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3rd International Workshop on
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES

The Workshop at a Glance

Sunday 21st September 1997

Monday 22nd September 1997

Tuesday 23rd September 1997

      Arrival
 8:40 Session 2:
THERMAL AND ELECTRO-THERMAL MODELLING AND SIMULATION
 9:00Invited Talk
14:00Registration
11:00Coffee
 9:40Coffee
15:00Welcome address
11:20Vendor presentations
10:00 Session 4:
SENSORS AND ACTUATORS
15:10Opening adress
12:30Lunch
12:15Lunch
15:20 Invited Talk
14:00Free Time
14:00 Session 5:
MEASURING THERMAL MATERIAL PARAMETERS
16:00Coffee
16:20Session 1:
 EVALUATION OF THERMAL MEASUREMENTS
16:00Session 3:
 TEMPERATURE MAPPING
15:40Special Session:
 DELPHI/SPEED
17:40Coffee
17:20Coffee
16:20 Closing Remarks
18:00Poster Session 1
18:00Poster Session 2
19:30Reception
19:00Banquet
20:30Panel:
 THERMAL MANAGEMENT: A LONELY FIGHT OR CONCURRENT ENGINEERING ?

Last Updated August 19, 1997.

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