THERMINIC WORKSHOP PROGRAMME
25th September 1995
- 8.30 Opening Address
- 8.40 INVITED TALK : D. Blackburn NIST, Gaithersburg, USA
ISSUES IN THE MEASUREMENT OF TEMPERATURE AND THERMAL
CHARACTERIZATION OF MICROELECTRONIC COMPONENTS
- 9.20-11.00 SESSION 1 Thermal and Temperature Sensors
Chair : C. Cahill NMRC, Cork, Ireland
- 9.20 M. Kimura, J. Manaka, K. Nagai
Tohoku-Gakuin Univ., Tagajo, Japan
Ricoh Seiki Co., Develop. Center,
Tokyo, Japan
ABSOLUTE-HUMIDITY SENSING INDEPENDENT OF THE AMBIENT TEMPERATURE
- 9.40 V. Székely, Cs. Márta, M. Rencz,
Zs. Benedek, B. Courtois
TU Budapest, Hungary
TIMA Laboratory, Grenoble, France
DESIGN FOR THERMAL TESTABILITY (DfTT) AND A CMOS REALIZATION
- 10.00 W. Wójciak, A. Napieralski
TU Lódz, Poland
AN ANALOGUE TEMPERATURE
SENSOR INTEGRATED IN THE
CMOS TECHNOLOGY
- 10.20 T. Kudoh, S. Ikebe, H. Sato,
K. Komatsu, M. Kimura
TERUMO Corp., Kanagawa, Japan
Tohoku-Gakuin Univ., Tagajo, Japan
HIGHLY SENSITIVE
THERMISTOR
BOLOMETER FOR A CLINICAL
TYMPANIC THERMOMETER
- 10.40 U.A. Dauderstädt, P.H.S. de Vries,
R. Hiratsuka, P.M. Sarro
Delft Univ. of Technology, The Netherlands
Nippon Steel Corporation, Japan
DIMES-ICP, Delft, The Netherlands
SIMULATION OF A THERMAL
ACCELEROMETER
- 11.00-11.20 Coffee
- 11.20-12.40 SESSION 2 Thermal Simulation
Chair : V. Székely TU Budapest,
Hungary
- 11.20 A. Napieralski, G. Jablonski
TU Lódz, Poland
PYRTHERM FOR WINDOWS -
USER FRIENDLY THERMAL CAD SOFTWARE
- 11.40 J.L. Blanchard, S. Louage
Zuken-Redac S.A., Les Ulis, France
AN INTERACTIVE AND
INTEGRATED THERMAL
CHARACTERIZATION OF
COMPONENT PLACEMENT
- 12.00 A.J. Przekwas, S.D. Habchi
CFD Research Corp., Huntsville, USA
MULTI-SCALE SIMULATION OF
ELECTRONICS THERMAL
PACKAGING ETP AND SYSTEM
COOLING
- 12.20 K.O. Petrosjanc, I.A. Kharitonov,
N.I. Rjabov, A.V. Panjukhin
Moscow Univ. of Electronics
and Mathematics, Russia
SOFTWARE FOR
SEMICONDUCTOR DEVICES,
MONOLITH AND HYBRID IC's
DESIGN AND SIMULATION
- 12.50 Lunch
- 14.20-16.00 SESSION 3 Packages Thermal Modelling and
Investigation
Chair : A. Napieralski TU Lódz, Poland
- 14.20 L. Tielemans, G. Gregoris, L. De Schepper
DESTIN N. V., Diepenbeek, Belgium
Alcatel Espace, Toulouse, France
Limburgs Univ. Centrum, Diepenbeek,
Belgium
THERMAL DEGRADATION OF
POWER MODULES
- 14.40 M. O'Flaherty, C. Cahill, K. Rodgers,
O. Slattery
NMRC, Cork, Ireland
VALIDATION OF NUMERICAL
MODELS OF CERAMIC PIN GRID
ARRAY PACKAGES
- 15.00 H. I. Rosten DELPHI -
Flomerics Ltd., Surrey, United Kingdom
A EUROPEAN-FUNDED
PROJECT FOR THE
DEVELOPMENT
OF LIBRARIES AND PHYSICAL
MODELS FOR AN INTEGRATED
DESIGN ENVIRONMENT
- 15.20 V.A. Koval, D.V. Fedasyuk
State Univ. "Lviv Polytechnic", The Ukraine
THERMAL SIMULATION OF THE
SEMICONDUCTOR IC's :
GENERAL
AND PRACTICAL APPROACH
- 15.40 L. Albo, A. Coello-Vera, P. Pipard
Alcatel Espace, Toulouse, France
THERMAL ANALYSIS OF MCM-V
STACKS
- 16.00-16.20 Coffee
- 16.20-18.00 SESSION 4 Thermal Simulation
Chair : V. Koval TU Lviv, The Ukraine
- 16.20 B. Lanzendörfer
SICAN GmbH, Hannover, Germany
THERMAL ANALYSIS AND
SIMULATION OF MCM-SI AND
MICROMECHANIC COMPONENTS
- 16.40 M. Furmánczyk, G. Jablónski,
A. Napieralski, J. Pacholik
TU Lódz, Poland
THE 3D TRANSIENT THERMAL
SIMULATION WITH ARBITRARY
BORDER CONDITION
- 17.00 K. Hofmann, J.M. Karam, V. Moleavin,
T. Niculiun, B. Courtois, M. Glesner
TH Darmstadt, Germany
TIMA/TIMC, Grenoble, France
Univ. Bucharest "Politechnica", Romania
MODELLING AND SIMULATION
OF THERMAL EFFECTS ON THE
SYSTEM LEVEL
- 17.20 T. Niculiu, K. Hofmann, M. Glesner
Univ. Bucharest "Politechnica", Romania
TH Darmstadt, Germany
ANALOG HDL BASED THERMAL
CIRCUIT SIMULATION FOR
MICROSYSTEMS
- 17.40 D. Agonafer, A. Free
IBM, Poughkeepsie, NY, USA
AN INTEGRATED SOLID MODEL
BASED CFD MODELING
METHODOLOGY FOR COMPUTER
PACKAGING APPLICATIONS
- 19.00 Dinner
- 20.30 PANEL SESSION
Chair : G. De Mey Univ. of Ghent, Belgium
HOW BAD IS THERMAL
EDUCATION OF
ELECTRONICS
ENGINEERS ?
Introductory talk : G. De Mey,
Univ. Ghent, Belgium
MISUNDERSTANDINGS OF HEAT
TRANSFER IN THE
ELECTRONICS
ENGINEERING COMMUNITY
Panelists : D. Blackburn,
A. Napieralski, V. Székely, C. Zardini
NIST, Gaithersburg, USA,
TU Lódz, Poland,
TU Budapest, Hungary,
IXL, Talence, France
26th September 1995
- 8.30 INVITED TALK : T. Tarter AMD, Sunnyvale, USA
FACING CHALLENGES IN
MICROPROCESSOR COOLING ;
PORTABLE POWER
- 9.10-10.10 SESSION 5 Evaluation of Thermal Measurements
Chair : D. Blackburn NIST, Gaithersburg, USA
- 9.10 B Bocquet, D. Allal, Y. Leroy
IEMN, Villeneuve d'Ascq, France
THERMOMETRY OF LOSSY
COPLANAR LINES BY
MICROWAVE
CORRELATION RADIOMETRY
- 9.30 G. Oliveti, A. Piccirillo, P.E. Bagnoli
CSELT, Torino, Italy
Univ. Pisa, Italy
ANALYSIS OF LASER DIODES
THERMAL PROPERTIES WITH
SPATIAL RESOLUTION BY
MEANS OF T.R.A.I.T. METHOD
- 9.50 V. Székely
TU Budapest, Hungary
A NEW EVALUATION METHOD
OF THERMAL TRANSIENT
MEASUREMENT RESULTS
- 10.10 Introduction to the poster session
Chair : M. Rencz TU Budapest, Hungary
- 10.40-11.40 POSTER + Coffee
- S. Rael, Y. Marechal, C. Schaeffer
LEG/ENSIEG, St. Martin d'Heres, France
A 3D ELECTROTHERMAL
MODELLING
FOR PARALLELED CHIPS
- M. Mullins, R. Bayford, J. Butcher,
A. van Putten
MUMEC, London, United Kingdom
EFFECTIVE 3D THERMAL AND
ELECTRICAL SIMULATION OF
SILICON THERMAL FLOW
SENSORS WITH HSPICE
BEHAVIOURAL MODELS
- A. Csendes, Zs. Kohári
TU Budapest, Hungary
THERMAL INVESTIGATION OF
MICROSTRUCTURES BY
DIFFERENT SIMULATION AND
MEASUREMENT TOOLS
- W. Wójciak, A. Napieralski
TU Lódz, Poland
THE DISTANCE DEPENDENT
METHOD FOR TEMPERATURE
MEASUREMENT OF SINGLE
HEAT SOURCE IN
SEMICONDUCT
- OR DEVICES - THE FIRST
APPROACH
- M. Kaluza, S. Delmas, E. Sicard,
C. Garres
TU Lódz, Poland
INSA, Toulouse, France
Matra Marconi Space, Toulouse, France
DESIGN AND SIMULATION OF
CMOS-COMPATIBLE
INDUCTORS FOR THE POWER
SUPPLY OF IMPLANTED
THERMAL SENSORS
- P. Godts, L. Camberlain, C. Machut,
D. Leclercq
IEMN, Villeneuve d'Ascq, France
