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THERMINIC 1997

September 21-23,
Cannes, "Côte d'Azur"
France

3rd International Workshop on
THERMAL INVESTIGATIONS of ICs and MICROSTRUCTURES

General Chair
B. Courtois
TIMA Grenoble/France

Vice General Chair
M. Rencz
TU Budapest/Hungary

Programme Chair
V. Székely
TU Budapest/Hungary

Programme Committee

G. De Mey
U. Ghent/Belgium

W. Claeys
U. Bordeaux/France

D. Blackburn
NIST Gaithersburg/USA

A. Napieralski
TU Lodz/Poland

H. Rosten
Flomerics/UK

M. Glesner
TH Darmstadt/Germany

J.B. Saulnier
ENSMA/France

N. Sabry
ANACAD/France

A. Ortega
U. Arizona/USA

R. Vahrmann
TEMIC/Germany

J. Figueras
U. Barcelona/Spain

D. Agonafer
IBM/USA

C. Lasance
Philips/The Netherlands

Y. Zorian
LogicVision/USA

J.G. Ferrante
Matra Systèmes & Information/France

S. Chew
IME/Singapore

M. Esashi
U. Tohoku/Japan

K. Kurzweil
ISHM/France

D. Esteve
LAAS/France

V. Koval
TU Lviv/The Ukraine

U. Dillner
IPHT/Germany

G.S. Visweswaran
IIT/India

H. Jaouen
SGS Thomson/France

O. Slattery
NMRC/Ireland

T. Jarvinen
Nokia/Finland

K. Eshraghian
Edith Cowan U./Australia

W. Van Bokhoven
Eindhoven U. of Techno/The Netherlands

W. Temmerman
Alcatel Telecom/Belgium

E. Fourgeau
Analogy/France

G. Gielen
KU Leuven/Belgium

J. Rai-Choudhury
SPIE/USA


Call for Participation

THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronics and microstructures. These questions are becoming more and more crucial with the increasing element density of deep submicron downscaling of integrated circuits necessitating thermal simulation, monitoring and cooling. The high element density of MCMs and the mobile parts of microsystems raise newer and newer thermal problems to be solved in the near future. Thermal effects on the other hand can be used as bases of sensors or other functional structures.

The first THERMINIC Workshop was held in Grenoble in 1995. About 90 participants from Europe, the USA and Japan attended 43 presentations. The second THERMINIC Workshop was held in Budapest, September 25-27, 1996. From over 60 submissions, the Programme Committee selected 34 contributions for oral presentation and 15 for poster presentation.

The Workshop is sponsored by the IEEE Computer Society, Test Technology Technical Committee in cooperation with the THERMINIC CP940922 Copernicus and the BARMINT 8173 ESPRIT Projects, with the European Test Technology Technical Committee and with SPIE, the Society of Photo-Optical Instrumentation Engineers.

Areas of interest:

  • Thermal and Temperature Sensors
  • Thermal Simulation
  • Electro-thermal Simulation
  • Thermal Modelling and Investigation of Packages
  • Evaluation of Thermal Measurements
  • Temperature Mapping
  • Thermo-mechanical Effects
  • Reliability Issues.

Invited talks:

Two invited talks will be delivered at the Workshop:

  • "Application of Computational Fluid Dynamics to Cooling of Computer Systems." by D. Agonafer, IBM, Poughkeepsie, USA,
  • "High-Resolution Thermal Imaging of Electronic Devices and Interconnects." by A. Majumdar, University of California, Dept. of Mechanical Engineering, Berkeley, USA.

Vendor and book exhibition:

The THERMINIC Workshop invites vendors offering products in the scope of the Workshop to exhibit. Editors are invited to exhibit books.

To date, more than 70 submissions are being received. The programme should be mailed end of June.

Special Issue of Journals:

Special Issues of the Microelectronics Journal and of the Journal of Sensors and Actuators have been organized as follow up to the Workshop in 1995 and Special Issues of the Microelectronics Journal and of the IEEE Transactions on VLSI Systems are organized in 1996. Special Issues of the Journal of Sensors and Actuators, of the Microelectronics Journal and of the IEEE Transactions on Components, Packaging, and Manufacturing Technology will follow the Workshop in 1997.

Support by ONR European Office:

It is expected that the Office of Naval Research European Office will provide again a support to help participants from Central and Eastern Europe.

Venue:

The Workshop will be held at the SOFITEL-Méditerranée hotel, in Cannes "Côte d'Azur". The hotel is located on the westernmost point of the bay of Cannes, bordered by beaches of fine sand and overlooking the yacht harbour and the Croisette. Rooms will be available from 355FF on a double occupancy basis. Cannes is served by the airport of Nice (40 minutes by shuttle bus) and by the airport of Cannes-Mandelieu (10 minutes). Cannes may also be reached by highway and by train.


Submit intentions to participate to:

Bernard COURTOIS
TIMA
46 Avenue Félix Viallet
38031 Grenoble cedex, France
E-mail : Bernard.Courtois@imag.fr
WWW: http://tima-cmp.imag.fr


IEEE Computer Society

Test Technology Technical Committee