Vice General Chair
M. Rencz
TU Budapest/Hungary

Programme Chair
V. Székely
TU Budapest/Hungary

Programme Committee
to include

G. De Mey
U. Gent/Belgium

W. Claeys
U. Bordeaux/France

D. Blackburn
NIST Gaithersburg/USA

A. Napieralski
TU Lodz/Poland

M. Glesner
TH Darmstadt/Germany

J.B. Saulnier
ENSMA/France

N. Sabry
U. Mansoura/Egypt

A. Ortega
U. Arizona/USA

R. Vahrmann
TEMIC/Germany

C. Lasance
Philips/The Netherlands

Y. Zorian
LogicVision/USA

S. Chew
IME/Singapore

M. Kimura
U. Tohoku/Japan

U. Dillner
IPHT/Germany

H. Jaouen
SGS Thomson/France

O. Slattery
NMRC/Ireland

J. Rantala
Nokia/Finland

K. Eshraghian
Edith Cowan U./Australia

J. Parry
Flomerics/UK

T. Tarter
AMD/USA

J.M. Dorkel
LAAS/France

D. De Cogan
U. of East Anglia/UK

G. Gielen
KU Leuven/Belgium

A. Rubio
UPC/Spain

V. Luchinin
Microtechno. Ctre/Russia

Z. Suszynski
TU Koszalin/Poland

I. Barsony
KFKI-ATKI/ Hungary

P. Tuerkes
Siemens/Germany

E. Jones
US Air Force/USA

D. Balageas
ONERA/France

J. Rai-Choudhury
SPIE/USA

A. Bar-Cohen
U. of Minnesota/USA

D. Agonafer
IBM/USA

P. Raad
Southern Methodist U./USA

A. Majumdar
U. Of California/USA

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics and microstructures. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. The high element density of MCMs and the mobile parts of microsystems raise newer and newer thermal problems to be solved in the near future. Thermal effects on the other hand can be used as bases of sensors or other functional structures.

The Workshop is sponsored by the IEEE Computer Society Test Technology Technical Committee and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society, the THERMINIC Project supported by EC/ESPRIT, the European Test Technology Technical Committee and with SPIE, the Society of Photo-Optical Instrumentation Engineers.

Areas of interest:

• Thermal and Temperature Sensors
• Thermal Simulation
• Electro-thermal Simulation
• Thermal Modelling and Investigation of Packages
• Reliability Issues
• Measuring Thermal Effects and Parameters
• Evaluation of Thermal Measurements
• Temperature Mapping
• Coupled (thermo-mechanical, thermo-optical, etc.) Effects.

Vendor and book exhibition:

The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books.

Invited talks:

Two prominent speakers have accepted to give invited talks:

• B. Guenin, Amkor Electronics Inc., Chandler, USA, "Characterization of a Delaminated Interface in a Plastic Semiconductor Package and its Effect on Thermal Performance".
• R. Mahajan, Intel Corp., Hillsboro, USA, "Thermal Integration Challenges in Computing: The Need for Predictive Capabilities".

Information for the authors:

Authors are invited to submit papers describing recent work. Panel proposals are also invited. Papers may be extended summaries (minimum 500 words) or full papers although preference will be given to full paper submissions. In either case, clearly describe the nature of the work, explain its significance, highlight novel features, and describe its current status.

On the title page, please indicate : title, name and affiliations of all authors, an abstract of 50 words or less, and suggested topics. Also identify a contact author and include a complete mailing address, phone number, fax number and E-mail address.

Accepted contributions will be included in Workshop Proceedings.

Submission deadline (5 copies):	30 April 1998
Notification of acceptance:	12 June 1998
Submission of manuscripts for distribution at the Workshop:	31 August 1998

Special Issue of Journals:

Special Issues and special sections of leading periodicals have been organized as follow up of the previous Workshops (Journal of Sensors and Actuators, Microelectronics Journal, IEEE Transactions on VLSI Systems, IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A). In 1998, arrangements have been made with the IEEE Transactions on Components, Packaging and Manufacturing Technology - Part A and with the Microelectronics Journal.

Support by the DG III/F2 - International Cooperation of the European Commission and by the ONR European Office:

It is expected that the DG III/F2 of the European Commission and the Office of Naval Research European Office will provide again a support to help participants from Central and Eastern Europe.

Venue:

The Workshop will be held at the SOFITEL-Méditerranée hotel, in Cannes "Côte d'Azur". The hotel is located on the westernmost point of the bay of Cannes, bordered by beaches of fine sand and overlooking the yacht harbour and the Croisette. Rooms will be available from 355FF on a double occupancy basis. Cannes is served by the airport of Nice (40 minutes by shuttle bus) and by the airport of Cannes-Mandelieu (10 minutes). Cannes may also be reached by highway and by train.

Submit all paper proposals and/or intentions to participate to: