanced Cooling Techniques Thermal Performance of Interconnects Heat Transfer Enhancement Validation of Thermal Software Coupled (thermo-mechanical, thermo-optical, etc.) Effects. Technical Programme: The programme will include oral talks, poster presentation, a panel discussion and 3 invited talks given by prominent speakers. Vendor and book exhibition: The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books. Information for the authors: Authors are invited to submit electronic papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status. Please include title, name and affiliations of all authors, an abstract of 50 words or less and suggested topics. Also identify a contact author and include a complete mailing address, phone number, fax number and E-mail address. Only electronic submissions are accepted. The papers should be prepared in Postscript, text, Microsoft Word or PDF format and should be submitted to the THERMINIC email: Therm2K@imag.fr Accepted contributions will be included in Workshop Proceedings. Submission deadline: 21 April 2000 Notification of acceptance: 09 June 2000 Submission of manuscripts for distribution at the Workshop: 31 August 2000 Special Issue of Journals: Special Issues and special sections of leading periodicals have been organized as follow up of the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A). In 1999, arrangements have been made with the IEEE Transactions on Components and Packaging Technologies and with the Microelectronics Journal. Professional Development Courses/Tutorials: A Tutorial is being offered on Sunday 24 September, prior to the Workshop. Details will be published in the Programme booklet. E. Suhir, Lucent Technologies, USA "Thermal Stress Failures in Microelectronic and Photonic Packaging: Prediction and Prevention". Venue: The Workshop will be held in Budapest, Hungary. Submit all paper proposals and/or intentions to participate to: Bernard COURTOIS TIMA 46 Avenue Félix Viallet 38031 Grenoble cedex France E-mail : Therm2K@imag.fr WWW: http://tima.imag.fr/conferences/therminic Back

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