SUNDAY 3 OCTOBER
9:30	Tutorial A   /   Tutorial B
12:30	Lunch
14:00	Tutorial A   /   Tutorial B
MONDAY 4 OCTOBER
8:00	Registration
9:30	Welcome address Opening address
9:40	Invited talk	THERMAL PACKAGING FOR THE 21ST CENTURY: CHALLENGES AND OPTIONS
10:20	Session 1	ADVANCED MEASUREMENT TECHNIQUES
12:00	Lunch
13:30	Session 2	TEMPERATURE MEASUREMENT AND MONITORING
14:30	Coffee
14:50	Embedded Tutorial	A SURVEY ON COUPLED TRANSPORT PROCESSES IN THIN LIQUID FILMS FOR MICROCHANNEL HEAT TRANSFER APPLICATION
15:10	Session 3	ADVANCED COOLING TECHNOLOGIES
17:15	Poster session 1
19:00	Reception
TUESDAY 5 OCTOBER
8:30	Invited talk	NEEDS AND TRENDS IN INDUSTRIAL THERMAL MANAGEMENT OF ELECTRONICS
9:10	Session 4	ELECTRO-THERMAL SIMULATION
11:10	Coffee
11:30	Session 5	EXPERIMENTAL VALIDATION OF NUMERICAL ANALYSIS
13:15	Lunch
14:30	Vendors Session
16:00	Session 6	STUDIES ON THERMAL MATERIAL PARAMETERS
17:20	Coffee
17:40	Poster session 2
19:00	Diner
20:30	Panel	WHAT ARE THE EXPECTATIONS OF THE ELECTRONICS INDUSTRY FROM THE THERMAL ACADEMIC COMMUNITY ?
WEDNESDAY 6 OCTOBER
9:00	Invited talk	THERMAL STRESS IN MICROELECTRONICS PACKAGING: PROBABILISTIC APPROACH
9:40	Coffee
10:00	Embedded Tutorial	THERMAL CHARACTERISATION BY COMPACT MODELS: WHERE ARE WE ?
10:20	Session 7	THERMAL AND THERMOMECHANICAL CHARACTERISATION
12:00	Lunch
13:00	Session 8	MEMS
14:20	Coffee
14:40	Session 9	THERMAL ANALYSIS TECHNIQUES
15:40	Closing remarks