A NEW CONTACTLESS
TEMPERATURE MICROSENSOR
- L. Méchin, J.C. Villégier, P. Langlois,
D. Robbes, D. Bloyet
LETI-CEA, Grenoble, France
GREYC, Caen, France
THERMALLY ISOLATED YBaCuO
AIR BRIDGES ON SILICON
SUBSTRATES FOR HIGH
PERFORMANCE
BOLOMETERS
- R.G.C. Artus
Univ. of Reading, Berkshire,
United Kingdom
THE DESIGN AND THERMAL
MANAGEMENT OF A VIRTUAL
WAFER-SCALE MULTI-CHIP
MODULE SYSTEM
- B. Wiecek
TU Lódz, Poland
THERMAL MANAGEMENT IN
SURFACE MOUNTED ICs
- T. Ochi, T. Ogushi, R. Aoki
Osaka Univ., Japan
Mitsubishi Electric Corp., Hyogo, Japan
DEVELOPMENT OF A HEAT PIPE
THERMAL DIODE AND ITS HEAT
TRANSPORT PERFORMANCE
- M.J. Marongiu
MJM Consulting Services, Naperville, IL,
SOME COMPRESSIBLE FLOW
ISSUES IN THE DESIGN OF
USA MICRO CHANNEL COOLING
SYSTEMS
- M. Mermet-Guyennet, J.M. Paladel,
P. Galliard, R. Billoud, T. Fromont,
Y. Stricot
CSTI, Lyon, France
BULL, Les Clayes, France
THERMAL MANAGEMENT OF
TAB AND TBGA
COMPONENTS
IN AN AIR COOLED
SUPERCOMPUTER
- J. Bedmar, J.A. Puente, J.Pérez Oria
UPM, Madrid, Spain
Univ. Cantabria, Santander, Spain
A TECHNIQUE FOR SOLVING
THE THERMAL DISSIPATION
PROBLEM IN FAST VLSI
ELECTRONIC SYSTEMS
- 11.40-13.00 SESSION 6 Thermography
Chair : M. Glesner TH Darmstadt, Germany
- 11.40 A. Csendes, V. Székely, M. Rencz
TU Budapest, Hungary
RESOLUTION, ACCURACY
AND OTHER FEATURES OF
LIQUID CRYSTAL THERMAL
MAPPING
- 12.00 M. Ashauer, J. Ende, H. Glosch,
H. Haffner, K. Hiltmann
Inst. für Mikro- und Informationstechnik,
Villingen-Schwenningen, Germany
THERMAL CHARACTERIZATION
OF MICROSYSTEMS BY MEANS
OF HIGH-RESOLUTION
THERMOGRAPHY
- 12.20 M. Grecki, J. Pacholik, B. Wiecek,
A. Napieralski
TU Lódz, Poland
APPLICATION OF COMPUTER
-BASED THERMOGRAPHY TO
THERMAL MEASUREMENTS
OF INTEGRATED CIRCUITS
AND POWER DEVICES
- 12.40 P. Dondon, J. Lauriou, C. Zardini
IXL, Talence, France
THERMAL TRANSIENT
CHARACTERIZATION OF
ELECTRONIC ASSEMBLIES BY
INFRARED THERMOGRAPHY
IN FAST LINE SCAN MODE
- 13.00 Lunch
- 14.30-16.10 SESSION 7 Electro-thermal Simulation
Chair : M. Kimura Tohoku-Gakuin Univ., Tagajo, Japan
- 14.30 V. Székely, A. Poppe, M. Rencz,
A. Csendes, T. Kocsis TU Budapest, Hungary
SELF-CONSISTENT ELECTRO-
THERMAL SIMULATION :
FUNDAMENTALS AND
PRACTICE
- 14.50 J. Litsios, B. Schmithüsen, W. Fichtner
ETH-Zentrum, Zürich, Switzerland
THERMAL MIXED MODE
DEVICE AND CIRCUIT
SIMULATION
- 15.10 W. K. Chu, W. H. Kao
Cadence Design Systems Inc., San Jose,
CA, USA
A THREE-DIMENSIONAL
TRANSIENT ELECTRO-
THERMAL SIMULATION
SYSTEM FOR IC's
- 15.30 M. Wilklund, S. Mattisson
Lund Inst. of Technology, Sweden
SIMULATION OF THERMAL
EFFECTS IN INTEGRATED
CIRCUITS USING STANDARD
CIRCUIT SIMULATORS
- 15.50 J. Ecrabey, L. Hebrard,
J. Berger-Toussan, M. Le Helley
LEAME, Ecole Cent. de Lyon, France
A 3D MODEL FOR PACKAGES
IN ELECTROTHERMAL
SIMULATIONS
OF INTEGRATED CIRCUITS
- 16.10 End of session 7
- 16.30 Buses leave (option A)
- 16.30 Free discussion on Thermal Simulation (option B)